AU3073997A - Contact tip structures for microelectronic interconnection elements and methods of making same - Google Patents

Contact tip structures for microelectronic interconnection elements and methods of making same

Info

Publication number
AU3073997A
AU3073997A AU30739/97A AU3073997A AU3073997A AU 3073997 A AU3073997 A AU 3073997A AU 30739/97 A AU30739/97 A AU 30739/97A AU 3073997 A AU3073997 A AU 3073997A AU 3073997 A AU3073997 A AU 3073997A
Authority
AU
Australia
Prior art keywords
methods
contact tip
making same
interconnection elements
tip structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU30739/97A
Inventor
Thomas H Dozier
Benjamin N Eldridge
Igor Y. Khandros
Gaetan L Mathieu
Sheldon A. Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US1996/008107 external-priority patent/WO1996037332A1/en
Priority claimed from US08/784,862 external-priority patent/US6064213A/en
Priority claimed from US08/788,740 external-priority patent/US5994152A/en
Priority claimed from US08/802,054 external-priority patent/US6482013B2/en
Priority claimed from US08/852,152 external-priority patent/US6184053B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Priority claimed from PCT/US1997/008606 external-priority patent/WO1997043653A1/en
Publication of AU3073997A publication Critical patent/AU3073997A/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
AU30739/97A 1996-05-17 1997-05-15 Contact tip structures for microelectronic interconnection elements and methods of making same Abandoned AU3073997A (en)

Applications Claiming Priority (27)

Application Number Priority Date Filing Date Title
US518996P 1996-05-17 1996-05-17
US60005189 1996-05-17
PCT/US1996/008107 WO1996037332A1 (en) 1995-05-26 1996-05-24 Fabricating interconnects and tips using sacrificial substrates
WOUS9608107 1996-05-24
US2086996P 1996-06-27 1996-06-27
US60020869 1996-06-27
US2440596P 1996-08-22 1996-08-22
US60024405 1996-08-22
US2455596P 1996-08-26 1996-08-26
US60024555 1996-08-26
US3069796P 1996-11-13 1996-11-13
US60030697 1996-11-13
US3266696P 1996-12-13 1996-12-13
US60032666 1996-12-13
US3405396P 1996-12-31 1996-12-31
US60034053 1996-12-31
US08/784,862 US6064213A (en) 1993-11-16 1997-01-15 Wafer-level burn-in and test
US08784862 1997-01-15
US08788740 1997-01-24
US08/788,740 US5994152A (en) 1996-02-21 1997-01-24 Fabricating interconnects and tips using sacrificial substrates
US08/802,054 US6482013B2 (en) 1993-11-16 1997-02-18 Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US08802054 1997-02-18
US81946497A 1997-03-17 1997-03-17
US08819464 1997-03-17
US08852152 1997-05-06
US08/852,152 US6184053B1 (en) 1993-11-16 1997-05-06 Method of making microelectronic spring contact elements
PCT/US1997/008606 WO1997043653A1 (en) 1996-05-17 1997-05-15 Contact tip structures for microelectronic interconnection elements and methods of making same

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AU3073997A true AU3073997A (en) 1997-12-05

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AU30739/97A Abandoned AU3073997A (en) 1996-05-17 1997-05-15 Contact tip structures for microelectronic interconnection elements and methods of making same
AU31366/97A Abandoned AU3136697A (en) 1996-05-17 1997-05-15 Microelectronic spring contact elements

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Application Number Title Priority Date Filing Date
AU31366/97A Abandoned AU3136697A (en) 1996-05-17 1997-05-15 Microelectronic spring contact elements

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KR (1) KR100460471B1 (en)
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1940213A3 (en) * 2001-12-27 2009-12-16 FormFactor, Inc. Cooling assembly with direct cooling of active electronic components
JP4433265B2 (en) 2003-04-10 2010-03-17 ユー・エム・シー・ジャパン株式会社 LSI inspection method and defect inspection data analyzer
CN100343968C (en) * 2004-04-09 2007-10-17 矽统科技股份有限公司 Detecting head of tester
JP2008053428A (en) * 2006-08-24 2008-03-06 Seiko Instruments Inc Semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP3135378B2 (en) * 1992-08-10 2001-02-13 ローム株式会社 Semiconductor test equipment
JP2951166B2 (en) * 1992-09-01 1999-09-20 松下電器産業株式会社 Semiconductor test equipment, semiconductor test circuit chip and probe card
JPH07115113A (en) * 1993-08-25 1995-05-02 Nec Corp Semiconductor wafer testing device and testing method
JPH0850162A (en) * 1994-08-05 1996-02-20 Fujitsu Ltd Testing method and testing device for semiconductor device

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KR20030097591A (en) 2003-12-31
KR100460471B1 (en) 2004-12-08
AU3136697A (en) 1997-12-05
JP2001156223A (en) 2001-06-08
JP4598356B2 (en) 2010-12-15
JP2001526833A (en) 2001-12-18
JP2003218180A (en) 2003-07-31
JP2008141211A (en) 2008-06-19
JP4188546B2 (en) 2008-11-26

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