AU4255800A - High-temperature superconductor arrangement - Google Patents
High-temperature superconductor arrangement Download PDFInfo
- Publication number
- AU4255800A AU4255800A AU42558/00A AU4255800A AU4255800A AU 4255800 A AU4255800 A AU 4255800A AU 42558/00 A AU42558/00 A AU 42558/00A AU 4255800 A AU4255800 A AU 4255800A AU 4255800 A AU4255800 A AU 4255800A
- Authority
- AU
- Australia
- Prior art keywords
- temperature superconductor
- heat
- polymer matrix
- composite
- superconductor arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002887 superconductor Substances 0.000 title claims description 45
- 239000002131 composite material Substances 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 40
- 239000000835 fiber Substances 0.000 claims description 33
- 239000004020 conductor Substances 0.000 claims description 25
- 239000011159 matrix material Substances 0.000 claims description 21
- 229920000642 polymer Polymers 0.000 claims description 16
- 238000005338 heat storage Methods 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 241000371652 Curvularia clavata Species 0.000 claims 1
- 229910000323 aluminium silicate Inorganic materials 0.000 claims 1
- 229910003465 moissanite Inorganic materials 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 239000002826 coolant Substances 0.000 description 8
- 239000004744 fabric Substances 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 241000531908 Aramides Species 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- -1 aluminum silicates Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013657 polymer matrix composite Polymers 0.000 description 1
- 239000011160 polymer matrix composite Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/30—Devices switchable between superconducting and normal states
Landscapes
- Laminated Bodies (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
AUSTRALIA
Patents Act 1990 ABB Research Ltd.
ORIGINAL
COMPLETE SPECIFICATION STANDARD PATENT Invention Title: High-temperature superconductor arrangement The following statement is a full description of this invention including the best method of performing it known to us:- 4 4*
DESCRIPTION
TECHNICAL
FIELD
The invention relates to the field of hightemperature superconductors. It is based on a hightemperature superconductor arrangement as claimed in the preamble of claim 1.
S. PRIOR ART German Laid-Open Specification DE 196 34 424 Al discloses a high-temperature superconductor arrangement for use in a current limiter. The arrangement comprises a superconductor layer, a silver layer in the form of 20 an electrical bypass and which, together with the ~superconductor layer, forms a conductor composite, and a fiber composite layer. The latter contains a matrix .composed of epoxy resin and glass or carbon fibers as a reinforcing base material. It is used to make the conductor composite mechanically robust and is applied by vacuum impregnation onto at least one main surface of the conductor composite.
Current limiters based on high-temperature superconductors are immersed in a cooling medium, preferably liquid nitrogen
LN
2 If the superconductor changes to the resistive state in the event of a short circuit resulting from an overcurrent, energy is dissipated and, in some circumstances, the superconductor is heated very severely and requires at least a certain amount of time to cool down to the operating temperature again. The resistive heat produced in a short time in the event of a short circuit therefore has to be dissipated as efficiently as possible. In the abovementioned arrangement, heat is 2 conducted toward the cooling medium at right angles to the fiber composite layer. The efficiency of the heat transfer to the liquid nitrogen LN 2 is reduced, however, as soon as the latter starts to vaporize and bubbles or a gaseous film are or is formed on the surface to be cooled, since the specific heat of nitrogen gas is lower than the latent heat of vaporization of LN 2 This results in the conductor composite being heated undesirably until irreparable damage occurs to the high-temperature superconductor.
DESCRIPTION OF THE INVENTION ::The object of the invention is therefore to 15 provide a high-temperature superconductor arrangement in which the superconductor is protected against excessive heating if loaded by an overcurrent. This object is achieved by a high-temperature superconductor arrangement having the features of patent claim 1.
The essence of the invention is to provide a oo heat-storage layer in contact with the superconductor in a high-temperature superconductor arrangement of the ~type mentioned initially. This layer absorbs the heat produced by a short-term overcurrent in the superconductor, and then emits it to the cooling medium. In consequence, the superconductor is heated less severely and cools down again to its operating temperature correspondingly more quickly.
According to a first embodiment, the heat store is formed from a fiber composite material layer which was originally introduced into high-temperature superconductor arrangements to provide mechanical robustness.
According to a second embodiment, this layer has added to it a filling material with a high specific heat, in order to increase the heat capacity. This filling material is added to the polymer matrix and passes through the base fabric of the composite material.
3 In a further embodiment, the base material and filling material are chosen such that the coefficient of thermal conductivity of the resultant fiber composite material is as high as possible. This is achieved by heat produced locally and in a short time in the superconductor being distributed approximately uniformly in the layer which is designed as a heat store, that is to say it can be carried away from its point of origin.
In a further embodiment, the base material and filling material are optimized such that the coefficient of thermal expansion of the resultant fiber composite material is as low as possible. This allows the thermal contraction of the entire composite 15 material, and thus the stress on the superconductor, to o .be reduced as it cools down to its operating temperature.
Fiber composite materials having a structure similar to that mentioned above are already known from Patent Specification EP 0 257 466 BI. A laminate *a comprising a metal layer and a layer composed of a cured polymer matrix composite material is disclosed there, which laminate is used, for example, to cool electronic components mounted on a printed circuit o 25 board. A reinforcing, thermally conductive material having low thermal expansion is introduced into the composite material layer, in the form of particles, fibers or fabrics. This layer is used to conduct heat between the heat source(the electronic components) and the heat sink (metal layer) and to compensate for the coefficients of thermal expansion of the printed circuit board and metal layer. In contrast to this, in the present invention, such a fiber composite material is itself used as a heat store and does not just act as a heat conductor and/or electrical insulator.
4 BRIEF DESCRIPTION OF THE FIGURES The invention will be explained in more detail in the following text with reference to exemplary embodiments and in conjunction with the drawings.
Figure la shows a section through a hightemperature superconductor arrangement according to the prior art, and Figure lb shows a similar arrangement according to the invention.
Figure 2 shows a perspective illustration of a fiber composite material according to a preferred embodiment of the invention.
The reference symbols used in the drawings are summarized in the list of reference symbols. In 15 principle, identical parts have the same reference symbols.
APPROACHES TO IMPLEMENTATION OF THE INVENTION Figure la shows a detail of a cross section through a superconductor arrangement according to the prior art as is used, for example, in current limiters.
A high-temperature superconductor 10 is connected via its surface to an electrical bypass layer 11, and forms a conductor composite 1 with this bypass layer 11. A layer composed of a fiber composite material 2 is then applied to a main surface of the conductor composite 1 to make the conductor composite 1 mechanically robust.
The entire arrangement is once again immersed in liquid nitrogen
LN
2 30, or is surrounded by another cooling medium 3.
Owing to the alignment of the fibers in the base fabric, the thermal conductivity of fiber composite materials 2 is often more pronounced in the plane of the fabric. However, in an arrangement such as that shown in Figure la, the resistive heat produced in the superconductor 10 is dissipated at right angles to the fiber composite 2. Furthermore, bubbles of gaseous nitrogen 31 are formed at the junction between the fiber composite material 2 and the liquid nitrogen
LN
2 30 adjacent to it, owing to the low latent heat of vaporization of said liquid nitrogen, once again preventing the heat from being passed on and resulting in the conductor composite 1 being heated virtually adiabatically.
Figure Ib shows a superconductor arrangement according to the invention having a conductor composite 1 and a layer 4 which is in the form of a heat store and is in contact via its surface with a main surface of the conductor composite 1 and the cooling medium 3.
In this exemplary embodiment, the heat-storage layer 4 is arranged on the bypass side of the conductor **composite 1. The problem mentioned above is overcome in that at least some of the heat dissipated during shortterm overloading of the conductor composite 1 is temporarily absorbed by the heat store 4. The energy which is not carried away to the cooling medium 3 while the conductor composite 1 is being overloaded and is 20 temporarily stored (buffered) in the heat store 4 is emitted to the coolant 3 after the short circuit ends, that is to say after a few alternating-current cycles.
S
The superconductor is thus heated less severely when the same amount of heat is produced, and cools down again to the operating temperature correspondingly more quickly.
The conductor composite 1 may, of course, also have additional layers, or further conductor composites can be provided, separated from the first conductor composite 1 by electrically insulating layers.
Additional heat-storage layers 4' are also, of course, possible, for example on the side of the conductor composite 1 opposite a first heat sink 4.
The heat-storage layer 4 is formed from a fiber composite material. Such fiber composite materials are composed of a cured polymer matrix and a fiber mesh for mechanical reinforcement. Nowadays, glass, carbon or aramide fibers in the form of unidirectionally laid or woven fibers are normally used as the reinforcing 6 component. The matrix systems are preferably threedimensionally crosslinking thermosetting plastics and are based, for example, on epoxy, silicon or polyester resins. So-called prepregs are fiber materials (two- or three-dimensional base materials) which are preimpregnated with such resin formulations, are possibly pre-cured, deform easily, and can then be cured completely under pressure and temperature.
Figure 2 shows a section through such a fiber composite material 2. A base fabric 20 is surrounded by a matrix 21 into which a filler 22 is introduced, in the form of small particles. This fiber composite material 2 can itself be used as a heat store, for example in the form of a laminate, if the base 20 and the filler 22 are chosen appropriately.
For this purpose, the filling material 22 must have a high heat capacity (specific heat), and must preferably also have a high thermal conductivity.
"High" in this context means that the heat capacity and 20 the thermal conductivity of the resulting composite 4 must be greater than its characteristics without the addition of the filling material 22. It must also be *possible to distribute the filling material 22 well in the polymer matrix 21. Its particle diameter is 25 preferably not too large, so that the matrix filling material mixture infiltrates and wets the base material well, and no pores are produced. The proportion by volume is preferably relatively high, in order that the heat capacity of the composite can be increased efficiently. The total content of base and filling material is preferably greater than 0.5. By utilizing the percolation effect, the thermal conductivity can be increased further beyond a certain particle concentration. Depending on the desired characteristics of the composite, both the base and filling material can be mixed from different fiber types and powder materials.
Fibers composed of glass or carbon can be used as the base material for mechanically reinforcing the 7 composite material 2, and thus to make the conductor composite 1 mechanically robust. Such fibers are possibly aligned in only one direction and form a fabric 20, or even a three-dimensional mesh. The proportion of the base material in the composite is between 0.1 and 0.5 by volume. Fibers composed of aluminum oxide (A1 2 0 3 or silicon carbide (SiC) are preferably chosen in order to assist the desired thermal characteristics of the composite.
The fiber composite material is bonded to the conductor composite at room temperature, and is then cured before being cooled down to the operating temperature of the superconductor. The compression stresses on the superconductor ceramic which result from the different contractions during this process are reduced if the coefficient of thermal expansion of the fiber composite material is as low as possible. This is achieved by skillful selection of the base material and filling material, which for this purpose should have a low coefficient of thermal expansion.
The fiber composite material is used mainly in the form of thin boards. These are prepared as socalled prepreg boards by the desired filling material being added to the polymer matrix, and the base fabric thus being impregnated. Prepreg boards are preferably precured, but can still easily be formed and, depending on the nature of the polymer matrix, are cured in their final form under pressure and/or heat. In the process, an excellent adhesive bond is formed between the fiber composite material and the material adjacent to it, that is to say the conductor composite in the present case.
Suitable fillers include, for example, aluminum oxide A1 2 0 3 with a specific heat c of 3.35 J/Kcm 3 at room temperature. Addition of this powder increases the specific heat of the composite to 1.3 J/Kcm 3 Other possible powder filling materials are silicon carbide SiC (c 3.35 J/Kcm 3 or aluminum silicates with a high proportion of A1 2 0 3 (c 3 J/Kcm3) If it is intended to -8improve the thermal conductivity at the same time, it is also possible to use carbon C or aluminum nitride AlN, with a coefficient of thermal conductivity of 180 W/Km at room temperature. The thermal conductivity of the composite is increased from 0.25 W/Km to more than 1 W/Km by adding sufficient
AIN.
In general, a current limiter comprises a superconductor arrangement of the type described here in the form of a plurality of webs or sections of finite width which are displaced parallel to one another. A filler in the form of powder and having a dielectric constant which is higher than that of the matrix material is embedded in the polymer matrix in 15 order to smooth out or weaken the electrical field between two superconductor sections, or between a superconductor and a grounded shield. Carbon black is particularly suitable for this purpose, for example, and can be used to provide the composite with semiconductor characteristics.
20 Use of a suitable filling material thus results in a fiber composite material which is distinguished by its mechanical strength and increased heat capacity. It ~is thus suitable for use at low temperatures, in particular to provide thermal stability for high- 25 temperature superconductors.
9- LIST OF REFERENCE SYMBOLS 1 11 2 21 22 3 31 4 Conductor composite Superconductor Bypass Fiber composite material Base fabric Polymer matrix Filling material Cooling medium Liquid nitrogen
LN
2 Gaseous nitrogen Heat store
Claims (10)
1. A high-temperature superconductor arrangement having a conductor composite comprising a super- conductor layer and an electrical bypass layer wherein a heat-storage layer is in contact with a main surface of the conductor composite
2. The high-temperature superconductor arrangement as claimed in claim i, wherein the heat-storage layer is formed from a fiber composite material having a polymer matrix and a mechanically reinforcing base material
3. The high-temperature superconductor arrangement as claimed in claim 2, wherein the polymer matrix has added to it a filling material with a heat :i capacity which is higher than the heat capacity of the S.polymer matrix
4. The high-temperature superconductor arrangement as claimed in claim 3, wherein the base material *oo 20 and the filling material have a coefficient of o thermal conductivity which is higher than the coefficient of thermal conductivity of the polymer matrix
5. The high-temperature superconductor arrangement as claimed in claim 3, wherein the base material and the filling material have a coefficient of thermal expansion which is less than the coefficient of thermal expansion of the polymer matrix
6. The high-temperature superconductor arrangement as claimed in claim 3, wherein the polymer matrix has added to it a filling material having a dielectric constant which is higher than the dielectric constant of the polymer matrix
7. The high-temperature superconductor arrangement as claimed in one of claims 3 to 6, wherein the proportion of the base material in the composite is between 0.1 and 0.5 by volume.
8. The high-temperature superconductor arrangement as claimed in claim 7, wherein the proportion of base 11 material and filling material in the composite is at least 0.5 by volume.
9. The high-temperature superconductor arrangement as claimed in one of claims 3 to 6, wherein the filling material comprises ceramic particles having a specific heat of at least 3 J/Kcm 3 The high-temperature superconductor arrangement as claimed in claim 9, wherein the filling material comprises a powder composed of aluminum oxide A1 2 0 3 aluminum nitride AIN, silicon carbide SiC or carbon C or aluminosilicates having a high proportion of A1 2 0 3
11. Use of a fiber composite material with a polymer matrix, a mechanically reinforcing base material and a filling material, which is added to the 15 polymer matrix in order to increase the specific heat of the composite material, as a heat-storage laminate. DATED THIS 20 DAY OF JUNE 2000 S* ABB RESEARCH LTD. Patent Attorneys for the S« Applicant:- *F.B.RICE CO *5 e Vf i_
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19929277A DE19929277A1 (en) | 1999-06-25 | 1999-06-25 | High temperature superconductor arrangement |
| DE19929277 | 1999-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU4255800A true AU4255800A (en) | 2001-01-04 |
Family
ID=7912612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU42558/00A Abandoned AU4255800A (en) | 1999-06-25 | 2000-06-20 | High-temperature superconductor arrangement |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1063712A2 (en) |
| CN (1) | CN1287053A (en) |
| AU (1) | AU4255800A (en) |
| CA (1) | CA2311430A1 (en) |
| DE (1) | DE19929277A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10226390B4 (en) * | 2002-06-13 | 2004-07-22 | Siemens Ag | Resistive current limiter device with superconducting conductor track and non-superconducting shunt |
| DE60217840T2 (en) * | 2002-06-17 | 2007-11-15 | Abb Research Ltd. | Superconducting fault current limiter |
| DE10230083B3 (en) * | 2002-06-27 | 2004-02-05 | Siemens Ag | Current limiting device with improved heat dissipation |
| EP1898475B1 (en) | 2006-09-05 | 2014-01-08 | Nexans | Resistive high temperature superconductor fault current limiter |
| EP2487731A1 (en) * | 2011-02-10 | 2012-08-15 | Nexans | Composite with coated conductor |
| CN104080309A (en) * | 2013-03-25 | 2014-10-01 | 曾凯熙 | Composite material fiber fabric having heat dissipation effect and fabrication method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4434819C5 (en) * | 1994-09-29 | 2004-05-27 | Abb Research Ltd. | Current limiting device |
| DE19520205A1 (en) * | 1995-06-01 | 1996-12-05 | Siemens Ag | Resistive current limiting device using high-T¶c¶Supraleitermaterial |
| DE19634424C2 (en) * | 1996-08-26 | 1998-07-02 | Abb Research Ltd | Method of manufacturing a current limiter with a high temperature superconductor |
| DE19746976C2 (en) * | 1997-10-24 | 2000-11-30 | Abb Research Ltd | High temperature superconductor arrangement |
| DE19856425A1 (en) * | 1997-12-08 | 1999-07-01 | Cryoelectra Ges Fuer Kryoelekt | High temperature superconductor for use in superconducting fault current limiter |
-
1999
- 1999-06-25 DE DE19929277A patent/DE19929277A1/en not_active Withdrawn
-
2000
- 2000-05-29 EP EP00810470A patent/EP1063712A2/en not_active Withdrawn
- 2000-06-13 CA CA002311430A patent/CA2311430A1/en not_active Abandoned
- 2000-06-20 AU AU42558/00A patent/AU4255800A/en not_active Abandoned
- 2000-06-26 CN CN00118763.5A patent/CN1287053A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA2311430A1 (en) | 2000-12-25 |
| EP1063712A2 (en) | 2000-12-27 |
| DE19929277A1 (en) | 2000-12-28 |
| CN1287053A (en) | 2001-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK1 | Application lapsed section 142(2)(a) - no request for examination in relevant period |