AU3084600A - Luminescent diode device - Google Patents

Luminescent diode device

Info

Publication number
AU3084600A
AU3084600A AU30846/00A AU3084600A AU3084600A AU 3084600 A AU3084600 A AU 3084600A AU 30846/00 A AU30846/00 A AU 30846/00A AU 3084600 A AU3084600 A AU 3084600A AU 3084600 A AU3084600 A AU 3084600A
Authority
AU
Australia
Prior art keywords
diode device
luminescent diode
luminescent
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU30846/00A
Inventor
Vladimir Semenovich Abramov
Sergei Dmitrievich Denisov
Petr Alexeevich Micheev
Alexandr Eduardovich Puysha
Nikolai Valentinovich Scherbakov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OBSCHESTVO S OGRANICHENNOI OTVETSTVENNOSTIJU "KORVETLIGHTS"
Original Assignee
OBSCHESTVO S OGRANICHENNOI OTVETSTVENNOSTIJU "KORVETLIGHTS"
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OBSCHESTVO S OGRANICHENNOI OTVETSTVENNOSTIJU "KORVETLIGHTS" filed Critical OBSCHESTVO S OGRANICHENNOI OTVETSTVENNOSTIJU "KORVETLIGHTS"
Publication of AU3084600A publication Critical patent/AU3084600A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
AU30846/00A 1999-10-18 1999-10-18 Luminescent diode device Abandoned AU3084600A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1999/000387 WO2001029904A1 (en) 1999-10-18 1999-10-18 Luminescent diode device

Publications (1)

Publication Number Publication Date
AU3084600A true AU3084600A (en) 2001-04-30

Family

ID=20130405

Family Applications (1)

Application Number Title Priority Date Filing Date
AU30846/00A Abandoned AU3084600A (en) 1999-10-18 1999-10-18 Luminescent diode device

Country Status (3)

Country Link
JP (1) JP2003512727A (en)
AU (1) AU3084600A (en)
WO (1) WO2001029904A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7347603B2 (en) 2002-11-05 2008-03-25 Matsushita Electric Industrial Co., Ltd. Light-emitting diode
JP2004265977A (en) * 2003-02-28 2004-09-24 Noritsu Koki Co Ltd Light emitting diode light source unit
US6856717B2 (en) 2003-03-24 2005-02-15 Hymite A/S Package with a light emitting device
US6995402B2 (en) * 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
CN202056570U (en) * 2011-01-20 2011-11-30 木林森股份有限公司 Surface-mounted LED (light-emitting diode) with lens

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981023A (en) * 1974-09-16 1976-09-14 Northern Electric Company Limited Integral lens light emitting diode
JPS6037260U (en) * 1983-08-22 1985-03-14 舶用電球株式会社 Light emitting part of light emitting diode lamp
DE58909888C5 (en) * 1989-05-31 2017-03-02 Osram Gesellschaft mit beschränkter Haftung A method of manufacturing a surface mount opto-device and surface mount opto-device
JPH07211943A (en) * 1994-01-25 1995-08-11 Nikon Corp Light source device
RU2114492C1 (en) * 1996-03-19 1998-06-27 Владимир Семенович Абрамов Light-emitting diode
JPH10284757A (en) * 1997-04-04 1998-10-23 Toyoda Gosei Co Ltd Light-emitting diode device
RU2133068C1 (en) * 1997-07-30 1999-07-10 Абрамов Владимир Семенович Light-emitting diode unit
RU2134000C1 (en) * 1997-12-31 1999-07-27 Абрамов Владимир Семенович Light-emitting diode unit
RU2137978C1 (en) * 1998-03-26 1999-09-20 Открытое акционерное общество "ЛОМО" Lighting fixture with asymmetric distribution of light flux relative to optical axis

Also Published As

Publication number Publication date
JP2003512727A (en) 2003-04-02
WO2001029904A1 (en) 2001-04-26

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
TH Corrigenda

Free format text: IN VOL 15, NO 32, PAGE(S) 6822-6826 UNDER THE HEADING APPLICATIONS LAPSED, REFUSED OR WITHDRAWN PLEASE DELETE ALL REFERENCE TO APPLICATION NO. 30846/00, 30847/00, 30848/00, 72743/00 AND 78006/00

MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase