AU3548399A - Sealed liquid-filled module and method of forming same - Google Patents

Sealed liquid-filled module and method of forming same

Info

Publication number
AU3548399A
AU3548399A AU35483/99A AU3548399A AU3548399A AU 3548399 A AU3548399 A AU 3548399A AU 35483/99 A AU35483/99 A AU 35483/99A AU 3548399 A AU3548399 A AU 3548399A AU 3548399 A AU3548399 A AU 3548399A
Authority
AU
Australia
Prior art keywords
sealed liquid
forming same
filled module
filled
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU35483/99A
Inventor
Howard L. Davidson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of AU3548399A publication Critical patent/AU3548399A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Casings For Electric Apparatus (AREA)
AU35483/99A 1999-04-01 1999-04-01 Sealed liquid-filled module and method of forming same Abandoned AU3548399A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/007275 WO2000060914A1 (en) 1999-04-01 1999-04-01 Sealed liquid-filled module and method of forming same

Publications (1)

Publication Number Publication Date
AU3548399A true AU3548399A (en) 2000-10-23

Family

ID=22272491

Family Applications (1)

Application Number Title Priority Date Filing Date
AU35483/99A Abandoned AU3548399A (en) 1999-04-01 1999-04-01 Sealed liquid-filled module and method of forming same

Country Status (2)

Country Link
AU (1) AU3548399A (en)
WO (1) WO2000060914A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0706196D0 (en) * 2007-03-29 2007-05-09 E2V Tech Uk Ltd Sealed and cooled enclosure with coltage isolation
CN102821586B (en) * 2012-09-01 2015-12-09 温州市三立电子科技有限公司 Liquid-cooled motor controller
JP5946815B2 (en) * 2013-11-26 2016-07-06 ファナック株式会社 Motor drive device having printed circuit board on which insulating parts are mounted

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739043A (en) * 1993-07-23 1995-02-07 Sumitomo Wiring Syst Ltd Packing structure of electric connection box and formation method of packing material
DE4340108C3 (en) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Shielding element and method for its production
US5847317A (en) * 1997-04-30 1998-12-08 Ericsson Inc. Plated rubber gasket for RF shielding

Also Published As

Publication number Publication date
WO2000060914A1 (en) 2000-10-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase