AU4138497A - Method and device for forming a lead frame - Google Patents

Method and device for forming a lead frame

Info

Publication number
AU4138497A
AU4138497A AU41384/97A AU4138497A AU4138497A AU 4138497 A AU4138497 A AU 4138497A AU 41384/97 A AU41384/97 A AU 41384/97A AU 4138497 A AU4138497 A AU 4138497A AU 4138497 A AU4138497 A AU 4138497A
Authority
AU
Australia
Prior art keywords
forming
lead frame
lead
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU41384/97A
Inventor
Adrianus Wilhelmus Van Dalen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fico BV
Original Assignee
Fico BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico BV filed Critical Fico BV
Publication of AU4138497A publication Critical patent/AU4138497A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
AU41384/97A 1996-08-29 1997-08-29 Method and device for forming a lead frame Abandoned AU4138497A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1003916 1996-08-29
NL1003916A NL1003916C2 (en) 1996-08-29 1996-08-29 Method and device for bending a connecting frame.
PCT/NL1997/000496 WO1998009322A1 (en) 1996-08-29 1997-08-29 Method and device for forming a lead frame

Publications (1)

Publication Number Publication Date
AU4138497A true AU4138497A (en) 1998-03-19

Family

ID=19763435

Family Applications (1)

Application Number Title Priority Date Filing Date
AU41384/97A Abandoned AU4138497A (en) 1996-08-29 1997-08-29 Method and device for forming a lead frame

Country Status (3)

Country Link
AU (1) AU4138497A (en)
NL (1) NL1003916C2 (en)
WO (1) WO1998009322A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102013401A (en) * 2009-02-27 2011-04-13 伟仕高(肇庆)半导体有限公司 Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof
CN103579040A (en) * 2013-10-30 2014-02-12 山东泰吉星电子科技有限公司 No-damage chip molding and packaging process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2532427B2 (en) * 1987-01-14 1996-09-11 関西日本電気株式会社 Lead bending method and apparatus for electronic parts
JPH04186870A (en) * 1990-11-21 1992-07-03 Nec Kyushu Ltd Manufacturing equipment of semiconductor device
JP2674419B2 (en) * 1992-04-27 1997-11-12 日本電気株式会社 Lead forming method and apparatus for semiconductor device
JPH0669393A (en) * 1992-08-18 1994-03-11 Toshiba Corp Method for bending lead
JP3216933B2 (en) * 1993-03-01 2001-10-09 アピックヤマダ株式会社 External lead bending equipment
JP3347886B2 (en) * 1994-08-05 2002-11-20 アピックヤマダ株式会社 External lead bending equipment

Also Published As

Publication number Publication date
NL1003916C2 (en) 1998-03-04
WO1998009322A1 (en) 1998-03-05

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