AU2446401A - Multi semiconductor pressure sensor with steep passageway - Google Patents

Multi semiconductor pressure sensor with steep passageway

Info

Publication number
AU2446401A
AU2446401A AU24464/01A AU2446401A AU2446401A AU 2446401 A AU2446401 A AU 2446401A AU 24464/01 A AU24464/01 A AU 24464/01A AU 2446401 A AU2446401 A AU 2446401A AU 2446401 A AU2446401 A AU 2446401A
Authority
AU
Australia
Prior art keywords
steep
passageway
pressure sensor
semiconductor pressure
multi semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU24464/01A
Inventor
Clifford D. Fung
P. Rowe Harris
Deguang Zhu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Forxboro Company
Original Assignee
FORXBORO Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FORXBORO Co filed Critical FORXBORO Co
Publication of AU2446401A publication Critical patent/AU2446401A/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00Devices or apparatus for measuring differences of two or more fluid pressure values
    • G01L13/02Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
    • G01L13/025Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
AU24464/01A 1999-12-20 2000-12-20 Multi semiconductor pressure sensor with steep passageway Abandoned AU2446401A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US46842099A 1999-12-20 1999-12-20
US09468420 1999-12-20
PCT/US2000/034781 WO2001046665A1 (en) 1999-12-20 2000-12-20 Multivariate semiconductor pressure sensor with passageway

Publications (1)

Publication Number Publication Date
AU2446401A true AU2446401A (en) 2001-07-03

Family

ID=23859741

Family Applications (1)

Application Number Title Priority Date Filing Date
AU24464/01A Abandoned AU2446401A (en) 1999-12-20 2000-12-20 Multi semiconductor pressure sensor with steep passageway

Country Status (2)

Country Link
AU (1) AU2446401A (en)
WO (1) WO2001046665A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6790699B2 (en) 2002-07-10 2004-09-14 Robert Bosch Gmbh Method for manufacturing a semiconductor device
US10221062B2 (en) * 2016-10-03 2019-03-05 Continental Automotive Systems, Inc. Cavity with silicon on insulator MEMS pressure sensing device with an extended shallow cross-shaped cavity
CN108254031B (en) * 2017-12-28 2020-07-10 上海工程技术大学 Differential pressure type gas micro-flow sensor and manufacturing method thereof
EP3654005B1 (en) * 2018-11-15 2022-05-11 TE Connectivity Solutions GmbH Differential pressure sensor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975390A (en) * 1986-12-18 1990-12-04 Nippondenso Co. Ltd. Method of fabricating a semiconductor pressure sensor
US5969591A (en) * 1991-03-28 1999-10-19 The Foxboro Company Single-sided differential pressure sensor
US5220838A (en) * 1991-03-28 1993-06-22 The Foxboro Company Overpressure-protected, differential pressure sensor and method of making the same
US5632854A (en) * 1995-08-21 1997-05-27 Motorola, Inc. Pressure sensor method of fabrication
EP0890998A1 (en) * 1997-07-07 1999-01-13 STMicroelectronics S.r.l. Manufacturing method and integrated piezoresistive pressure sensor having a diaphragm of polycristalline semiconductor material

Also Published As

Publication number Publication date
WO2001046665A9 (en) 2002-07-25
WO2001046665A8 (en) 2001-10-11
WO2001046665A1 (en) 2001-06-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase