AU2020102051A4 - The computer (1) during in operation gets heated up because of the rotating compounds. In existing cooling unit requires external power source to operate, which increase the cost for using that device. The present invention focuses on using phase change material which absorbs the heat during in operation and after operation phase change material starts cool. During cool it attains the real state of material, which doesn’t require any external power source. It obviously reduces the cost involved in the system as well as increase the life of the computers. - Google Patents
The computer (1) during in operation gets heated up because of the rotating compounds. In existing cooling unit requires external power source to operate, which increase the cost for using that device. The present invention focuses on using phase change material which absorbs the heat during in operation and after operation phase change material starts cool. During cool it attains the real state of material, which doesn’t require any external power source. It obviously reduces the cost involved in the system as well as increase the life of the computers. Download PDFInfo
- Publication number
- AU2020102051A4 AU2020102051A4 AU2020102051A AU2020102051A AU2020102051A4 AU 2020102051 A4 AU2020102051 A4 AU 2020102051A4 AU 2020102051 A AU2020102051 A AU 2020102051A AU 2020102051 A AU2020102051 A AU 2020102051A AU 2020102051 A4 AU2020102051 A4 AU 2020102051A4
- Authority
- AU
- Australia
- Prior art keywords
- phase change
- during
- change material
- power source
- external power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
:
The computer (1) during in operation gets heated up because of the rotating compounds. In
existing cooling unit requires external power source to operate, which increase the cost for
using that device. The present invention focuses on using phase change material which
5 absorbs the heat during in operation and after operation phase change material starts cool.
During cool it attains the real state of material, which doesn't require any external power
source. It obviously reduces the cost involved in the system as well as increase the life of the
computers.
.0
.5
20
25
Description
Editorial Note 2020102051 There is only four pages of the description
Title of the invention: Computers with hybrid phase change material
Field of the invention:
The present invention relates to the field of computers and particular relates to the
computers embedded with phase change material to cool the system constantly.
Prior art to the invention: .0
1. A patent document with application number "20050280987", titled with "Phase change materials as a heat sink for computers", describes, "An electronic device includes a housing
in which electronic components are stored. A heat sink is positioned adjacent the housing, wherein the heat sink is composed of a phase change material."
.5
2. A patent document with application number "20160019937", titled with "Distributed computing with phase change material thermal management", describes, "Various
apparatus and methods using phase change materials are disclosed. In one aspect, a method of operating a computing device that has a first semiconductor chip with a first .0 phase change material and a second semiconductor chip with a second phase change
material is provided. The method includes determining if the first semiconductor chip phase
change material has available thermal capacity. If the first semiconductor chip phase change material has available thermal capacity then the first semiconductor chip is instructed to
operate in sprint mode. The first semiconductor chip is instructed to perform a first
computing task while in sprint mode."
wherein, the present invention provides the computers to cool constantly without any external source which in turn increases the efficiency of the system.
Objects of the invention:
The primary object of the present invention is to provide efficient cooling for the computers.
The secondary object of the present invention is to provide in reducing the power consumption by the cooling unit which incur the less cost. Another object of the present
inventions is that which is incorporated over any existing system of different dimensions.
Summary of the invention:
The computer (desktops, laptops and tablets) during in operation gets heated up because of
.0 the rotating compounds. The long hours of usage of the system leads to demand cooling unit. In existing cooling unit requires external power source to operate, which increase the
cost for using that device. The present invention focuses on using phase change material which absorbs the heat during in operation and after operation phase change material
starts cool. During cool it attains the real state of material. The major thing which should be .5 identified here is to cool the system, which doesn't require any external power source. It
obviously reduces the cost involved in the system as well as increase the life of the computers. The present invention provides hassle free attachment over the existing
computers which in turn increases the life. The dimensions of the cooling unit can be completely modified as per the requirement.
'.0
Brief description of diagram:
Figure 1 is the schematic representation of computers with phase change material
Detailed description:
The following specification particularly describes the invention and the manner in which it is
to be performed as cooling unit for the computers.
The computer (desktops, laptops and tablets) during in operation gets heated up because of
the rotating compounds. The long hours of usage of the system leads to demand cooling unit. In existing cooling unit requires external power source to operate, which increase the
cost for using that device. The existing systems in turn incur more cost for the purpose of .0 cooling. The present invention provides the solution of cooling without the external power
source to cool the computers.
Embodiment comprises of a computer (1) and a cooling unit (2). The computer (1) during operation emits more heat by the internal rotating components like hard disc which runs in
.5 higher speed. Efficacy of the computer (1) is depends on the thermal management system.
The present invention uses the cooling unit (2), which absorbs the heat constantly. The cooling unit (2) comprises of the heat cover with phase change material. The heat cover may
of different material preferably the aluminium foil cover is used for better heat absorption and to liberate. During operation phase change material absorbs the heat and started melting. Once the phase change material is melted to limited extend, it won't attain the
state of liquid. The state conversion is from solid to semi-solid state, based on this criterion
only the material for phase change material is chosen. It starts melt around 20 degree Celsius and stay in semi-solid state till 65 degree Celsius. So, the complete melting doesn't
occur in this case. The heat absorption occurs until it reaches the saturation state, that is
below 65 degree Celsius. Once the operation is turned off, the cooling unit (2) gets cooled in the normal atmospheric temperature and turns into the original solid state.
The cooling unit (2) can be incorporated over the existing computers too. The enhanced
efficiency is achieved by this constant cooling of the system without any external source to
cool the system. The cooling unit (2) attachment also quite simple and various size and shape can attained as per the requirement, this made the unit completely customisable. The hassle free, easy attachment, no power requirement made the cooling unit (2) to adopt by computer devices like desktops, laptops and tablets.
.0
.5
Claims (6)
1) We claim, A computers with hybrid phase change material: comprises of, A computer (1): and A cooling unit (2);
wherein, the computer (1) embedded the cooling unit (2) which cools the system without any external source to operate the cooling and in turn extends the efficiency of the .0 computer (1).
2) The computers with hybrid phase change material as claimed in claim 1, wherein, the cooling unit (2) is readily incorporated over the existing systems and customizable as per the requirement in terms of the dimensions. .5
Page 1/1 Aug 2020
Title: - Computers with hybrid phase change material 1. Dr. Balaji Devarajan 2. Dr. Priyadharshini Muthukrishnan 5 3. Dr. Arulmurugan B 4. Dr. L. Rajeshkumar 2020102051
5. Mrs. Bhuvaneswari Venkateswaran
6. Dr. Priya. A.K
10 2
1
Figure 1
15 Dr. Balaji Devarajan
Dr. Priyadharshini Muthukrishnan
20 Dr. Arulmurugan B
Dr. L. Rajesh kumar 25 Bhuvaneswari V Mrs. Bhuvaneswari Venkateswaran
Dr. Priya. A.K
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2020102051A AU2020102051A4 (en) | 2020-08-30 | 2020-08-30 | The computer (1) during in operation gets heated up because of the rotating compounds. In existing cooling unit requires external power source to operate, which increase the cost for using that device. The present invention focuses on using phase change material which absorbs the heat during in operation and after operation phase change material starts cool. During cool it attains the real state of material, which doesn’t require any external power source. It obviously reduces the cost involved in the system as well as increase the life of the computers. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2020102051A AU2020102051A4 (en) | 2020-08-30 | 2020-08-30 | The computer (1) during in operation gets heated up because of the rotating compounds. In existing cooling unit requires external power source to operate, which increase the cost for using that device. The present invention focuses on using phase change material which absorbs the heat during in operation and after operation phase change material starts cool. During cool it attains the real state of material, which doesn’t require any external power source. It obviously reduces the cost involved in the system as well as increase the life of the computers. |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2020102051A4 true AU2020102051A4 (en) | 2020-10-08 |
Family
ID=72663813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2020102051A Ceased AU2020102051A4 (en) | 2020-08-30 | 2020-08-30 | The computer (1) during in operation gets heated up because of the rotating compounds. In existing cooling unit requires external power source to operate, which increase the cost for using that device. The present invention focuses on using phase change material which absorbs the heat during in operation and after operation phase change material starts cool. During cool it attains the real state of material, which doesn’t require any external power source. It obviously reduces the cost involved in the system as well as increase the life of the computers. |
Country Status (1)
Country | Link |
---|---|
AU (1) | AU2020102051A4 (en) |
-
2020
- 2020-08-30 AU AU2020102051A patent/AU2020102051A4/en not_active Ceased
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Yang et al. | Finned heat pipe assisted low melting point metal PCM heat sink against extremely high power thermal shock | |
CN105472950B (en) | Heat dissipation device and electronic equipment | |
TW479450B (en) | Look-ahead closed-loop thermal management | |
US20090308081A1 (en) | Integrated circuit chip cooling using magnetohydrodynamics and recycled power | |
CA2468065A1 (en) | Optimised use of pcms in cooling devices | |
US10210912B2 (en) | Integrated thermoelectric cooler for three-dimensional stacked DRAM and temperature-inverted cores | |
WO2022205790A1 (en) | Heat dissipation device, battery pack, and electrical device | |
AU2020102051A4 (en) | The computer (1) during in operation gets heated up because of the rotating compounds. In existing cooling unit requires external power source to operate, which increase the cost for using that device. The present invention focuses on using phase change material which absorbs the heat during in operation and after operation phase change material starts cool. During cool it attains the real state of material, which doesn’t require any external power source. It obviously reduces the cost involved in the system as well as increase the life of the computers. | |
JP7096786B2 (en) | Heat dissipation module and its heat dissipation method | |
JPH0984302A (en) | Drive circuit-containing motor apparatus | |
JP2007183746A (en) | Electronic component cooling device and personal computer equipped with the same | |
Raghavan et al. | Designing for responsiveness with computational sprinting | |
US20130329369A1 (en) | Electronic device | |
US20080190119A1 (en) | Package for housing a semiconductor chip and method for operating a semiconductor chip at less-than-ambient temperatures | |
CN105913867B (en) | A kind of adjustment device and electronic equipment | |
JP2002270765A (en) | Semiconductor module, cooling device, and power converter | |
TW201223426A (en) | Cooling system for cooling a heat source and projector having the same | |
WO2022095397A1 (en) | Phase change liquid cooling heat dissipation device | |
CN109194036A (en) | A kind of engine cooler and its control method for wind-power electricity generation | |
JP2007212014A (en) | Latent heat storage device and engine | |
Sponagle et al. | Numerical study of temperature control in tablet computers using phase change material thermal energy storage | |
US10030896B1 (en) | Magneto-caloric cooling system | |
US9631842B1 (en) | Magneto-caloric cooling system | |
JP2007227413A (en) | Electronic device | |
TW201622314A (en) | Power heat dissipation device and heat dissipation control method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FGI | Letters patent sealed or granted (innovation patent) | ||
MK22 | Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry |