AU2841400A - Method and apparatus for producing semiconductor preforms - Google Patents

Method and apparatus for producing semiconductor preforms

Info

Publication number
AU2841400A
AU2841400A AU28414/00A AU2841400A AU2841400A AU 2841400 A AU2841400 A AU 2841400A AU 28414/00 A AU28414/00 A AU 28414/00A AU 2841400 A AU2841400 A AU 2841400A AU 2841400 A AU2841400 A AU 2841400A
Authority
AU
Australia
Prior art keywords
preforms
producing semiconductor
semiconductor
producing
semiconductor preforms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU28414/00A
Inventor
Neep Hing Chin
Koon Hong Koh
Wan Toh Low
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
COOKSON SEMICONDUCTOR PACKAGING MATERIALS
Original Assignee
COOKSON SEMICONDUCTOR PACKAGIN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by COOKSON SEMICONDUCTOR PACKAGIN filed Critical COOKSON SEMICONDUCTOR PACKAGIN
Publication of AU2841400A publication Critical patent/AU2841400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/06—Making preforms by moulding the material
    • B29B11/08—Injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/7343—Heating or cooling of the mould heating or cooling different mould parts at different temperatures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • B29C33/046—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam using gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C45/7337—Heating or cooling of the mould using gas or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/255—Blocks or tablets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU28414/00A 1999-02-10 2000-02-10 Method and apparatus for producing semiconductor preforms Abandoned AU2841400A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11943999P 1999-02-10 1999-02-10
US60119439 1999-02-10
US50156400A 2000-02-09 2000-02-09
US09501564 2000-02-09
PCT/SG2000/000021 WO2000047391A1 (en) 1999-02-10 2000-02-10 Method and apparatus for producing semiconductor preforms

Publications (1)

Publication Number Publication Date
AU2841400A true AU2841400A (en) 2000-08-29

Family

ID=26817339

Family Applications (1)

Application Number Title Priority Date Filing Date
AU28414/00A Abandoned AU2841400A (en) 1999-02-10 2000-02-10 Method and apparatus for producing semiconductor preforms

Country Status (2)

Country Link
AU (1) AU2841400A (en)
WO (1) WO2000047391A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005017995A1 (en) 2003-08-08 2005-02-24 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
NL2000930C2 (en) * 2007-10-12 2009-04-15 Fico Bv Method and device for encapsulating electronic components with liquid portioned encapsulating material.
CN111688136B (en) * 2020-06-29 2022-03-04 青岛顺联橡塑有限公司 Production method and production equipment of container rubber-plastic support beam

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4309379A (en) * 1978-12-21 1982-01-05 Hooker Chemicals & Plastics Corp. Method and apparatus for runnerless injection-compression molding thermosetting materials
JPS597008A (en) * 1982-07-03 1984-01-14 Toshiba Corp High-density tablet and method of sealing semiconductor with resin using said tablet
US4996170A (en) * 1990-07-30 1991-02-26 Motorola, Inc. Molding process for encapsulating semiconductor devices using a thixotropic compound
WO1996020075A1 (en) * 1994-12-23 1996-07-04 Amoco Corporation Improved process for making preforms useful for encapsulating semiconductors
CA2206384A1 (en) * 1996-05-29 1997-11-29 Eiki Togashi A method of injection-molding for epoxy resin moldings and an injection-moldable epoxy resin composition

Also Published As

Publication number Publication date
WO2000047391A1 (en) 2000-08-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase