JPH02120330A - Production of laminate - Google Patents

Production of laminate

Info

Publication number
JPH02120330A
JPH02120330A JP63272275A JP27227588A JPH02120330A JP H02120330 A JPH02120330 A JP H02120330A JP 63272275 A JP63272275 A JP 63272275A JP 27227588 A JP27227588 A JP 27227588A JP H02120330 A JPH02120330 A JP H02120330A
Authority
JP
Japan
Prior art keywords
resin
base material
impregnated
pressure
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63272275A
Other languages
Japanese (ja)
Other versions
JPH0564975B2 (en
Inventor
Masaru Ogata
緒方 優
Mitsutoshi Kamata
満利 鎌田
Kenichi Kariya
刈屋 憲一
Yukihiro Yamashita
幸宏 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP63272275A priority Critical patent/JPH02120330A/en
Publication of JPH02120330A publication Critical patent/JPH02120330A/en
Publication of JPH0564975B2 publication Critical patent/JPH0564975B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To improve electrical characteristics and heat resistance without causing breakage of a base material by molding a prepreg obtd. by impregnating the base material made of a glass non-woven fabric with a resin compsn. contg. a phenol resin, an epoxy resin and Al(OH)3 under heat and pressure. CONSTITUTION:A resin compsn. is obtd. by compounding a mixed resin of a phenol resin and an epoxy resin with Al(OH)3. Then, a base material made of a glass non-woven fabric is impregnated with this resin compsn. in such a way that the amount of the resin contg. Al(OH)3 is 50-70wt.% and dried to such an extent that the impregnated resin does not flow when it is molded under heat and pressure. Then, this base material is impregnated again with the resin compsn. in such a way that the total amount of the resin contg. Al(OH)3 is 87-95wt.% and dried. The obtd. prepregs of a specified number are laminated and molded under heat and pressure.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電気絶縁用途に適した、ガラス不織布を基材
とする積層板の製造法に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for producing a laminate based on a nonwoven glass fabric, suitable for electrical insulation applications.

従来の技術 近年、特に民生用電気機器等も、安全性の面よりこれに
組込んで使用する絶縁板及びプリント回路基板の難燃化
の要求が非常に高くなってきている。同時に、多岐にわ
たる性能向上の要求もあり、特に寸法精度の点より低温
打抜き加工性及び部品の高密度化を図るスルホール信軸
性(厚さ方向寸法変化小〕の向上要求等があり、且つ価
格面でも安価なものが求められている。
BACKGROUND OF THE INVENTION In recent years, there has been an extremely high demand for flame retardant insulating boards and printed circuit boards used in consumer electric appliances and the like from the standpoint of safety. At the same time, there are demands for a wide range of performance improvements, particularly from the viewpoint of dimensional accuracy, such as low-temperature punching workability and through-hole axial stability (small dimensional change in the thickness direction) to increase the density of parts. There is also a demand for inexpensive products.

従来、上記絶縁板やプリント回路基板として用いられて
いる難燃性の積層板としては、(1)紙基材難燃性フェ
ノール樹脂積層板(NEMA規格XPC−FR) (2)中心層紙−表面層ガラス職布基材コンポジットエ
ポキシ樹脂積層板(同規格CEM(3)中心層ガラス不
織布−表面層ガラス織布2N材コンポジツト工ポキシ樹
脂積層板(同規格CEN−3) (4)ガラス織布基材エポキシ樹脂積層板(同規格FR
−4) 等がある。
Conventionally, flame-retardant laminates used as the above-mentioned insulating boards and printed circuit boards include (1) paper-based flame-retardant phenolic resin laminates (NEMA standard XPC-FR), (2) center layer paper- Surface layer glass fabric base composite epoxy resin laminate (standard CEM (3)) Center layer glass non-woven fabric - surface layer glass woven fabric 2N material composite poxy resin laminate (standard CEN-3) (4) Glass woven fabric Base material epoxy resin laminate (same standard FR
-4) etc.

しかし、紙基材難燃性フェノール樹脂積層板に於いては
、厚さ方向の寸法変化が大きく又打抜加工性についても
完全常温打抜可能な域までは到達していない。
However, in the case of paper-based flame-retardant phenolic resin laminates, dimensional changes in the thickness direction are large, and the punching processability has not yet reached the level where complete room-temperature punching is possible.

又、FR−4、CEM−3、OEM−1等に於いては、
基材としてガラス織布のみあるいは表面材にガラス織布
を用いているので、打抜加工性がもう一つ不足している
(金型摩耗が大きく打抜穴の仕上がりが良くない)。さ
らに、ガラス織布を使用しているので価格が高い等の問
題がある。
Also, in FR-4, CEM-3, OEM-1, etc.
Since only glass woven fabric is used as the base material or glass woven fabric is used as the surface material, there is another deficiency in punching workability (mold wear is large and the finish of the punched holes is poor). Furthermore, since woven glass fabric is used, there are problems such as high price.

このようなことから、ガラス不織布基材を用いたプリプ
レグのみを積層成形することが考えられる。しかし、ガ
ラス不撒布基材は、ヨコ方向の強度が弱い為、高圧成形
(80kg/am”以上)すると基材切れが発生する。
For this reason, it is conceivable to laminate and mold only prepregs using glass nonwoven fabric base materials. However, since the glass-free base material has low strength in the horizontal direction, the base material breaks when molded under high pressure (80 kg/am" or more).

そこで、低圧成形がなされることになり、低圧でも成形
できるエポキシ樹脂を使用することになる。
Therefore, low-pressure molding is performed, and an epoxy resin that can be molded at low pressure is used.

発明が解決しようとする課題 しかし、ガラス不織布のみを基材として使用した前記エ
ポキシ樹脂積層板は、耐熱性、電気特性が不十分であり
、これを向上させるためには、エポキシ樹脂にフェノー
ル樹脂を混合して使用するのが適当である。ところが、
フェノール樹脂は、成形時の硬化反応の過程で縮合水を
生成し、これを外へ除くために高圧成形が必要であり、
強度の弱いガラス不織布を基材とする積層板の製造には
適さない。
Problems to be Solved by the Invention However, the epoxy resin laminate using only glass nonwoven fabric as a base material has insufficient heat resistance and electrical properties. It is appropriate to use them in combination. However,
Phenolic resin generates condensed water during the curing reaction during molding, and high-pressure molding is required to remove this water.
It is not suitable for manufacturing laminates based on weak glass nonwoven fabric.

本発明は、ガラス不織布を基材とし、エポキシ樹脂とフ
ェノール樹脂の混合樹脂を使用して、基材切れを起こす
ことなく電気特性、耐熱性の優れた積層板を提供するこ
とを目的とする。
An object of the present invention is to provide a laminate that uses glass nonwoven fabric as a base material and uses a mixed resin of epoxy resin and phenol resin to have excellent electrical properties and heat resistance without causing the base material to break.

課題を解決するための手段 上記目的を達成するために、本発明は、フェこれを、ガ
ラス不織布に、水酸化アルミニウムを含む樹脂量が50
〜75重量%となるように含浸し、含浸樹脂が加熱加圧
成形おにいて流動しなくなる状態まで乾燥する(第1工
程)。
Means for Solving the Problems In order to achieve the above objects, the present invention provides a glass nonwoven fabric with a resin containing aluminum hydroxide in an amount of 50%.
The impregnated resin is impregnated to a concentration of ~75% by weight, and dried until the impregnated resin no longer flows when heated and pressed (first step).

次いで、前記樹脂組成物を、水酸化アルミニウムを含む
総樹脂量が87〜93%重量%となるように再度含浸し
乾燥してプリプレグを得る(第2工程)。これを加熱加
圧成形するものである。
Next, the resin composition is impregnated again so that the total resin amount including aluminum hydroxide is 87 to 93% by weight and dried to obtain a prepreg (second step). This is molded under heat and pressure.

作用 本発明は、上記第1工程で、含浸樹脂が流動しなくなる
状態まで乾燥することにより、ガラス不織布の繊維同士
を結着し、加熱加圧成形における基材切れを防止する。
Function In the present invention, in the first step, the impregnated resin is dried to a state where it no longer flows, thereby binding the fibers of the glass nonwoven fabric to each other and preventing the base material from breaking during hot-press molding.

しかし、流動しなくても完全には硬化していないため、
高圧成形すると押し広げられ、基材切れを起こしてしま
う。そこで水酸化アルミニウムを存在させることにより
、前・記押し広げに対する補強をし、第2工程で含浸し
た樹脂の加熱加圧成形における流動も抑制して、基材切
れを防止するものである。
However, even if it does not flow, it is not completely hardened, so
When molded under high pressure, it is forced out and the base material breaks. Therefore, the presence of aluminum hydroxide provides reinforcement against the above-mentioned pushing and spreading, and also suppresses the flow of the resin impregnated in the second step during hot-press molding, thereby preventing the base material from breaking.

尚、第1工程での含浸樹脂量が50重重量に満たないと
基材強度が不足して基材切れを起こし、75重量%を越
えると第2工程での含浸樹脂量が少なくならざるを得ず
、積層板の電気特性、耐熱特性の低下を生じる。
In addition, if the amount of impregnated resin in the first step is less than 50% by weight, the base material strength will be insufficient and the substrate will break, and if it exceeds 75% by weight, the amount of impregnated resin in the second step will be reduced. This results in a decrease in the electrical properties and heat resistance properties of the laminate.

また、第2工程後の総樹脂量が87%未満であると第2
工程での含浸樹脂量が必然的に少なくなり、積層板の電
気特性、耐熱性等が低下する。
In addition, if the total resin amount after the second step is less than 87%, the second step
The amount of impregnated resin in the process inevitably decreases, and the electrical properties, heat resistance, etc. of the laminate deteriorate.

一方、93重量%を越えると第2工程での含浸樹脂量が
多くなり、プリプレグ同士のブロッキングを生じ、積層
成形前の組込みにおいて非常に工数がかかり生産上大き
な問題である。
On the other hand, if it exceeds 93% by weight, the amount of impregnated resin in the second step increases, causing blocking between the prepregs, which requires a large number of man-hours to assemble before lamination molding, and is a major problem in production.

水酸化アルミニウムを使用することは、上記の他に積層
板の加熱時の厚さ方向の膨脂率を小さくし、且つ難燃効
果があり従来使用している高価な臭素系難燃剤を減らせ
る効果がある。
In addition to the above, the use of aluminum hydroxide reduces the fat expansion rate in the thickness direction when the laminate is heated, and has a flame retardant effect, reducing the need for expensive brominated flame retardants that are conventionally used. effective.

実施例 本発明の詳細な説明する。Example The present invention will be described in detail.

実施例に使用する樹脂組成物の配合及び基材を第1表に
示す。
Table 1 shows the formulations and base materials of the resin compositions used in the examples.

第 表 上記実施例及び比較例1の樹脂組成物の第1工程での含
浸樹脂量(重量%)及び第2工程後の総樹脂量を第2表
に示す(水酸化アルミニウムを含む)。
Table 2 shows the amount of impregnated resin (wt%) in the first step and the total resin amount after the second step of the resin compositions of Examples and Comparative Example 1 (including aluminum hydroxide).

酸物を含浸し、加熱加圧成形において流動性がなくなる
まで乾燥する。次いで、同じ樹脂組成物を含浸乾燥して
プリプレグとする。
It is impregnated with an acid and dried until it loses its fluidity during heat and pressure molding. Next, the same resin composition is impregnated and dried to obtain a prepreg.

前記プリプレグを所定枚数重ね、両面に銅箔を載置して
、圧力100kg/C1M、温度160″Cで60分間
積層成形した。尚、比較例1は、圧力80〜100kg
/cffl、温度160°Cで30分間積層成形した。
A predetermined number of prepregs were stacked, copper foil was placed on both sides, and lamination molding was performed at a pressure of 100 kg/C1M and a temperature of 160''C for 60 minutes.In addition, in Comparative Example 1, the pressure was 80 to 100 kg.
/cffl for 30 minutes at a temperature of 160°C.

ものであった。他の積層板の特性をNBMA規格品の特
性と共に第3表に示す。
It was something. The properties of other laminates are shown in Table 3 together with the properties of NBMA standard products.

↓虚戸 それぞれの工程での樹脂の含浸は次のように行なった。↓Kyoto Impregnation with resin in each step was performed as follows.

IOQχガラス不織布に第1表の樹脂組発明の効果 上述のように本発明は、ガラス不織布に含浸した樹脂を
加熱加圧成形において流動しなくなる状態まで乾燥する
こと、水酸化アルミニウムを配合することにより、エポ
キシ樹脂にフェノール樹脂併恭を配合して高圧成形する
ガラス不礒布基材積層板の製造において、基材切れを起
こすごとなく、耐熱性、電気特性の優れた積層二反を得
ることができる。さらに、水酸化アルミニウムの存在で
厚さ方向の膨張が小さく、難燃生の優れた、打抜き加工
性のよい積層板を得らする点、その工業的価値は極めて
大である。
IOQχ Resin structure shown in Table 1 on glass non-woven fabric Effect of the invention As mentioned above, the present invention has the following advantages: by drying the resin impregnated into the glass non-woven fabric to a state where it no longer flows in hot pressure molding, and by blending aluminum hydroxide. In the production of glass-free substrate laminates, which are made by blending epoxy resin with phenolic resin and molding them under high pressure, it is possible to obtain double-layer laminates with excellent heat resistance and electrical properties without causing any breakage of the substrate. can. Furthermore, the presence of aluminum hydroxide makes it possible to obtain a laminate with small expansion in the thickness direction, excellent flame retardancy, and good punching workability, which is of extremely great industrial value.

Claims (1)

【特許請求の範囲】 フェノール樹脂とエポキシ樹脂の混合樹脂に水酸化アル
ミニウム配合した樹脂組成物を用意し、 これをガラス不織布基材に水酸化アルミニウムを含む樹
脂量が50〜75重量%となるように含浸し、含浸した
樹脂が加熱加圧成形において流動しなくなる状態まで乾
燥する工程、 次いで前記樹脂組成物を水酸化アルミニウムを含む総樹
脂量が87〜93重量%となるように再度含浸し乾燥す
る工程を経てプリプレグを作製し、 前記プリプレグを加熱加圧成形する積層板の製造法。
[Claims] A resin composition is prepared in which a mixed resin of phenol resin and epoxy resin is mixed with aluminum hydroxide, and this is applied to a glass nonwoven fabric base material so that the amount of resin containing aluminum hydroxide is 50 to 75% by weight. and drying until the impregnated resin does not flow during hot and pressure molding, then impregnating the resin composition again so that the total amount of resin including aluminum hydroxide is 87 to 93% by weight and drying. A method for manufacturing a laminate, in which a prepreg is produced through a step of: and the prepreg is heated and press-molded.
JP63272275A 1988-10-28 1988-10-28 Production of laminate Granted JPH02120330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63272275A JPH02120330A (en) 1988-10-28 1988-10-28 Production of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63272275A JPH02120330A (en) 1988-10-28 1988-10-28 Production of laminate

Publications (2)

Publication Number Publication Date
JPH02120330A true JPH02120330A (en) 1990-05-08
JPH0564975B2 JPH0564975B2 (en) 1993-09-16

Family

ID=17511581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63272275A Granted JPH02120330A (en) 1988-10-28 1988-10-28 Production of laminate

Country Status (1)

Country Link
JP (1) JPH02120330A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT395432B (en) * 1990-06-13 1992-12-28 Isovolta MAT IMPREGNATED WITH PLASTIC AND METHOD FOR THE PRODUCTION THEREOF AND THEIR USE
AT396240B (en) * 1990-06-13 1993-07-26 Isovolta PREPREG PROCESS FOR ITS PRODUCTION AND USE
GB2286363A (en) * 1994-02-10 1995-08-16 Belfield Mfg Ltd Producing limited fire hazard epoxide glass laminates
US6187852B1 (en) 1996-03-22 2001-02-13 Isola Laminate Systems Corp. Fillers for improved epoxy laminates
JP2014231566A (en) * 2013-05-29 2014-12-11 パナソニック株式会社 Prepreg, metal-clad laminate, and printed wiring board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT395432B (en) * 1990-06-13 1992-12-28 Isovolta MAT IMPREGNATED WITH PLASTIC AND METHOD FOR THE PRODUCTION THEREOF AND THEIR USE
AT396240B (en) * 1990-06-13 1993-07-26 Isovolta PREPREG PROCESS FOR ITS PRODUCTION AND USE
GB2286363A (en) * 1994-02-10 1995-08-16 Belfield Mfg Ltd Producing limited fire hazard epoxide glass laminates
GB2286363B (en) * 1994-02-10 1998-01-21 Belfield Mfg Ltd A process for producing limited fire hazard epoxide glass laminates
US6187852B1 (en) 1996-03-22 2001-02-13 Isola Laminate Systems Corp. Fillers for improved epoxy laminates
JP2014231566A (en) * 2013-05-29 2014-12-11 パナソニック株式会社 Prepreg, metal-clad laminate, and printed wiring board

Also Published As

Publication number Publication date
JPH0564975B2 (en) 1993-09-16

Similar Documents

Publication Publication Date Title
JPH02120330A (en) Production of laminate
KR20200060292A (en) Resin composition, prepreg, and laminate
JP3620426B2 (en) Prepreg, laminate and printed wiring board using flame retardant epoxy resin composition
JP3179145B2 (en) Phenolic resin composition
JPH05309789A (en) Production of composite copper clad laminated sheet
JPS6221626B2 (en)
JP2604846B2 (en) Manufacturing method of laminated board
JPH0859860A (en) Production of flame-retardant phenol resin laminate
JPH0518711B2 (en)
JPH04259543A (en) Manufacture of laminated board for printed circuit
JPH09141781A (en) Manufacture of laminated plate for printed circuit
JPS63168439A (en) Epoxy resin composition for laminated sheet
JPS5845234A (en) Manufacture of epoxy resin laminated board
JPH02258337A (en) Manufacture of laminate for printed circuit
JP3282579B2 (en) Composite metal foil clad laminate
JPH04215492A (en) Manufacture of laminated board for printed circuit
JPH03211892A (en) Manufacture of laminated board for printed circuit
JPH07162114A (en) Composite copper-clad laminated board
JP4178796B2 (en) Method for producing metal-clad laminate
JPH10235783A (en) Manufacture of composite metal foil-clad laminate
JPS6039287B2 (en) Manufacturing method of paper-based phenolic resin laminate
JPS63205229A (en) Manufacture of thermo-setting resin laminated board
JP2001335651A (en) Epoxy resin composition for impregnation of organic fiber substrate, and prepreg, laminated sheet and printed wiring board using the same
JPH03138995A (en) Manufacture of laminated board for painted circuit
JPH03139897A (en) Manufacture of laminate sheet for printed circuit