AU2545095A - Method of coating a substrate with copper - Google Patents

Method of coating a substrate with copper

Info

Publication number
AU2545095A
AU2545095A AU25450/95A AU2545095A AU2545095A AU 2545095 A AU2545095 A AU 2545095A AU 25450/95 A AU25450/95 A AU 25450/95A AU 2545095 A AU2545095 A AU 2545095A AU 2545095 A AU2545095 A AU 2545095A
Authority
AU
Australia
Prior art keywords
copper
coating
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU25450/95A
Inventor
John Gavin Macdonald
Ronald Sinclair Nohr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kimberly Clark Corp
Original Assignee
Kimberly Clark Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kimberly Clark Corp filed Critical Kimberly Clark Corp
Publication of AU2545095A publication Critical patent/AU2545095A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
AU25450/95A 1994-05-11 1995-05-09 Method of coating a substrate with copper Abandoned AU2545095A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24191694A 1994-05-11 1994-05-11
US241916 1994-05-11
PCT/US1995/005754 WO1995031586A1 (en) 1994-05-11 1995-05-09 Method of coating a substrate with copper

Publications (1)

Publication Number Publication Date
AU2545095A true AU2545095A (en) 1995-12-05

Family

ID=22912696

Family Applications (1)

Application Number Title Priority Date Filing Date
AU25450/95A Abandoned AU2545095A (en) 1994-05-11 1995-05-09 Method of coating a substrate with copper

Country Status (3)

Country Link
AU (1) AU2545095A (en)
CA (1) CA2147522A1 (en)
WO (1) WO1995031586A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9717368D0 (en) * 1997-08-18 1997-10-22 Crowther Jonathan Cold plasma metallization

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0300846B1 (en) * 1987-06-30 1991-12-18 Institut Français du Pétrole Process for modifying the surface of a substrate by the formation of an alloy, use of the process, paticularly in the preparation of ferrous alloys, and catalysts and alloys obtained by the process
DE4035080A1 (en) * 1990-11-05 1992-05-07 Abb Patent Gmbh METHOD AND DEVICE FOR PRODUCING PARTIAL METAL LAYERS
DE4113525C2 (en) * 1991-04-25 1995-08-03 Heraeus Noblelight Gmbh Process for the metallization of surfaces of components and their use
US5176744A (en) * 1991-08-09 1993-01-05 Microelectronics Computer & Technology Corp. Solution for direct copper writing

Also Published As

Publication number Publication date
WO1995031586A1 (en) 1995-11-23
CA2147522A1 (en) 1995-11-12

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