AU2021100830A4 - Method and Apparatus For Excimer Laser Micromachining Of Conical Microholes - Google Patents

Method and Apparatus For Excimer Laser Micromachining Of Conical Microholes Download PDF

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AU2021100830A4
AU2021100830A4 AU2021100830A AU2021100830A AU2021100830A4 AU 2021100830 A4 AU2021100830 A4 AU 2021100830A4 AU 2021100830 A AU2021100830 A AU 2021100830A AU 2021100830 A AU2021100830 A AU 2021100830A AU 2021100830 A4 AU2021100830 A4 AU 2021100830A4
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Australia
Prior art keywords
mask
excimer laser
micromachining
sample
stage
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AU2021100830A
Inventor
Tao Chen
Dengyu SHAN
Zhengfei WANG
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Beijing University of Technology
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Beijing University of Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00626—Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B81B1/002—Holes characterised by their shape, in either longitudinal or sectional plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/055—Microneedles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2900/00—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a method and an apparatus for excimer laser micromachining of conical microholes. The apparatus comprises an indicator laser beam (1), an excimer laser system (2), a mask switching stage (3), a mask (4), a mirror (5), a projection lens (6), a sample stage (7), a three-axis translation stage (8), a motor driver (9) and a computer (10). At present, the taper of conical microholes is small and difficult to control. Through the invention, the taper of microholes may be increased by changing the size of the mask in the micromachining process. The invention uses gas lasers such as an excimer laser to process conical microholes. Since the gas laser photon energy is greater than the chemical bond energy in the material molecules, the chemical bond of the material molecules can be directly broken to achieve cold micromachining effect, and better surface quality can be obtained. In addition, the invention has the advantages of high micromachining accuracy, high reliability, high absorption rate of the materials to light and no heat affected zone. Drawings of Descriptions 4 56 10 Z,7 \ 9 A c8 Figure 1 Projection Lens Laser Beam PMMA Figure 2

Description

Drawings of Descriptions
4 56
10 Z,7
9 A c8 \
Figure 1
Projection Lens
Laser Beam
PMMA
Figure 2
Descriptions Method and Apparatus for Excimer Laser Micromachining of Conical
Microholes Technical Field Technical Field
[0001] The present invention belongs to the technical field of laser micromachining, in particular to an excimer laser micromachining method and apparatus for conical microholes.
Background Technology
[0002] With the rapid development of modern science, advanced manufacturing technology, biomedicine and other high-tech fields, the demand for precision micro devices is increasingly urgent. However, traditional micromachining methods can no longer meet people's needs. Laser micromachining is a popular micromachining method. In the field of micromachining, laser micromachining has incomparable technical advantages over other technologies. Different from the traditional micromachining methods, laser micromachining is a multi-photon absorption process, in which the nonlinear action process is dominant, and the micromachining accuracy is high. At present, nanosecond pulsed excimer lasers are relatively mature, which have many advantages, such as short wavelength, high energy of single photon, high energy of single pulse output and stable output of laser pulse. They have become a main industrial laser in the field of laser micromachining, especially the 248nm KrF excimer laser beam has a great advantage in the manufacture of polymer materials. Excimer lasers are easy to deal with the design changes of processed objects, and can be used for micro micromachining with high accuracy.
[0003] Laser micromachining is an ideal technique for the manufacture of medical devices by selecting the appropriate wavelength and pulse width. Laser micromachining is contactless in nature, which allows it to be used in a dust-free and sterile environment required for the manufacture of medical devices. This method is used to manufacture polymer molds that can be injected multiple times in a relatively short period. The invention is used for micromachining conical microholes in polymethyl methacrylate (PMMA) by an excimer laser as a microneedle mold to reverse the mold, so as to obtain biodegradable polymer microneedles, which can be used for subcutaneous drug delivery with less invasive needles.
[0004] The conical microholes obtained by the existing laser micromachining methods have a small taper and a large bottom aperture, and the microneedle tip obtained after mold inversion can't meet the requirements of medical application. It has become an urgent problem to obtain ideal microneedles by increasing the taper of microholes and making them easy to demold after reversing the mold.
Summary of the Invention
[0005] In order to overcome the deficiencies of the prior art, the present invention provides a method and an apparatus for excimer laser micromachining of conical microholes, in which a dual mask is used to perform laser micromachining of conical microholes.
[0006] The technical scheme adopted by the present invention is:
[0007] An apparatus for excimer laser micromachining of conical microholes, wherein, the apparatus comprises an indicator laser beam (1), an excimer laser system (2), a mask switching stage (3), a mask (4), a mirror (5), a projection lens (6), a sample stage (7), a three-axis translation stage (8), a motor driver (9) and a computer (10). The computer (10) is equipped with a system control program; the sample stage (7) is placed on the three axis translation stage (8) to form the micromachining stage; the mirror (5) is arranged diagonally at an angle of 45 0, and the center of the mirror (5) coincides with the central axis of the projection lens (6); the sample is fixed on the sample stage (7) by a fixture; the computer (10) is connected with the excimer laser system (2), the motor driver (9) and the three-axis translation stage (8) respectively; the computer (10) is used to control the three-axis translation stage (8) to move the sample up and down; the light beam (1), the excimer laser system (2), the mask switching stage (3), the mirror (5) and the projection lens (6) are connected successively along the optical path transmission direction; the mask switching stage (3) has the mask (4) at the incident light; the emergent light of the mask switching stage (3) is reflected through the mirror (5) into an optical path that is vertically downward at an angle of 90 ° with the original optical path, and then through the projection lens (6) to the sample on the three-axis translation stage (8) and the sample stage (7).
[0008] The light beam (1) is a HeNe indicator laser beam, the excimer laser system (2) is a 248nm KrF excimer laser, and the mirror (5) is a high-reflectivity mirror for the wavelength of 248nm.
[0009] A method for excimer laser micromachining of conical microholes by the apparatus, wherein, it includes the following steps:
[0010] (1) Calibrate the optical path of the excimer laser micromachining apparatus so that the light beam of the excimer laser is coaxial with the UV laser light of the excimer; the laser beam emitted by the excimer laser system can pass vertically through the hole in the center of the mask and its optical path can be changed through the center of the mirror; the laser beam is deflected 90 °, and the deflected laser beam is vertically downward and reaches the sample through the projection lens;
[0011] (2) Place the mask on the incident light of the mask switching stage, adjust the mask to the center of the spot, so that the laser beam can cover the whole mask hole, and fix the mask and the mask switching stage;
[0012] (3) Place the sample on the sample stage and secure it; move the three-axis translation stage in the horizontal XY plane through the computer to change the relative position between the sample and the light spot so that the light spot irradiates at the position to be processed; move the three-axis translation stage up and down through the computer to change the relative position between the sample and the light spot so that the upper surface of the sample is just on the mask projection surface, so the resulting upper surface of the sample is in the shape of the mask hole;
[0013] (4) After micromachining by changing different parameters, observe the shape of the hole, and finally choose the appropriate micromachining parameters, namely laser energy, laser pulse frequency, pulse number, mask hole size and other process parameters;
[0014] (5) Turn on the laser and process the sample according to the selected process parameters.
[0015] The computer control program of the micromachining system includes the following functions: triggering the excimer laser and controlling the drive motor of the three-axis translation stage.
[0016] The sample in the invention is placed on the sample stage as shown in Figure2. When being defocused, the material has a lower energy density inside than that on the surface, resulting in a larger taper of the microhole.
[0017] The present invention has the following beneficial effects:
[0018] At present, the taper of conical microholes is small and difficult to control. The invention makes full use of the advantages of double mask micromachining and increases the taper of the microholes by changing the size of the mask during the micromachining.
[0019] The invention uses gas lasers such as an excimer laser to process conical microholes. Since the gas laser photon energy is greater than the chemical bond energy in the material molecules, the chemical bond of the materials can be directly broken to achieve cold micromachining, and better surface quality can be obtained. In addition, the invention has the advantages of high accuracy, high reliability, high absorption rate of the materials to light and no heat affected zone.
Description of the Drawings
[0020] Figure 1 is a schematic diagram of the apparatus for excimer laser micromachining of conical microholes in the present invention.
[0021] Figure 2 is a schematic diagram of how the sample is placed on the sample stage.
[0022] Figure 3 is a schematic diagram of two masks with different sizes and mask holes.
[0023] Figure 4 shows the results of single-mask micromachining of conical microholes.
[0024] Figure 5 shows the results of double-mask micromachining of conical microholes.
[0025] In the figure, 1-indicator laser beam , 2-excimer laser, 3-mask switching stage, 4 mask, 5-mirror , 6-projection lens, 7-sample stage, and 8-three-axis translation stage, 9 motor driver, 10-computer.
Detailed Description of the Presently Preferred Embodiments
[0026] The technical details of the method and apparatus proposed in the invention are further described below in combination with the attached drawings:
[0027] Refer to Figure 1, the apparatus for excimer laser micromachining of conical microholes comprises a computer and control software, an indicator laser beam , an excimer laser, a mask and a mask switching stage, a 248 nm-band high-reflectivity mirror, a projection lens, a sample stage, a three-axis translation stage and a motor driver.
[0028] The invention can process conical microholes with good taper on PMMA thin plate by an excimer laser.
[0029] The specific steps of micromachining conical microholes on PMMA by an excimer laser include:
[0030] (1) Calibrate the optical path structure of the excimer laser micromachining system, and judge whether the indicator laser beam and the laser beam are coaxial by the position of the light spot generated by the laser on the sensitive paper and the relative position of the indicator laser beam on the paper. At the same time, make the beam pass through the mask hole vertically and through the center of the mirror and the center axis of the projection lens.
[0031] (2) Place the mask on the incident light at the front entrance of the mask switching stage, adjust the mask to the center of the spot, so that the laser beam can cover the whole mask hole, and fix the mask and the mask switching stage
[0032] (3) Place the PMMA sheet on the sample stage and fix it, and control the relative position of the laser and the material by the program on the computer, so that the upper surface of the position to be processed is right at the projection image plane.
[0033] (4) First, fix the mask with an aperture of 2mm on the mask switching stage, turn on the laser, and make 100 pulses according to the set laser parameters;
[0034] (5) Keep the sample in the same position, use a mask with an aperture of 1mm, fix it on the mask switching stage, and make 200 pulses with the same laser parameters as above;
[0035] (5) Move the sample by the computer-controlled translation stage, and the upper surface is always located in the image plane of the projection system to ensure that the shape of the upper surface is always round. Continue to make the next hole in the same way until the micromachining of conical microhole array template is finished.
[0036] It will be apparent to those skilled in the art that the descriptions above are several preferred embodiments of the invention only, which does not limit the implementing range of the invention. Various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention.

Claims (4)

Claims
1. An apparatus for excimer laser micromachining of conical microholes, wherein, the apparatus comprises an indicator laser beam (1), an excimer laser system (2), a mask switching stage (3), a mask (4), a mirror (5), a projection lens (6), a sample stage (7), a three-axis translation stage (8), a motor driver (9) and a computer (10). The computer (10) is equipped with a system control program; the sample stage (7) is placed on the three-axis translation stage (8) to form the micromachining stage; the mirror (5) is arranged diagonally at an angle of 45 0, and the center of the mirror (5) coincides with the central axis of the projection lens (6); the sample is fixed on the sample stage (7) by a fixture; the computer (10) is connected with the excimer laser system (2), the motor driver (9) and the three-axis translation stage (8) respectively; the computer (10) is used to control the three-axis translation stage (8) to move the sample up and down; the light beam (1), the excimer laser system (2), the mask switching stage (3), the mirror (5) and the projection lens (6) are connected successively along the optical path transmission direction; the mask switching stage (3) has the mask (4) at the incident light; the light at the front entrance of the mask switching stage is reflected by the mirror (5) into an optical path that is vertically downward at an angle of 90 ° with the original optical path, and then through the projection lens (6) to the sample on the three-axis translation stage (8) and the sample stage (7).
2. An apparatus for excimer laser micromachining of conical microholes according to Claim 1, wherein, the light beam (1) is a HeNe indicator laserbeam, the excimer laser system (2) is a 248nm KrF excimer laser, and the mirror (5) is a high reflectivity mirror for the wavelength of 248nm.
3. An apparatus for excimer laser micromachining of conical microholes according to Claim 1, wherein, the computer control program of the micromachining system includes the following functions: triggering the excimer laser and controlling the drive motor of the three-axis translation stage.
4. A method for excimer laser micromachining of conical microholes by the apparatus, wherein, it includes the following steps: (1) Calibrate the optical path of the excimer laser micromachining apparatus so that the indicator laser beam of the excimer laser is coaxial with the UV laser light of the excimer; the laser beam emitted by the excimer laser system can pass vertically through the diaphragm hole in the center of the mask and its optical path can be changed through the center of the mirror ; the laser beam is deflected 90 0, and the deflected laser beam is vertically downward and reaches the sample through the projection lens. (2) Place the mask on the incident light of the mask switching stage, adjust the mask to the center of the spot, so that the laser beam can cover the whole mask hole, and fix the mask and the mask switching stage; (3) Place the sample on the sample stage and secure it; move the three-axis translation stage in the horizontal XY plane through the computer to change the relative position between the sample and the light spot so that the light spot irradiates at the position to be processed; move the three-axis translation stage up and down through the computer to change the relative position between the sample and the light spot so that the upper surface of the sample is just on the mask projection image, so the resulting upper surface of the sample is in the shape of the mask hole; (4) After micromachining by changing different parameters, observe the shape of the hole, and finally choose the appropriate micromachining parameters, namely laser energy, laser pulse frequency, pulse number, mask hole size and other process parameters;
(5) Turn on the excimer laser, and process the sample according to the selected process parameters.
AU2021100830A 2021-02-10 2021-02-10 Method and Apparatus For Excimer Laser Micromachining Of Conical Microholes Ceased AU2021100830A4 (en)

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