AU3571801A - Method for controlling uniformity of treatment of a surface with a particle beamand equipment therefor - Google Patents

Method for controlling uniformity of treatment of a surface with a particle beamand equipment therefor

Info

Publication number
AU3571801A
AU3571801A AU35718/01A AU3571801A AU3571801A AU 3571801 A AU3571801 A AU 3571801A AU 35718/01 A AU35718/01 A AU 35718/01A AU 3571801 A AU3571801 A AU 3571801A AU 3571801 A AU3571801 A AU 3571801A
Authority
AU
Australia
Prior art keywords
beamand
particle
treatment
equipment therefor
controlling uniformity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU35718/01A
Inventor
Gilles Borsoni
Vincent Le Roux
Laurence Vallier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X Ion SA
Original Assignee
X Ion SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X Ion SA filed Critical X Ion SA
Publication of AU3571801A publication Critical patent/AU3571801A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2445—Photon detectors for X-rays, light, e.g. photomultipliers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/248—Components associated with the control of the tube
    • H01J2237/2482—Optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
AU35718/01A 2000-03-01 2001-02-20 Method for controlling uniformity of treatment of a surface with a particle beamand equipment therefor Abandoned AU3571801A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0002617A FR2805925B1 (en) 2000-03-01 2000-03-01 METHOD FOR CONTROLLING THE UNIFORMITY OF TREATING A SURFACE WITH A PARTICLE BEAM AND IMPLEMENTING EQUIPMENT
FR0002617 2000-03-01
PCT/FR2001/000486 WO2001065596A2 (en) 2000-03-01 2001-02-20 Method for controlling uniformity of treatment of a surface of material for microelectronics with an electrically charged particle beam and equipment therefor

Publications (1)

Publication Number Publication Date
AU3571801A true AU3571801A (en) 2001-09-12

Family

ID=8847585

Family Applications (1)

Application Number Title Priority Date Filing Date
AU35718/01A Abandoned AU3571801A (en) 2000-03-01 2001-02-20 Method for controlling uniformity of treatment of a surface with a particle beamand equipment therefor

Country Status (3)

Country Link
AU (1) AU3571801A (en)
FR (1) FR2805925B1 (en)
WO (1) WO2001065596A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2849266A1 (en) * 2002-12-18 2004-06-25 Gilles Borsoni Ion beam nanometric/sub nanometric sample surface modifier having multistage ions with very low cinematic energy having ion beam/electrostatic decelerator and surface sweep sampler
CN106405619A (en) * 2015-11-19 2017-02-15 南京瑞派宁信息科技有限公司 Detector collimation method and device
CN108123841B (en) * 2017-12-22 2020-12-08 成都飞鱼星科技股份有限公司 Extensible control router and router performance expansion method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193038A (en) * 1987-02-06 1988-08-10 Idemitsu Petrochem Co Ltd Method and apparatus for analyzing solid element
JPH01179153A (en) * 1988-01-08 1989-07-17 Seiko Instr & Electron Ltd Focus ion beam working device
JP2760802B2 (en) * 1988-06-01 1998-06-04 株式会社日立製作所 Focused ion beam processing equipment
JPH02205682A (en) * 1989-02-02 1990-08-15 Mitsubishi Electric Corp Charged particle beam type processing device
JPH0354824A (en) * 1989-07-24 1991-03-08 Nec Corp Semiconductor processing and semiconductor processing device
US5263776A (en) * 1992-09-25 1993-11-23 International Business Machines Corporation Multi-wavelength optical thermometry
DE4421517A1 (en) * 1993-06-28 1995-01-05 Schlumberger Technologies Inc Method for removing or depositing material by means of a particle beam and device for carrying out the method
DE19635072C2 (en) * 1996-08-30 1998-10-22 Telefunken Microelectron Method for measuring and evaluating the roughness of a semiconductor surface and its use

Also Published As

Publication number Publication date
FR2805925B1 (en) 2004-10-22
WO2001065596A2 (en) 2001-09-07
WO2001065596A3 (en) 2002-04-18
FR2805925A1 (en) 2001-09-07

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase