AU2021107547A4 - Heat transfer and heat dissipation method with high heat and high heat flux density based on high-dimensional thermoelectric power - Google Patents
Heat transfer and heat dissipation method with high heat and high heat flux density based on high-dimensional thermoelectric power Download PDFInfo
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- AU2021107547A4 AU2021107547A4 AU2021107547A AU2021107547A AU2021107547A4 AU 2021107547 A4 AU2021107547 A4 AU 2021107547A4 AU 2021107547 A AU2021107547 A AU 2021107547A AU 2021107547 A AU2021107547 A AU 2021107547A AU 2021107547 A4 AU2021107547 A4 AU 2021107547A4
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- temperature
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- heat transfer
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1917—Control of temperature characterised by the use of electric means using digital means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Abstract
The invention discloses a heat transfer and heat dissipation method with high heat and high
heat flux density based on high-dimensional thermoelectric power. A temperature data
acquisition/transmission module collects and transmits real-time temperature data on a
temperature detector in real time, and the control/temperature measurement module modifies
the integration time of the temperature detector in real time; the heat transfer channel in the
control/temperature measurement module outputs the precise temperature signals of collected
temperature data; the external power metering signal module analyzes and compares the
precise temperature signals, and the high-dimensional heat dissipation matrix realizes the large
area distribution control of 1-n groups of thermoelectric refrigeration chips by time
synchronization constraint module; as a system-level precise temperature control technology,
the present invention realizes the overall heat flux density greater than 1 0 A 6 W/cm 2, the heat
transfer distance can exceed hundreds of meters, and precise temperature control at laboratory
stage achieves -196C to 1200°C, the temperature difference between the head and the end
product is only 0.5C, and the heat dissipation structure design can be customized.
1/1
FIGURES
etectorAen - alv - - - LTI
adiatorelec
erims LTI
efrigerata
-e chip 1
filter
.Iabt~ic LTI
ceditieig charml
filter circuit selecin filter et
ceneaidit tion
-- L T I L T
prece ii heattrncfnserhanedl
cetrol sgnal
-temal ph A
metering powe mterin
.ignal chanrnel dermce ec.
fi chip n
time synchronization constraintmedule
Description
1/1
etectorAen - alv - - - LTI adiatorelec
erims LTI efrigerata -e chip 1
filter
.Iabt~ic LTI ceditieig charml filter circuit selecin filter et
ceneaidit tion -- L T I L T
prece ii heattrncfnserhanedl
cetrol sgnal
-temal ph A metering powe mterin .ignal chanrnel dermce ec.
fi chip n time synchronization constraintmedule
Heat Transfer and Heat Dissipation Method with High Heat and High Heat Flux Density
Based on High-dimensional Thermoelectric Power
The invention relates to the technical field of heat pipe heat dissipation, in particular to a heat
transfer and heat dissipation method with high heat and high heat flux density based on high
dimensional thermoelectric power.
Temperature control is widely used in electrical appliances, food freezing, cold chain logistics,
industrial production, medical treatment and daily life. In the current technology, freon and heat
pipe are commonly used. No matter what kind of heat dissipation method, the final heat
dissipation medium is air, and others are intermediate links. Natural convection cooling of air is
the most direct and simple way. The application range of self-cooling is rapidly expanded by
heat pipe. Because self-cooling cooling system of heat pipe requires no fan, without noise,
maintenance free and shows safety and reliability. Air cooling or even self-cooling of heat pipe
can replace water cooling system, saving water resources and related auxiliary equipment
investment. In addition, heat pipe heat dissipation can concentrate and even seal heating parts,
thus achieving the heat dissipation part to the outside or far away, making the equipment easier
to prevent dust, moisture and explosion, and improving the safety, reliability and application
range of the equipment;
Although this technology is commonly used, it is limited by boiling limit, carrying limit,
condensation limit, continuous flow limit, cold start limit, etc., and the heat transfer efficiency
and transmission distance of heat pipe technology are limited, and the working temperature range is low, and the structure is relatively fixed, which cannot meet the requirements of various product structures. Therefore, the present invention proposes a heat transfer and heat dissipation method with high heat and high heat flux density based on high-dimensional thermoelectric power to solve the problems existing in the prior art.
In view of the problems above, the purpose of the present invention is to provide a heat transfer
and heat dissipation method with high heat and high heat flux density based on high-dimensional
thermoelectric power.
The purpose of the present invention is achieved by following technical scheme: A heat transfer
and heat dissipation method with high heat and high heat flux based on high-dimensional
thermoelectric power comprises a high-dimensional heat dissipation matrix, a time
synchronization constraint module, thermoelectric refrigeration chips, a temperature data
acquisition/transmission module, a temperature detector, a control/temperature measurement
module, a heat transfer channel and an external power metering signal module; a temperature
data acquisition/transmission module collects and transmits real-time temperature data on a
temperature detector in real time, and the control/temperature measurement module modifies the
integration time of the temperature detector in real time; the heat transfer channel in the
control/temperature measurement module outputs the precise temperature signals of collected
temperature data; the external power metering signal module analyzes and compares the precise
temperature signals, and the high-dimensional heat dissipation matrix realizes the large-area
distribution control of 1-n groups of thermoelectric refrigeration chips by time synchronization
constraint module
Further improvement lies in: the temperature data acquisition/transmission module and the
external power metering signal module both meet the requirements of low power consumption,
working mode, conversion rate and accuracy through operational amplifiers and A/D conversion
chips.
Further improvement lies in: The A/D conversion chips correspond to n groups of thermoelectric
refrigeration chips in 4-way single-ended input and 2-way differential input modes, and can
obtain quantization precision when working in differential mode; each A/D conversion chip can
input two-way differential analog signals, and the A/D conversion chips accurately match with
through a plurality of conditioning circuits and filters in the circuit.
Further improvement lies in: the single analog signal in the external power metering signal
module is connected to the analog signal processing conversion circuit board, and then processed
separately in four bidirectional channels, and then input into two groups of A/D conversion chips
in differential mode for quantification. Each signal is processed by input reverse following, DC
offset adjustment, dynamic range adjustment, second-order low-pass filtering and reverse
following output.
Further improvement lies in: the thermoelectric refrigeration chips set a target temperature point
through an external resistance network or a digital-to-analog conversion chip; feedback and
output the current temperature and the voltage at both ends of the thermoelectric refrigeration
chips, and output a temperature locking indication signal when the target temperature reaches
±0.1c; a PID control module is built in the thermoelectric refrigeration chips, and PID
parameters are set through external capacitors and resistors; the thermoelectric refrigeration
chips are internally provided with a PWM output module, a MOS tube driving module, a 2.5V voltage reference and a crystal oscillation circuit, and is provided with a short-circuit indication signal.
The invention has the beneficial effects that through intelligent linkage with the original air
conditioning equipment, the safe ambient temperature level in the base station can be ensured
only by starting the heat exchange equipment in normal weather and the indoor circulating air
volume is improved, the thermal control requirements of the base station are optimized,
achieving good heat control effect; the core high-efficiency heat transfer technology is adopted
to transfer indoor heat to outdoor efficiently, maintaining a small temperature difference between
indoor and outdoor, and have high heat exchange efficiency; passive heat transfer system is
adopted, with large energy saving ratio; the heat transfer system has long service life, and only
indoor and outdoor fans need to be replaced regularly within the life cycle of the base station, so
the system reliability is high; small changes to the enclosure structure is achieved; no
introduction to outdoor humidity and dust is achieved so that indoor cleanliness and humidity are
met, and requires simple maintenance; the product is of low price, high performance and high
cost- performance ratio.
Fig. 1 is a circuit architecture diagram of the present invention.
In order to deepen the understanding of the present invention, the present invention will be
further described in detail with embodiment below. This embodiment is only used to explain the
present invention, and does not limit the scope of protection of the present invention.
As shown in Figure 1, a heat transfer and heat dissipation method with high heat and high heat
flux based on high-dimensional thermoelectric power comprises a high-dimensional heat
dissipation matrix, a time synchronization constraint module, thermoelectric refrigeration chips,
a temperature data acquisition/transmission module, a temperature detector, a
control/temperature measurement module, a heat transfer channel and an external power
metering signal module; a temperature data acquisition/transmission module collects and
transmits real-time temperature data on a temperature detector in real time, and the
control/temperature measurement module modifies the integration time of the temperature
detector in real time; the heat transfer channel in the control/temperature measurement module
outputs the precise temperature signals of collected temperature data; the external power
metering signal module analyzes and compares the precise temperature signals, and the high
dimensional heat dissipation matrix realizes the large-area distribution control of 1-n groups of
thermoelectric refrigeration chips by time synchronization constraint module; the output signal
amplitude of the temperature detector is 0.5V-1.2V and the average signal-to-noise ratio is 300
so the dynamic range of signal output is 1240: 1.
The temperature data acquisition/transmission module and the external power metering signal
module both meet the requirements of low power consumption, working mode, conversion rate
and accuracy through operational amplifiers and A/D conversion chips. AD8054 is selected as
the operational amplifier. When AD8054 operates at ±5V input voltage, the unit gain
bandwidth is 100 MHz, the voltage slew rate is 120 V/ s, the settling time is 100 s, the input
voltagenoiseis 16nVIHz and overload recovery time in forward and reverse direction are 150 ns and 360 ns respectively, and the input resistor of the operational amplifier is 30M and the equivalent capacitance is 0.5 pF.
The A/D conversion chip adopts THS1206. The A/D conversion chips correspond to n groups of
thermoelectric refrigeration chips in 4-way single-ended input and 2-way differential input
modes, and can obtain quantization precision when working in differential mode; each A/D
conversion chip can input two-way differential analog signals, and the A/D conversion chips
accurately match with through a plurality of conditioning circuits and filters in the circuit.
The A/D conversion chips integrate FIFO data interface and chip selection function, and directly
uses logic circuits for matching and conditioning. The A/D conversion chip integrates a high
precision conversion reference. Under the support of the structural design of the heat transfer
channel, the heat dissipation is achieved without fan, and the A/D conversion chips combine low
power consumption and precise temperature control to achieve heat transfer with high heat and
high heat flux.
The single analog signal in the external power metering signal module is connected to the analog
signal processing conversion circuit board, and then processed separately in four bidirectional
channels, and then input into two groups of A/D conversion chips in differential mode for
quantification. Each signal is processed by input reverse following, DC offset adjustment,
dynamic range adjustment, second-order low-pass filtering and reverse following output; among
them, the DC offset adjustment can realize the hardware preliminary correction with the
unevenness of the temperature data channel offset, and adjust the signal to the differential input
range of the A/D conversion chip 7, which is realized by a reverse proportional amplification and
subtraction circuit.
The thermoelectric refrigeration chip uses ADN8830, which has outstanding advantages such as
high efficiency, small package, high temperature control accuracy, and easy operation. The
thermoelectric refrigeration chips set a target temperature point through an external resistance
network or a digital-to-analog conversion chip; feedback and output the current temperature and
the voltage at both ends of the thermoelectric refrigeration chips, and output a temperature
locking indication signal when the target temperature reaches ±0.lC; a PID control module is
built in the thermoelectric refrigeration chips, and PID parameters are set through external
capacitors and resistors; the thermoelectric refrigeration chips are internally provided with a
PWM output module, a MOS tube driving module, a 2.5V voltage reference and a crystal
oscillation circuit, and is provided with a short-circuit indication signal to improve safety in
temperature control.
Since the output temperature control voltage of this thermoelectric refrigeration chips is 3.3V
and 5.OV and neither can meet the cooling voltage requirement of the detector. The PWM output
terminal of this thermoelectric refrigeration chip is connected to a MOSFET driver chip to
increase the driving voltage. The dual-channel high-speed MOSFET driver chip UCC27424
produced by TI Company is chosen, which can output a maximum current of 4 A, an input
voltage of 4 V~15 V, an input falling delay time of 25 ns, and an input rising delay time of 35 ns.
MOSFET uses FDS8958 produced by Fairchild Company. Each MOSFET integrates two N
channel and P-channel MOS transistors. Among them, the rated voltage of the N-channel chip is
V and the rated current is 7 A; the rated voltage of the P-channel chip is -30 V, and the rated
current is -5 A.
As a system-level precise temperature control technology, the present invention realizes the
overall heat flux density greater than 1 0 A6 W/cm 2 , the heat transfer distance can exceed hundreds
of meters, and precise temperature control at laboratory stage achieves -196C to 1200°C, the
temperature difference between the head and the end product is only 0.5°C, and the heat
dissipation structure design can be customized.
The heat transfer and heat dissipation method with high heat and high heat flux based on high
dimensional thermoelectric power, thanks to intelligent linkage with the original air conditioning
equipment, the safe ambient temperature level in the base station can be ensured only by starting
the heat exchange equipment in normal weather and the indoor circulating air volume is
improved, the thermal control requirements of the base station are optimized, achieving good
heat control effect; the core high-efficiency heat transfer technology is adopted to transfer indoor
heat to outdoor efficiently, maintaining a small temperature difference between indoor and
outdoor, and have high heat exchange efficiency; passive heat transfer system is adopted, with
large energy saving ratio; the heat transfer system has long service life, and only indoor and
outdoor fans need to be replaced regularly within the life cycle of the base station, so the system
reliability is high; small changes to the enclosure structure is achieved; no introduction to
outdoor humidity and dust is achieved so that indoor cleanliness and humidity are met, and
requires simple maintenance; the product is of low price, high performance and high cost
performance ratio.
The above shows and describes the basic principles, main features and advantages of the present
invention. It should be understood by those skilled in the field that the present invention is not
limited by the embodiments above. The embodiments and descriptions above only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, there will be various changes and improvements in the present invention, all of which fall within the scope of the claimed invention. The claim scope of that present invention is defined by the append claims and their equivalents.
Claims (2)
1. A heat transfer and heat dissipation method with high heat and high heat flux based on high
dimensional thermoelectric power, characterized by comprising a high-dimensional heat
dissipation matrix, a time synchronization constraint module, thermoelectric refrigeration chips,
a temperature data acquisition/transmission module, a temperature detector, a
control/temperature measurement module, a heat transfer channel and an external power
metering signal module; a temperature data acquisition/transmission module collects and
transmits real-time temperature data on a temperature detector in real time, and the
control/temperature measurement module modifies the integration time of the temperature
detector in real time; the heat transfer channel in the control/temperature measurement module
outputs the precise temperature signals of collected temperature data; the external power
metering signal module analyzes and compares the precise temperature signals, and the high
dimensional heat dissipation matrix realizes the large-area distribution control of 1-n groups of
thermoelectric refrigeration chips by time synchronization constraint module; wherein
The temperature data acquisition/transmission module and the external power metering signal
module both meet the requirements of low power consumption, working mode, conversion rate
and accuracy through operational amplifiers and A/D conversion chips. The A/D conversion
chips correspond to n groups of thermoelectric refrigeration chips in 4-way single-ended input
and 2-way differential input modes, and can obtain quantization precision when working in
differential mode; each A/D conversion chip can input two-way differential analog signals, and
the A/D conversion chips accurately match with through a plurality of conditioning circuits and
filters in the circuit; the single analog signal in the external power metering signal module is connected to the analog signal processing conversion circuit board, and then processed separately in four bidirectional channels, and then input into two groups of A/D conversion chips in differential mode for quantification. Each signal is processed by input reverse following, DC offset adjustment, dynamic range adjustment, second-order low-pass filtering and reverse following output.
2. A heat transfer and heat dissipation method with high heat and high heat flux based on high
dimensional thermoelectric power according to claim 1, characterized in that the thermoelectric
refrigeration chips set a target temperature point through an external resistance network or a
digital-to-analog conversion chip; feedback and output the current temperature and the voltage at
both ends of the thermoelectric refrigeration chips, and output a temperature locking indication
signal when the target temperature reaches ±0.1°C; a PID control module is built in the
thermoelectric refrigeration chips, and PID parameters are set through external capacitors and
resistors; the thermoelectric refrigeration chips are internally provided with a PWM output
module, a MOS tube driving module, a 2.5V voltage reference and a crystal oscillation circuit,
and is provided with a short-circuit indication signal.
FIGURES 1/1
Applications Claiming Priority (2)
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|---|---|---|---|
| CN202010300171.1A CN111488010B (en) | 2020-04-16 | 2020-04-16 | Large-heat high-heat-flow-density heat transfer and dissipation method based on high-dimensional thermoelectricity |
| CN202010300171.1 | 2020-04-16 |
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| AU2021107547A4 true AU2021107547A4 (en) | 2021-10-21 |
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| CN (1) | CN111488010B (en) |
| AU (1) | AU2021107547A4 (en) |
| WO (1) | WO2021209006A1 (en) |
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| CN111488010B (en) * | 2020-04-16 | 2021-02-26 | 深圳见炬科技有限公司 | Large-heat high-heat-flow-density heat transfer and dissipation method based on high-dimensional thermoelectricity |
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| JP3613251B2 (en) * | 2002-03-04 | 2005-01-26 | 日本電気株式会社 | Multi-stage electronic cooling unit and temperature control stage |
| CN1181420C (en) * | 2003-05-23 | 2004-12-22 | 华中科技大学 | High-precision temperature control circuit for thermoelectric cooler |
| KR100530163B1 (en) * | 2003-12-01 | 2005-11-22 | 삼성전자주식회사 | Apparatus for controlling tec |
| CN2831423Y (en) * | 2005-09-13 | 2006-10-25 | 中兴通讯股份有限公司 | Active radiator of large-scale integrated chip |
| CN101876833B (en) * | 2010-06-25 | 2012-05-23 | 电子科技大学 | Intelligent temperature control method for array light receiving/transmitting module in optical switch |
| CN102721243B (en) * | 2011-03-31 | 2015-03-11 | 中国科学院西安光学精密机械研究所 | Single chip computer-based multi-TEC (Thermoelectric Cooler) temperature-regulated control system |
| CN202177270U (en) * | 2011-07-21 | 2012-03-28 | 东北林业大学 | temperature controller for combined control of multiple semiconductor refrigerators |
| CN103148561A (en) * | 2011-12-06 | 2013-06-12 | 西安扩力机电科技有限公司 | Simple control-type indoor temperature regulation and control device |
| CN108508940B (en) * | 2018-04-02 | 2020-07-31 | 太原理工大学 | Laser temperature feedback regulation control circuit and method |
| CN208569424U (en) * | 2018-07-17 | 2019-03-01 | 太原理工大学 | The output control adjustable laser temperature control circuit of voltage |
| CN108826620B (en) * | 2018-08-06 | 2020-05-22 | 南京邮电大学 | Distributed control method of large-scale heating ventilation air-conditioning system in university campus building |
| CN111488010B (en) * | 2020-04-16 | 2021-02-26 | 深圳见炬科技有限公司 | Large-heat high-heat-flow-density heat transfer and dissipation method based on high-dimensional thermoelectricity |
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| CN111488010B (en) | 2021-02-26 |
| WO2021209006A1 (en) | 2021-10-21 |
| CN111488010A (en) | 2020-08-04 |
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