AU2540597A - Fillers for improved epoxy laminates - Google Patents

Fillers for improved epoxy laminates

Info

Publication number
AU2540597A
AU2540597A AU25405/97A AU2540597A AU2540597A AU 2540597 A AU2540597 A AU 2540597A AU 25405/97 A AU25405/97 A AU 25405/97A AU 2540597 A AU2540597 A AU 2540597A AU 2540597 A AU2540597 A AU 2540597A
Authority
AU
Australia
Prior art keywords
talc particles
talc
fillers
those
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU25405/97A
Inventor
Peggy Mae Conn
Jeffrey Robert Kamla
Scott Harold Richgels
Aroon Vishwanath Tungare
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24486319&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2540597(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by AlliedSignal Inc filed Critical AlliedSignal Inc
Publication of AU2540597A publication Critical patent/AU2540597A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

Epoxy laminates incorporate up to 20 wt. % talc particles, particularly pure Montana platy talc particles having a maximum particle size of about 40 mum providing improved drilling performance, reduced dust formation, and improved Z-direction CTE, particularly when the epoxy resin has a Tg of about 150° C. or higher. The talc is selected from those which do not significantly reduce the electrical strength of the laminate relative to those which contain no talc particles. Characteristically, the talcs will have less than 5 wt. % impurities and less than 0.01 wt. % (100 wt.ppm) water extractable anions.
AU25405/97A 1996-03-22 1997-03-21 Fillers for improved epoxy laminates Abandoned AU2540597A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/620,525 US6187852B1 (en) 1996-03-22 1996-03-22 Fillers for improved epoxy laminates
US08620525 1996-03-22
PCT/US1997/004620 WO1997035457A1 (en) 1996-03-22 1997-03-21 Fillers for improved epoxy laminates

Publications (1)

Publication Number Publication Date
AU2540597A true AU2540597A (en) 1997-10-10

Family

ID=24486319

Family Applications (1)

Application Number Title Priority Date Filing Date
AU25405/97A Abandoned AU2540597A (en) 1996-03-22 1997-03-21 Fillers for improved epoxy laminates

Country Status (7)

Country Link
US (2) US6187852B1 (en)
EP (1) EP0864248B1 (en)
AT (1) ATE300858T1 (en)
AU (1) AU2540597A (en)
DE (1) DE69733803T2 (en)
TW (1) TW413659B (en)
WO (1) WO1997035457A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7507471B1 (en) * 1995-10-10 2009-03-24 Isola Usa Corp Reducing dusting of epoxy laminates
US8105690B2 (en) * 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
JP2002527538A (en) * 1998-10-13 2002-08-27 ピーピージー インダストリーズ オハイオ， インコーポレイテッド Glass fiber reinforced prepreg, laminate, electronic circuit board, and fabric assembling method
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
US20070111578A1 (en) * 2005-11-15 2007-05-17 Langon Alfred J Socket adapter mold
EP2053163A1 (en) * 2007-10-26 2009-04-29 SAPPI Netherlands Services B.V. Coating formulation for offset paper and paper coated therewith
CN101965507A (en) * 2008-01-09 2011-02-02 陶氏环球技术公司 The equipment and the method that are used for evaluation layer trigger squeeze processing characteristics
CN101368077B (en) * 2008-10-09 2011-11-30 腾辉电子（苏州）有限公司 Epoxy resin adhesive liquid
US20120055704A1 (en) * 2010-09-06 2012-03-08 Taiwan Union Technology Corporation Epoxy resin blend
SG10201601382XA (en) 2011-02-24 2016-03-30 Isola Usa Corp Ultrathin laminates
CN107531976A (en) * 2015-01-29 2018-01-02 英默里斯滑石美国有限公司 Engineering mineral as makrolon filler and the method using its polycarbafil
JP6672953B2 (en) * 2016-03-29 2020-03-25 味の素株式会社 Resin sheet
AR127339A1 (en) * 2021-10-15 2024-01-10 Nippon Steel Corp METAL TUBE FOR OIL WELL
WO2025113789A1 (en) 2023-11-29 2025-06-05 Ithaka Institute For Carbon Strategies Prepreg, prepreg body and a method to produce a prepreg

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE30843E (en) * 1971-05-10 1982-01-05 Epoxy tape
USRE34164E (en) * 1974-03-30 1993-01-19 Aluminum Company Of America Synthetic hydrotalcite
US4214026A (en) * 1978-08-24 1980-07-22 Asahi Kasei Kogyo Kabushiki Kaisha Sheet molding material
JPS55142645A (en) * 1979-04-24 1980-11-07 Shin Kobe Electric Machinery Laminated board
JPS57199643A (en) 1981-06-01 1982-12-07 Nikkan Ind Laminated board
JPS597044A (en) 1982-07-05 1984-01-14 ニツカン工業株式会社 Laminated board
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
JPS60203642A (en) * 1984-03-28 1985-10-15 Shin Kobe Electric Mach Co Ltd Manufacture of composite laminate board
US4719250A (en) * 1984-06-18 1988-01-12 Hoechst Celanese Corporation Encapsulation of electronic components
JPH0197633A (en) 1987-10-09 1989-04-17 Sumitomo Bakelite Co Ltd Manufacture of laminated plate for printed circuit
JPH01222950A (en) 1988-03-03 1989-09-06 Hitachi Chem Co Ltd Laminated plate
JPH02120330A (en) 1988-10-28 1990-05-08 Shin Kobe Electric Mach Co Ltd Manufacturing method of laminates
JPH02133440A (en) 1988-11-15 1990-05-22 Matsushita Electric Works Ltd Production of electrical laminate
US4960634A (en) 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
US5264065A (en) 1990-06-08 1993-11-23 Amp-Akzo Corporation Printed circuits and base materials having low Z-axis thermal expansion
JPH0592438A (en) * 1991-10-02 1993-04-16 Matsushita Electric Works Ltd Production of laminated sheet
JPH05138808A (en) * 1991-11-16 1993-06-08 Toshiba Chem Corp Copper clad laminated sheet
US5362457A (en) * 1992-08-13 1994-11-08 Aluminum Company Of America Direct synthesis of anion substituted hydrotalcite
JPH0724955A (en) * 1993-07-07 1995-01-27 Toshiba Chem Corp Copper-clad laminate
US5776424A (en) * 1994-04-29 1998-07-07 Aluminum Company Of America Two powder synthesis of hydrotalcite and hydrotalcite-like compounds with monovalen inorganic anions

Also Published As

Publication number Publication date
TW413659B (en) 2000-12-01
EP0864248B1 (en) 2005-07-27
US6322885B2 (en) 2001-11-27
DE69733803T2 (en) 2006-06-08
DE69733803D1 (en) 2005-09-01
US6187852B1 (en) 2001-02-13
EP0864248A1 (en) 1998-09-16
WO1997035457A1 (en) 1997-09-25
ATE300858T1 (en) 2005-08-15
US20010014705A1 (en) 2001-08-16

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