AU2464400A - Probe card - Google Patents
Probe cardInfo
- Publication number
- AU2464400A AU2464400A AU24644/00A AU2464400A AU2464400A AU 2464400 A AU2464400 A AU 2464400A AU 24644/00 A AU24644/00 A AU 24644/00A AU 2464400 A AU2464400 A AU 2464400A AU 2464400 A AU2464400 A AU 2464400A
- Authority
- AU
- Australia
- Prior art keywords
- probe card
- probe
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR9951626 | 1999-11-19 | ||
KR1019990051626A KR100278104B1 (en) | 1999-11-19 | 1999-11-19 | Probe card |
PCT/KR2000/000086 WO2001036986A1 (en) | 1999-11-19 | 2000-02-03 | Probe card |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2464400A true AU2464400A (en) | 2001-05-30 |
Family
ID=19620930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU24644/00A Withdrawn AU2464400A (en) | 1999-11-19 | 2000-02-03 | Probe card |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100278104B1 (en) |
AU (1) | AU2464400A (en) |
WO (1) | WO2001036986A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002015260A1 (en) * | 2000-08-16 | 2002-02-21 | Nanomechatronics Inc | Probe, probe card and probe manufacturing method |
KR20000064001A (en) * | 2000-08-16 | 2000-11-06 | 홍영희 | Probe and probe card |
KR100805217B1 (en) * | 2007-08-02 | 2008-02-21 | 주식회사 에이엠에스티 | Probe card |
KR101122479B1 (en) * | 2010-01-08 | 2012-02-29 | 삼성전기주식회사 | Probe card |
KR101227547B1 (en) * | 2011-07-15 | 2013-01-31 | 주식회사 세디콘 | Probe card |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3116326B2 (en) * | 1992-12-01 | 2000-12-11 | 日本電信電話株式会社 | Probe card |
US5559446A (en) * | 1993-07-19 | 1996-09-24 | Tokyo Electron Kabushiki Kaisha | Probing method and device |
KR0117115Y1 (en) * | 1993-12-17 | 1998-04-27 | 문정환 | Probe card for wafer test |
KR970006517Y1 (en) * | 1993-12-21 | 1997-06-25 | 금성일렉트론 주식회사 | Probe card of wafer test |
JPH0915262A (en) * | 1995-06-28 | 1997-01-17 | Nec Kansai Ltd | Probe card |
-
1999
- 1999-11-19 KR KR1019990051626A patent/KR100278104B1/en active IP Right Grant
-
2000
- 2000-02-03 AU AU24644/00A patent/AU2464400A/en not_active Withdrawn
- 2000-02-03 WO PCT/KR2000/000086 patent/WO2001036986A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR100278104B1 (en) | 2001-01-15 |
KR20000017761A (en) | 2000-04-06 |
WO2001036986A1 (en) | 2001-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK13 | Application withdrawn section 141(2)/reg 8.3(2) - pct appl. non-entering nat. phase, withdrawn by applicant |