AU2017204522A1 - Electron beam layer manufacturing - Google Patents

Abstract

A process and apparatus for free form fabrication of a three-dimensional work piece comprising (a) feeding raw material in a solid state to a first predetermined location; (b) depositing the raw material onto a substrate as a molten pool deposit under a first processing 5 condition; (c) monitoring the molten pool deposit for a preselected condition; (d) comparing information about the preselected condition of the monitored molten pool deposit with a predetermined desired value for the preselected condition of the monitored molten pool deposit; (e) solidifying the molten pool deposit; (f) automatically altering the first processing condition to a different processing condition based upon information obtained from the comparing step (d); 0 and repeating steps (a) through (f) at one or more second locations for building up layer by layer a three-dimensional work piece. The apparatus is characterized by a detector that monitors a preselected condition of the deposited material and a closed loop electronic control device for controlling operation of one or more components of the apparatus in response to a detected condition by the detector.

Description

2017204522 30 Jun2017

ELECTRON BEAM LAYER MANUFACTURING RELATED APPLICATIONS

[001] The present application is a divisional application of parent application 2015275236, the contents of which are incorporated herein by reference.

FIELD OF THE INVENTION

[002] The present invention relates generally to layer manufacturing or fabrication of articles and, more specifically, to additive manufacturing or solid freeform fabrication of articles using electron beam energy and dosed loop control technology.

BACKGROUND OF THE INVENTION

[003] Free form fabrication (FFF) and additive manufacturing (AM) are names for a general class of layer manufacturing (LM), in which a three-dimensional (3-D) article is made by the sequential build-up of layers of material. Prior to physically building up the article, the process often begins with creating a computer aided design (CAD) file to represent the image or drawing of a desired article. Using a computer, information about this article image file is extracted, such as by identifying information corresponding to individual layers of the article. Thus, to derive data needed to form an article by LM, conceptually the article is sliced Into a large number of thin layers wfth the contours of each layer being defined by a plurality of line segments or data points connected to form polylines. The layer data may be converted to suitable tool path data, such as data that is manipulated by or in the form of computer numerical control (CNC) codes, such as G-codes, Μ-codes, or the like. These codes may be utilized to drive a fabrication tool for building an artide layer-by-layer.

[004] One or more suitable LM techniques may be utilized for making artides, (e.g., such as by creating one or more device patterns directly on a substrate). The LM technique usually indudes a step of selectively depositing material layer by layer, selectively removing material layer by layer, or a combination thereof. Many LM techniques are attractive in that they avoid the need for masks, for pre-existing three-dimensional patterns, and/or expensive tooling.

[005] Historically, LM processes that use electron beams for melting a metal have been generally performed in an open loop fashion, which relies throughout substantially the entirety of the process upon human intervention, and particularly an operator, to adjust operating 1 2017204522 30 Jun2017 paratneters. For example, an operator typically is ©bilged to visually observe tils Ljyi process throughout the layer by layer buildup, generally externa! of ah LM apparatusand througha viewing port Of ths’LM apparatus. if.and when an operator detects a,perceived departure from the buildup process, as.forecastedj the operator needs to immediately change operating, parameters. This approach may pose potential for complications dye to the subjectivity of the observations of the operator, due to any delay experienced between an observation and any, adjustment in operating parameters, and/qr due to improper selection of parameters. 1*1' recent years, there has been a growing need for a reliable system that: reduces reitbhce upon human operators of.LM processds and equipment. Hqwever, the art has yet to provide an effective solution. fOOTJ Among the dfHteuities encountered in attempting to implement closed fOop controls for LM techniques, and especially in fee area of LM that employs layer by layer build up of articles using molten metab has bean the ability to suitably monitor deposits of metal. This is a particularly acute difficulty when attempting to conduct LM at relatively high output rates. For example, until the present invention, it has been impractical to use camera-based monitoring systems, especially.monitoringsystems.that control metal deposition using overhead imaging of a mefe!. deposit, Optics may be susceptible to vapor build-up that occurs during manufaetbring. The amount of data and the rateat which images must; be captured for analysis, aiso hes faced limitations due to camera hardware. By.way of illustration, in achieving, rapid imaging, heat may be generated by operation of the associated camera electronics', this may have the effect· Of corrupting images that are obtained, Overhead positioning of a camera also puis fee camera at potential risk of image distortion due to pixel excitation by scattered electrons. Also; suitably robust, commercially practical, and compact designs for use, especially in LM, have been unavailable, [008J Accordingly, there continues to be a need in the art for ah improved system for monitoring layer manufacturing to provide feedback controls for forming a three-dimensional article. More particularly,. a system that provides automatic alteration of processing Conditions based gn information obtained from monitoring the layer manufacturing of the three-dimertsidnai article. |009] Examples of efforts, to provide layer manufacturing Of articles and processes include those disclosed In US Patent Nos. S(534,314; 5,669,433; ,073; ;β.,8,71,80δΐ β,960.8S3; 6,401,001; 6,193,923; 6,405,:09¾ 6,459^51; 6,680,456; 7,073*561; 7,165,935; and 7(326,377; and US Patent Application Nos. 3G030075836; 20050173380; and 20050288813, a.ii. of which are incorporated by reference for ail purposes. The possibility of closed loop controls for 2 additive manufacturing of articles by electron beam fabrication processes is identified at col. 12, lines 8-15 in U.S. Patent No. 7,168,935 (incorporated by reference), In Seufzer and Taminger, "Control of Space-based electron Beam Free Form Fabrication" (accessed at ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/20070030308__2007030399.pdf) (incorporated by reference), the authors address a possible approach to a closed-loop control system. See also, Sharma, “On Electron Beam Additive Manufacturing Process for Titanium Alloys" (Abstract for Session on April 27,2009 Spring 2009 AIChE National Meeting) (incorporated by reference). 2017204522 30 Jun2017 [0010] U.S. Patent No. 6,091,444 (incorporated by reference) elaborates on some of the difficulties faced in imaging high temperature melts. The patent illustrates an example of a high temperature melt view camera that includes a water cooled enclosure with a pinhole in it, through which a gas is passed.

[0010a] Reference to any prior art in the specification is not, and should not be taken as, an acknowledgment, or any form of suggestion, that this prior art forms part of the common general knowledge in Australia or any other jurisdiction or that this prior art could reasonably be expected to be ascertained, understood and regarded as relevant by a person skilled in the art.

SUMMARY OF THE INVENTION

[0010b] In a first aspect, the present invention provides an apparatus for layer manufacturing a metallic three-dimensional work piece, comprising: a) a housing defining a chamber capable of evacuation and within which the metallic three-dimensional work piece is formed layer by layer from a plurality of successively deposited molten pool deposits, the housing enclosing: A. a plurality of wires fed from one or more material delivery devices; B. an electron beam gun that melts the plurality of wires; C. a table upon which the metallic three-dimensional work piece is formed, the table and the electron beam gun being adjustably spaced relative to each other so that as the metallic three-dimensional work piece Is formed layer by layer from the plurality of successively deposited molten pool deposits, the spacing incrementally increases; D. an optical assembly including: i. a first enclosure, ii. optics housed in the first enclosure, iii. an aperture in a wall of the first enclosure for allowing access, into the first enclosure, of light emitted by the plurality of successively deposited molten pool deposits so that the light reaches the optics, and iv. a vapor protection device that substantially avoids build-up of metal vapor on the optics during operating of the apparatus; E. an imaging device including: i, a detector array, ii. thermally regulated electronic componentry, and iii. a second enclosure that substantially 3 encloses the detector array and the thermally regulated electronic componentry, and also includes an opening through which light that is emitted by the plurality of successively deposited molten pool deposits can communicate with the detector array; and F. a frame that carries the enclosures of the optical assembly and the imaging device in spaced apart relation from each other so that the aperture of first enclosure is substantially overhead of the plurality of successively deposited molten pool deposits, and the first and second enclosures are separated from each other; b) a closed loop control device configured to automatically adjust one or more processing parameters of the apparatus in response to data obtained from the imaging device. 2017204522 30 Jun2017 [0010c] In a second aspect, the present invention provides a process for layer manufacturing a three-dimensional work piece with the apparatus of the first aspect, wherein the process includes the steps of feeding the plurality of wires from a plurality of delivery devices at one or more angles and/or distances from the plurality of successively deposited molten pool deposits and adjusting the angles and/or the distance of the plurality of wires relative to the plurality of successively deposited molten pool deposits.

[0011] The present disclosure seeks to improve upon prior LM apparatus and processes by providing a unique process for fabrication of articles utilizing electron beam energy and closed loop controls. The present invention may incorporate any of the teachings described in of U.S. Provisional Application No. 61/243,242, filed September 17, 2009, the contents of which are hereby expressly incorporated by reference. One or more embodiments of the invention may make advantageous use of one or more unique features for allowing rapid article builds, especially aided by dosed loop control operation, such as one or any combination of a vapor protective device as described herein, a cooled camera housing as described herein, an alignment fixture as described herein, substantially overhead imaging of molten pool deposits during a build as described herein, or any combination thereof.

[0012] Disclosed herein is a process for layer manufacturing of a three-dimensional work piece comprising the steps of: feeding metal wire raw material in a solid state to a first predetermined location (e.g,, in the form of a bead, such as an elongated bead such as from a wire that may have an average width of about 3 to about 20 mm, preferably about 10 to about 15 mm (e.g., about 12.7 mm)); depositing the metal wire raw material onto a substrate forming a molten pool deposit under a first processing condition by melting the metal wire with an electron beam; monitoring the molten pool deposit for a preselected condition using a detector substantially contemporaneously with the depositing step (e.g. using an optical imaging device, such as a 4 digital camera; comparing information about the preselected condition of the monitored molten pool deposit with a predetermined value for the preselected condition of the monitored molten pool deposit; solidifying the molten pool deposit; automatically altering the first processing condition to a different processing condition based upon information obtained from the comparing step; and repeating the above steps at one or more second locations for building up layer by layer a three-dimensional work piece; wherein the monitoring step (c) includes monitoring a condition associated with the molten pool deposit from a location substantially overhead of the molten pool deposit; wherein the detector is located within a monitoring system that includes a vapor protection device and the monitoring system is located within a chamber that houses the three-dimensional work piece during forming; and wherein the vapor protection device is located so that an axis of a light beam received by the vapor protection device forms an angle from about 0.05° to about 20° from an axis of the electron beam. The steps may be performed at a rate sufficient to deposit successive layers at least about 0.5 cm3/hr to at least 2017204522 30 Jun2017 •5 λ ό about 2.0 cm /hr (e.g. about 1.54 cm /hr), more preferably at least about 2.0 cm /hr to at least about 5.0 cm3/hr. The steps may be performed at a rate sufficient to deposit successive layers at least about 2.5 kg of the raw material per hour, preferably at least 3 kg per hour (e.g., about 3.3 to about 6.8 kg per hour or higher). The steps may be performed at a rate sufficient to deposit the raw material as a plurality of beads that define successive layers having an average bead width of about 10 to about 15 mm (e.g., about 12.7 mm) at a rate of at least about 25 cm of bead per minute (e,g., about 35 to 80 cm per minute or higher).

[0013] The above process may in addition to a monitoring step include a step of cooling a detector by flowing a fluid in a housing of the detector for removing heat from the detector, wherein the cooled camera housing comprises: a front flange; at least one spacer pad connected to the front flange; at least one seal adjoining the spacer pad (e.g., located in-between a plurality of spacers, the front flange and spacers, or both); a rear flange connected to the front flange and sandwiching therebetween the at least one spacers and seals; wherein the front flange, the at least one seal, the at least one spacer pad, and the rear flange form an interior cavity, a plurality of printed circuit boards located within the interior cavity; an image detector, and wherein at least one of the flanges (e.g., the front flange) includes an inlet an outlet, a fluid passage between the inlet and the outlet through which the fluid is passed for cooling the printed circuit boards during their operation, and optionally a mount adapter.

4A 2017204522 30 Jun2017 [0014] The present disclosure also contemplates an apparatus for LM fabrication of a three-dimensional article comprising: a material delivery device for delivering raw material in a solid state; an electron beam gun energy emission device that emits electrons for melting the raw material to form a molten pool deposit; a work piece support upon which a work piece is formed layer by layer from a plurality of successively deposited molten pool deposits; a detector that monitors a preselected condition of the deposited material; a closed loop electronic control device for controlling operation of one or more components of the apparatus in response to a detected condition by the detector; and a housing defining a chamber within which the Work

4B piece is formed layer by layer from a plurality of successively deposited molten pool deposits; wherein the relative positions of two or more of the material delivery device, the energy emission device, the work piece support, or the detector changes during use of the system in at least the x, y, and z orthogonal axes for layer by layer buildup of an article. 2017204522 30 Jun2017 [0015] The apparatus may have associated with it an alignment fixture that is configured to allow for adjustment of an electron beam gun (and optionally a beam deflector), the detector, or both relative to each other and a known position of a work piece and/or work piece support. The present apparatus affords a robust system for gathering valuable data about a melt pool deposit substantially in real time. By way of illustration, the detectors may be capable of capturing and processing at least about 25, 30, 40, 50, or even 80, or more images per second. The processes herein contemplate operating the detectors at such rates or faster rates. In this manner, substantially real time data may be obtained about the deposited material that takes into account dynamic and unpredictable thermal conditions experienced by the work piece as a result of the layer by layer buildup and ongoing changes to dimensions and geometries of the work piece. The alignment fixture may comprise: a support structure with a base portion and a guide surface portion; an adjustable height work piece support simulator carried on the support structure that raises and lowers relative to the base portion along the guide surface portion; an energy emission device orientation simulator disposed above the work piece support simulator on the support structure, the energy emission device orientation simulator including an interface for alignment of mounting a detection device, an interface for alignment of mounting of a deflection coil, or both.

[0016] The apparatus may have associated with it a vapor protection device that comprises: a block that includes a base portion and a cover portion, the base portion including at least one fluid port that receives a gas stream that may be controllably regulated, the base portion and the cover portion each having an aperture that is generally axially aligned with each other and is adapted to be axially aligned substantially overhead of a molten metal pool deposit; at least one reflective substrate that is in optical communication with at least one of the apertures of the cover portion, or the base portion, for reflecting an image that passes through such aperture to a separately housed optical imaging device that records the image; wherein the gas stream enters the at least one fluid port and exits the block through one of the apertures, and provides an optically transparent protective barrier to prevent passage of metal vapor through the other aperture.

[0017] It should be appreciated that the above referenced aspects and examples are non-limiting as others exist with the present invention, as shown and described herein. For example, any of the above mentioned aspects or features of the invention may be combined to form other unique configurations, as described herein, demonstrated in the drawings, or otherwise. 5 2017204522 30 Jun2017 BRIEF DESCRIPTION OF THE DRAWINGS.

[0018] FIG: 1A is a general perspective view of an example of hardware useful for a system in accordance with the present teachings and a view ofadhamber Of a’h apparatus of the present teachings; [0019] FIG. 18 is a layer by (ayer deposition approach;.

[062.0] FIG. .2 Is a perspective view of an ilfustrative energy emission device and monitor assembly of the present teachings, [0021] FIG. 3A illustrates a side view pf an illusfretiye device for monitoring a molten.pool, deposit [0922] FIG. 38 illustratesan enlarged view of components of a vapor protection device shown in FIG. 3A.

[0023] FIGS 3C-3D illustrate an example of light beam orientation; [0024] FIG. 4A illustrates ah example of a purge block structure for a vapor protection device1.

[0025] FIG. 4BIllustrates an example of a component Of a·-'vapor prote<$Qn.device herein.

[0023] FIG. 3 is an exampie of an Image dMaihabie using the present teachings, [0,027] FIGS'. 6A-6B illustrate views of an example, of temperature controlled housing.

[0028] FIG.-SQ is ;a.n,exploded perspective view of a temperature controlled housing.

[0G2S] FIG 7.is a perspective view of anal)shmerit fixture.

DETAILED DESCRIPTION OF THE INVENTION

[0030] The present invention provides an 'apparaiusi-and process for layer rnanufoCtoringfLM) of a three-dimensional aiti.Cfe, The Invention, is particularly directed at an apparatus and process tick Liy that, provides high output rptest. For example, ft is possible that article (e.g·., metafile article) build rates of at least about 0.5;, 1,0,1,5,2,5,3;5, or even 4.0 crr^/hr, or higher, may be employed, ft is also possible that, artidle (e.g., metal lip article) build rates of dt least about 2.5, 3.0, 3.3, 5, or even 6.8. kg/hour [e.g. ltaving an average bead width of about 10 to about. 15 mm) may be employed/ [0031] in gepera.l, the apparatus: may include combinations of at least two or more of a material delivery device (e.g. a wire feed:device)'; an energy emission device that, applies energy to liquefy a.material (e.g,, a metal) delivered byihe material delivery device; a wofk piece support onto, which liquefied material is deposited; a closed loop control device [Oig,, one that Ιέ·' in .signaling communication with at least one ormore of the material delivery device, energy emission device, or work piece support); a detector (e>9< a digital camera having (!) electroriio 6 2017204522 30 Jun2017 components enclosed ih a temperature .controlled housing; (ii) a vapor protection device; or {lit} both (i) and $)} that, detects a condition' of materia! that has been deposited (04, by employing at least one solid state sensing device for generating an image of the deposited materia! subsfantiaiiy in real time) and supplies information about the condifeh to ihd cohtrol device so. that the control device oan change an operating parameter in response to lhe detected condition; and a housing that at least partially encloses, some or ail of the above components.

In general, the process may include supplying a material .(04,, a wire feed material); liquefying the material (e.g., by applying energy, such as from an electron beam); depositing liquefied material onto a work piece support as a molten pool deposit; monitoring the molten pool deposit; and controlling operation of the process using a closed loop control system for changing an operating parameter in response to a detected condition of the molten pool deposit The apparatus and the pmc®$s,rivay :rriake use of an optica! imaging detector that captures and processes data about images substantiallyIn real time,, and particularly a camera system that; ft) may be operated at a. rat© of at least about .25,.30, 40, 50, or even 60 or more frames per second; (ii) may derive its images substantially overhead of the melt deposit; (iii) may be operated for extended periods (e.g;, at least 8.24, 72, or even 144 hours or longer) Without buildup of image distorting vapors on any optical components; (iv) includes processing electronics that are maintained at a temperature below about 500, 400, 200, or even 100 “b;:0r any combination of (i)-(iv).

[0032] As-illustrated in FIGS. 1A-1B, the present inventiOfl may include a LM apparatus 1Q that includes,a material delivery device 12 for delivering raw'material in a solid state (Which may include at least one metal, which may be in the form of a wire); an energy emission device 14 (eg,:, an electron beam gun that Controllably emits an electron beam); a work piece support 18 (e.g,, a support that is motor-translated); a detector (e.g, including a camera); an .electronic control system with a suitable control device 20 (preferably including at least one microprocessor); and a chamber 22. At least a portion of one or more of the .components (e.g., the control system, a computer, or both) may reside outside of the chamber. The control system maybe in controlling communication with one or more ofthe material defiverydevice:12, energy emission device. 14, Work piece Support 1¾ or detector. The energy emission device 14 emits energy for melting the raw material td form a. molten pool deposit on -a work piece support:1 (e.g., onto a previous layer deposited onto a work piece Support), The work piece-support 16, the energy emission device 14, and/or the material delivery device 12 may be positionally translatable-relative to each other, so that a work piece can be formed layer by layer from a plurality of successively deposited (and solidified) molten poo! deposits. 7 2017204522 30 Jun2017 £0033] The detector 18 (FIGS. 2-33} monitors (e.g., using an optic# technique) a preselected conditioh of the deposited materiaV foraxahiple^ hulH .averagfetPitspefeiuFa· of the maiten pool deposit, temperature gfadieritWitolri:4fiefholt#rt poo! deposit, suftaoe topography of the molten poof deposit, the presence of any liquid-radlid interface in the molten poof deposit'; surface profile (.6,0.., shape) of the molten pool deposit, chemical analysis of the molten pool deposit, raw material entry location, raw material height, raw material orientation, or any combination thereof. The detector may obtain an image from a location substantially overhead of the molten pop! deposit so that a -material feed wire may be imaged substbritially as the· wire .ismeted. The. detector may communicate (directly or indirectly via another microprocessor that signally communicates with the control system) ihformation obtained about the preselected condition fo the. closed loop, electronic control devibe 20. £0034) the- clbsed' loop- elefctfohio-conbsl system may tibes j^gh(slly·· cbn&amp;bi |di.r4btly orlndireetly} operation of one or,more components of the appafatusin response to a detected conditioh. The control device may operate by altering one or more conditions. For example, one or more of the conditions, aitered niay be the location of any enei®y emissidn.deviGefor suppiyirig;energy to melt the raw material; the location of any: material delivery device used faFfeedtng the raw material; the location of the work pieoer support updn which a work, piebe is .built; the pressureof any enviromnehtin which the processing is performed; the temperature of any’envirprlmant in which tlte processing is performed; the Voltage or other energy supplied to melt the raw material; the beam used for any electron beam source of energy for melting the raw material (e.g., the beam focus, the beam power, beam raster pattern, or otherwise); the feed rate of the raw material; the composition of the deposited material; the temperature of the work piece; the temperature of the platform; or any combination thereof. The detector and control device.make it possible to perform an Llvt process autoffia®bafty,-afki espeda^-^ifbotrf.thb need for operator intervention (e.g., without the need for complete, reliance upon eubfectlve human operator observations about operating conditions, without the need for complete reliance upon manual adjustment of one or more operating parameters by a human operator, or both).

[0035] Use of toe processes arid apparatus may require a vacuum, so. theta reduction. of pressure below atmospheric pressure is achieved, Thtis, the eppamtus may have its components at.Jeastpartially enclosed within awdiied structure defining a chamber 22, which may be sealed, and within which the work piece may be formed layer by layer from a plurality of successively deposited molten pool deposits, The relative positions.of two or more of the material delivery, device, the energy emission debtee, the work pieces support, or the defector may change duringuseof the processes and apparatus;herein. 8 2017204522 30 Jun2017 [QQ36j| The I’M apparatus to includes a material delivery device 12 (FIG, 1 A) for delivering raw material in a solid state. tWe material delivery device 1-2 way be .strueturaiiy ecinneeted to awali defining the chamber 22 either via <£|ri^-sti*i#y|ial. aW»chfaent' .or sjfa an arm 28 (FIG, l A) that permits reorientation ofthe material delivery device 12 with respect to the eriergy emission device 14. The material delivery device may include one or more: frame structured that carry individual components, for example, a raw matenal holder (e.g„ an arm that rotatabiydames a spopl of wire), a Wire straightener, a motor, a sensor, or any combination'thereof, Optionally, the material delivery device 12 may be .adapted so that.it is mounted to a portion of the energy emission device (e.g,, a wire feed device may be mounted to an electron beqm gun). The material delivery device may attach via direct structural -attachment or via a posjfibrithg mechanism that permits desired orientation ofthe material delivery device 12 With res-pecf to the energy emission device 14, The raw material positioning device may be-configured’ for orientating the position of the raw material feed relative to the energy emission; device, preferably so that as raw material is advanced (e.g., continuously, intermittently, or both) by the material delivery device, and the raw material is delivered into a path of energy emitted by the energy emission device (e.g, , wire is fed Into the path of ah electron beam). The energy emission device, the wire feed, device, or both, may be configured to translate over at least 3 axes of translation {e,g., overtheor, y and-zaxas of mCartesian coordinate system), arid possibly everi over 4, 5, or even 6 axes bf translation, Thus, the raw material positioning mechanism may orientate the direction of the raw material feed relative tolhe ensrgy:-saurce· being emitted from the energy emission device, the molten pool, the work piece, dr any combination thereof as the volume of the work piece increased.. |$03Tj The material delivery deViced2 may Include a straightening mechanism, atlaasf one feed motor, feed sensors, a .raw material Supply and/or containment unit, or any combination thereof. Power required to operate the raw material feed motors (drive and tensioning) of the materia) delivery device 12 may -be .supplied from power via the at least one eledtrical feedthrough discussed herein. Examples of welding wire supply and straightening devices are-described in U.S. Patent Nos. 4,898,317:; 4,920,776; and U.S. Patent Application No. 20080296278, all incorporated by reference for ail purposes, A. suitable wire feed device thus may include a motor driven feeding mechanism including a pair of rollers that feeds a wife therebetween. As described in U.S.- Patent Application No. 200802.96278, incarpomted by reference, optionally there may be a tension ddntroller that adjusts. a tension between.bt least one pair of rollers, a wire speed sensor that measures wire feed speed, and a control circuit that 9 2017204522 30 Jun2017 compares a driven speed of the wire with the feed speed of the wire. The tension controller may also adjust the tension between the nailers. fOOSSJ The raw materials·used by the LM process may Include one or a ajmbinatipn pf; alloys bimetals (e.g., metals including a transition metal or an alloy thereof). Examples of raw fhatenals that may be used are: titanium, aluminum, iron^ ntekei, chromium, (p.g,, inconel}, Cobalt;, stainless steel, niobium, tantalum, copper, bronze, brass, beryllium, copper, vanadium, or tungsten. Particular exarhpies: of materials useful ih the present, technology are titanium and alloys of titanium fe.g,v also jrfdu$^&amp;1umtovm«· #nddtom,. or both}, sgch as one'including, titanium in.a major amount (Or substantially the balance) and about 3-10 wt% Aluminum (Aj) (more preferably about 6 wt%), and 0 to about &amp; wt % Vanadium (V) (more preferably about 4 Wt%),}. The raw matSriai may be supplied and/or fed in various shapes, and sizes. In.one preferred embodiment, the raw material is provided in the form of a wire feed stock. The raw materials may be provided in an already heat-treated (e;g,, tampered) condition.. it is also possible that the raw material may be provided in.a powder materiarform; in.which case, the material delivery device will be configured to include a suitable metering-device for delivering a predoterfriined qUanhly'ofpowden (0039] The material delivery device 12 may be adjustable so that it is capable of feeding relati vely large or even reiatiyeiy smaii diameter wires (e.g„· wires supplied by a.Wire spool, may have a diameter of about 5 mm of below, about. 3! trim or below, or even about 1 mm, or below) at both .hi gh and tow-speeds. The material delivery devi ce may include One or moreguide structures (e,g. one or more guide tubes 24) that hefp control wire position, it is aiso .possible that a plurality of wires (of the same of different material type) may be fed from one or more material.,delivery devices 12, at one or more angles and/or distances from the molten pool deposit.

[Q040J The LM apparatus 10 includesan energy emission device 14 that emits energy (a.g., using an electron beam gun or some other source of energy, such as a laser) for melting· the raw materia l to form, a molten pool deposit. The energy emission device. 14 may be structurally supported in the chamber 22, as seen iri FiO lA-IB, vip a, suitable stfpcturai. attachment dr positioning mechanism (e,g., arm 28f, which may also carry the material delivery device., The structural attachment or. positioning mechanism may be adjustable, For examples it may· inctude one dr wore attachment features (e.g., fasteners or the like) that allow itto be secured in a fixed: position and loosened, or otherwise released for adjustment or re-positioning. · The emission device may be configured for orientating the position of the energy beam relative to the work piece and/or work piece support. It may have at least 3,4, 5, or even 8 axes of translation (e,gM 1b 2017204522 30 Jun2017 over at least the x, y; and z axes of a Cartesian coordinate system). For example, the energy emission device 14.may be:configured to move .an electron beam gun using translation in X, Y, Z\ tilt in one or more of thejX-Y, XrZ, of Y-2 pfehes, or some oilier rotation to positibn lhe energy beam at a predetermined iooaiion.rei.ative4o :tb.e worfepiepe and/or; the vitork piece support.

[0041) Power required to operate the energy emission device 14 may be supplied from one or more:suitable power sourees. For example, power may be. suppiied via at leastohe ele&amp;ricdi feed-through power supply. The power source may deliver power greater than about 10 kilowatts (kW) or even greater than about 30 kW, The power source may deliver power up. to about 100 kW (e.g.> up to about 50 kW). The energy emission device may be sigfaily connected to one or mote processor (e.g., a processor Of a controller,/a computer» or otherwise) for controlling the energy output from the power supply. The. processor may be included. in the ctosedioop electronic control device or m.ay be part, of a separate^oomputer· and/or oontrotler, which Is operated by the closed loop electronic Control device,. One example of one approach for closed loop control is ilfusirated.in Serial No. 61/319,3.65, filed March 31,201:0, the; contents of which are incorporated by reference-herein.

[0042) A preferred energy emission device may include an electron beam generator that may locus a supply of electrons against the raw material (e;g,, an electron beam gun), Upon contact with the faw msfeilali the electrons may heat the raw material to cause the raw material to soften, vaporize, and/or rneit( and thereby introduce the raw material Into a molten deposit. For example, the energy emission device may genefateen electron beam.{which.may.be.;fOcused tp; a desired beam width or span). The .electron beam may be achieved: with a. low accelerating voltage, preferably between about 3 kV to about 80 kV, more preferably about 1.0 to 60 kV, arid even more preferably between 35 and 55 kV; with a maximum beam power in the range Of up to about 10 to about 15 kW (e.g., about 3 to about 5 k.W); by using about 100 V about 600 V (e.g., 110 V) input, power; or any combination thereof. Preferably, the energy emission device may be operated so there is sufficient power density for the electron beam freeform fabnoptipH process; while still providing suitable radiation shielding. The.processes herein may operate the energy emission.device within .some orall of the above parameters.

[0043) One approach, to the operation of anelectron beam gun may be to maintain the parameters of the gun at a Sufficient level so that the maximum depth of a molten pool deposit may be about 3 cm or less, more preferably about 1 cm or less, and possibly oven sibdut·0.5 cm or less, it is possible that the beam may be operated in a generally defocused mode. For the deposition of a material, the beam may he rasfered in a suitable pattern, such as generally non* circular pattern (e.g,., sin elliptical pattern,,aTmear pattern, a polygonal pattern, or any 11 2017204522 30 Jun2017 combination thereof).. For example, a beam having a width of about 0.5 to about 0.8 mm may be restored to eoveran. affective width of about 1 .0^:2.0,3.0· mm, of larger, in this mariner,; a relatively large amount of energy may be dispersed over a relatively large area, but to a relatively shallow depth, as compared with tredfildnal eSeetron beam welding.

[0044] The processes also contemplate operating the energy emission device· variably or constantly within some or all of'the above parameters. For instarfcevin responseto a detected condition., one or.more of the above parameters may be varied by a signal sent from a closed loop control device as taught herein. By way of example, the operation of the energy emission device maybe controlled in a suitable manner to achieve a preselected sizefor a deposited melt pool. The size of the deposited me.lt pool may be measured by the.detecter 18 (e.g,, mstal melt pool deposits are controlled to maintain successively deposited layers so that, they exhibit a melt, pool diameter or width of about 0.-3 mm-to about 20 mm or'even about ¢),5 mm to about 13 [0045] To the extent not taught expressly herein, or .elsewhere herein,, other art-disclosed operational parameters may be employed, such as are disposed in IfS. Patent No, 7,168,935, incorporated by reference (see, e.g., cols. 5,9, and the claims)» Other art disclosed energy emission devices may be employed alone or in combination with an electron beam .gunr such as a laser.

[DQ46] The LM apparatus 10 may include a work piece support 16 (F(Q. lA) upon which a workpiece-may be formed layer by layer from a plurality of successfyely deposited molten pool deposits (see, e/g„ FIG. 1B), and which may provide a s-<^tebie,oendd#tedf-tte.-elei^n beam (when on) in order to Help avoid static· build-up. The Work piece support 16 may include, a positioning mechanism (e.g.., a stepper motor, a servo motor, of some-other motor) for moving, the work piece support 16 !wMe optionally allowing the: energy emission device 14 Or another component to remain stationary. It is possible that the work piece .support 16 may be maintained generally stationary while moving the energy emission device or another component, The work piece; support 16 may further include at.least one pbsltibnihg sensor (e.g., rate.and location sensors); at least'©he posiiOnirig motor;; one or more power lined, of any combination thereof. the work piecesupport'16 may translate over at least 3 axes of translation (e.g.;, over' the x, y, and z axes of a Qartesian coordinate system), mare preferably translates linearly and rotationally over a total of at least four, -five,, oreven: six axes (e.g,, at least the X, Y, and 2 axes). The Work piece support 16 may rotate; clockwise, counterclockwise, or both around any of the axes. The work piece support 16 may be capable of moving entirely or partially outside of the chamber 22. 12 2017204522 30 Jun2017 [0047J Layer manufacturing according to the present teachings niay orient ah energy beam {e,g., an electron beam) vector substantially normal ίο the surface on Which the deposit .{s being; built. This tilt capability (erg,, positioning meohanism) enables positioning of the work piece, support at different ingles from 0“ (piatfbrm normal beariv vetforpbPQ? (platform normal is peipendbular to the energy' beam vector) to allow erihapOei flexibility and capability to build complex geometries, Which may include undercuts., overhangs, hollow sections, or any combination thereof. As can be. appreciated using traditional manufacturing techniques this has beep difficult to fabricate without expensive tooling, coring operations, and/or secondary processing (e,g., machining). (0048) With reference to FfGS. 2-38,. the LM apparatus 10 may include, one or more; monitoring system 30 that may include a detector 18, (e.g. an optical detector or more preferably a camera, such as a digital camera), -for monitoring a preselected condition. Preferably, for monitoring a preselected condition of deposited materials. More particularly, for monitoring a molten pool :of the deposited (materials. The monitoring system. 30 or its components (e.g., detector 18) may be located at bast partially within the chamber 22. With reference to FIGS. SA^B. ari embodiment of the monitoring system 30 is shown having a detector 18 With a detector housing 48 (which may be temperature controlled), and an optional vapor protector 32, (0049) The detector 18 may include one or more sensors or other devices (e.g,, one that derives its measurements optically, mechanically, by infrared imagery, by some.oiher .radiation detection, or otherwise). The detector may be a solid state device such· aa.one that comprises one Or more sensors (e.g., a solid state array effectively including a plurality of sensing pixels) that convert a: detected condition into an electrical signal.

[0030] The detector may be used so that it monitors a condition associated with a fnoiteripool deposit. The detector may mpnitor bulk average temperature of the moiten pool. deposit, temperatuns gradient within: the molten pool deposit, surface tppograpliy of the molten poo! deposit, the presence of any liquid-solid Interface in the moiten pool deposit,; sprface prpfiie of the moiten pooi deposit, chemical analysis of the. molten pool deposit; or any combination thereof. For example, the detector 18 may be configured to measure the melt-pool energy of the molten pool, vyhiph mby be deterieihed by measuring the melt-pool size and bmperature using an optical technique (e.g., by use of a/suitabie imaging device such as a camera), A preferred detector may employ suitable hardware adapted for machine, vision applicafidhs, and thus may include one or more housing (e.g., temperature regulated housings). The housing may contain s suitable substrate that includes an array of pixels,: arid optionally ohe or bore 13 2017204522 30 Jun2017 lenses and/or shutters.for controiiihg optica! communication between the pixel array and the object being monitored (e.g., a molten pool of a work, piece). £0051} The detector. 18 may inciude acamera selected from a high speed video cameraj standard video oamems, thermal imaging cameras, stiti imaging cameras, or any combination thereof. The detector 18 optionally may include one or more of the following,; an accelerometer, a thermocouple, a pressure sensor, a cufferii sensor,.a voltage sensor, a deflection coil sensor,. a focusing coil sensor, a rate sensor, a location sensor, a wife feed subsystem Sensor,.· or a combination thereof. An example of a suitable detector 18 may be a camera (e.g,·, a.high speed camera) with an image sensor that includes one.or more of the following features: an array of active, pixels (e.g„ a complementary metai oxide semiconductor (CMOS) image sensor array, a charge coupled device (GCD) image sensor array,,or both): progressive scan;, resoiutisrvthat is at least about 640x480; preferably at least about 752x582; arid more pneferably at least about 1024x1024 pixels. Examples of art-disciosed CMOS Imaging systems are found in 6,8ΐ5;6'β.5; 7,107,118; and 7,380,697, al! of whidh areincorpomted by reference herein. The detector may display results monochromatlcaiiy, in color, or both. The detector may be configured so that it opera tes.at an image acquisition rate or frame rate that ranges from about on the order of at least about 25 frames per second, e.g., about 30 frame per second (fps) or higher, ft may operate at least at about 40 fps, at least at about 50 fps, or even at about 60 fps, or more. For example, it may operate at about 25 to about 500 fps (e.g.., about 3Q to about 60. images per second, about 15Q fps, or faster). Suitable sensor arrays for detectors may have a pixel size of about 9 x 9 pm2 to about 12 x'12 pm2 (e.g., about 10,6 x 10.6 pm2). ^0052) Suitable cameras may‘include a CMOS active, pixel image sansorv CCD image sensor, or both, preferably housed together with suitable optics arid associated electronics. Examples of preferred cameras are available from Photon Focus of Switzerland (e.g., sold under model number MV-D1024E-40-CL-12, MV-D752-28-CWO, or MWD1Q24E-160). An example of a preferred camera may include a dynamic, range v#h ^.-reli^vsefy' Mgh borttfasi resolution (e.g. at least about 80 dBv 120 dB, 140 dB, or more), arid a shutter and/or an electronic shutter (e.g. a shutter that cohtrofe ex|tobure time electronically (i.e:, allows thecamera: to cOlie^.iightfor a finite amount of time) without any mechanical or moving parts), that may be" used fbrhigh speed applications With1,an exposuretime of about § to about. 1000 ps (e..g., about 10 pS). ; A camera' mpy employ a: suitable imaging array as is-employed conventiondily for monitoring-toetdsng Conditions. The camera may have a skimming feature, The imaging sensor-may operate over a spectral range of about 200 to: about 1200 nrh (e.g. about 350 *1000 nm), 2017204522 30 Jun2017 [0053] With reference to PlO. 3D, one possible .approach" may be to employe monitoring system that includes a detector with intermediate optics thatallow images to be .captured substantially overhead of the melt pool deposits. For example, the: detector may face's reflective substrate 34 .(8-:9,, e mirror of other* reflebtsteft lrviage) that may be positioned between the detector and the object to be imaged .(e.g. -a weld pooi), The refleGtivesubstrate may be posifloned so ®at the deteoter has a line of focus iA.},;(e;g. a path from the detector to the reflective .substrate) that may be approaching tee. electron beam,- andthe reflaotive substrate may have a }&amp;w«fiacua f8}Te.g;.,:irpni.a ptehote' of a purge block to the imaged structure) that is positioned generally in alignment with the path of the electron beam; [0064] FIGS, 3C-3D., provide one specific, but not .limiting, example-of 'the light beam orientation reiativstb the energy.beam. The energy beam being directed from: the energy emission device 14 extends along axis (C), which may be generally perpendicular· (e.g,, aboutrefettroiolhe work' piece support-1-0. The positioning mechanisiTi of'the monitoring system -SO may position the vapor protection device.32 so that the light beam may be received by the vapor protectiori device extends along .axis {A), which may be at an angle (d) of from about 0.05° to about 20° (e.g., about 2^ to about 10° and more preferablyabout $-)from axis.(C) (FIG, 30).. Thus, the angle (a) .may be about:20°or lessor even about 10° of less, Inane preferred embodiment, the tight beam generally-deflects at abduta 90° angle flora being received by the reffeetive substrate 34 to being deflected to the detector i 8 (FIG. 48).

[0055] The detector may be used in any step of monitoring, which may ihciude capturing ah eiectronicaliy stored image .substantially in real time (e.g,, it is less thsn:5, 4, 3,2,1 or, lower, seconds from the time of the event recorded). The sensing device: may detect electromagnetic radiation emitted from interaction of the electron beam-with a material in the work piece fit. being recognised that the work piece Will include any present rholten deposit)' to be imaged, [6066] Detection according to tee present teachings may be for purposes of directly obtaining a measurement, that is Indicative of a condition of a pool deposit it is possible fhat adetection technique may be employed that indirectly, measures a condition of a pooi deposit by observing a defectebie charactedstic. end then correiating the detected characteristic with anhridieaiion of a particular condition. To illustrate, under this appraach, oscillation frequency of a pool deposit may be monitored, a nd may be correlated With a depth of a deposition pool, it being theorised that a higher detected frequency may indicate less penetration of a molten pool deposit into a previous deposition layer. FIG. 5 is an example of a molten pool image that may be achieved using the detector The wire feed, in theseJmages is entering from tee left side. As is seen, 15 2017204522 30 Jun2017 overall the shape is generally' round and generally axially symmetrical. It includes a generally .C-shaped portion (0> with a generally circular or elliptical shaped portion: (X) (Whidhtmay correspond to an image of the feed matenai) that is within the 'C-shaped portion, and possibly extending outside the opening Of the C-shapert portion. The propess herein conterhpt^es that adjustments may be automatically made to the system so that a predetermined shape for'the image Is obtained,;a generally axial symmetry is achieved, or both. CQOSTJ The LM apparatus 10 may Include a. housing thai deflnese: chamber 32 wherein the work piece may be formed. The housing preferably may fdrm a sealed chamber capable of maintaining an evacuated environment. The mdjbr components!of the l^l apparatus 10 inay be contained within the sealed-housing (e.#., the .materia! delivery device 12, the ehergy emission device 14, the work piece support 10, and the detector 18), [0058] in. one embodiment, the housing may include a frame .and at least one wail formed, of a material. The wall may:t>e made of ceramic, a ceramic composite, a metal matrix composite, a polymer matrix composite, or a combination thereof., in another embodiment, the,frame and at least one wail may be made of titanium, aluminum, aiurftirfurft alloys; betyllhsm alloys, -stainless steel,· steel, or g.combination.thereof, which may provide for'radiation protection and Structural integrity. The housing may further iholude at least pna window for operator visibility as well as monitoring by cameras Or a video system, ttshould be recognized that, even though the present Invention obviates human operator Intervention, the processes and apparatus here may be:practiced with some human operator intervention; however, any such intervention may be considerably less than prior, systems, and may be aided by real time data acquisition froth the monitoring system.

[0059] The af least one Window may be formed of a transparent material such as leaded glass, glass, transparent plastic, or any Combination thereof. The housing may include at least one door attached to the frame or Wall to allow full access to the: chamber’s interior, when hot under vacuum. The sealed housing includes at least one electrical and/ or data cord feed-through (not shown) for connecting the material delivery device 12; the energy emission device 14; the monibrihg system 30 (e.g,, detector 18); motors for positioning mechanisms (e.g., fbrthe material delivery device, energy emission deyice, monitoring system 30, the work piece support, Or othewise);.:orarty combination thereof; with a power source and/or Instrumentation (e,g. computer system) located outside the housing.

[8080Ϊ As seen in FIG, i A, the housing may be a generally larger rectilinear cnoss-sec^ional shape. However, other shapes and sizes are possible, in one embodiment, the sealed chamber may be generally small so that the.housing may ba portable. As discussed above, the: 18 2017204522 30 Jun2017 housing provides a sealed chamber that. may evacuated usingavacuum meehaoism'ihdt shown) to reduce the pressure of the chamberbelow atmospheric pressure. For example; a pump, blower,, some other fluid mover; ,or a combination thereof may be used to reducethe pressure within the chamber.. The pressure within the Chamber otey range from about 1x10* to about 1 xriQi7 torn (or possibly tower), Furthermore, the pressure within the chamber may be less than about 0,1. forr, preferably less than about 1x1,O^dm and mere. preferably iess 'thart'about' 1x1 r! torn (0.0011 The effectiveness of the-above described detectors and monitoring steps may be. dependent upoil assuring a clear fine; of sight between the sensing elements of the detector and the object being measured (or any intermediate optical elements;, such as mirrors (e.g.. bha or more mirrors that may be used for beam modulation)). However, the process and/or apparatus may generate .raw material vapor that may be.sosceptibfefo. deposition onto hardware associated with the detector. For example,, vapor may. deposit upon a lens of the system, and/or upon another optical, element (e,g. a mirror), Accordingly, vvjth reference to FIQS. 3A and 38, the apparatus fhay include, a suitable vapor protection .device 3% which fundiionsto impose a protective barrier.(e.g., a solid barrier, a fluid barrier; or both) forward of one or more of the vulnerable, exposed components. Preferably, the Vapor protection device 32 will be such that it resists VapOr disposition buiid-up onto the exposed componentry so that the vapor does not build up end adversely affect measurement, integrity.. The vapor protector device: may include one or any combmdtioh.bf.a relativeiy iow suri'ace energy coating (which,may be substariiiaiiy transparent te hie radiation being.detected) that delays vapor deposition build-up’ onto a surtece-as compared with a surface, without the coating; a solid physical1 barrierfe.g.,. a shutter, a curtain, or other barrier that can be. opened and closed toexposethe componentry as, desired); a fluidic barrier (©.§., a gas stream that can be-r»ntro!iabl.y flowed to expose the componentry as desired); or a combination thereof. (0062] A vapor protector device may be located substantialiy adjacent to a barrier with ah aperture that may havesn optical element located behind the wall (e.g., abeam moduiation aperture), A vapor protection device 32 may be positioned subStantiaily adjacent with the detector 18 (e.g., proximate to the lens of a camera},, remote from.fhe detector 1.8 (e.g., proximate to a reflective Substrate 3.4 as in FIG. 38, but laterally spaced apart from it), or both.

In a preferred embodiment, as shown iri FIGS;. 3A-3B; the barrier,νβίΗ an apeHhre 42-may be located juxtaposed the second opening 38 of the housing 44. The protective device-32 may indude a protective means, for reducing or eliminating vapor buildup, such as a purge system, The purge system may include a purge linefnot shown) attached to a fitting 46, and a port so. 17' 2017204522 30 Jun2017 that the fitting and. purge fine may be connected to the vapor protection device for delivering a fluid into the housing 44. The fitting 46 may be a compression fitting andmay attach to a tube or a pipe. As discussed herein, the fitting 46 may be positioned, proximate to the barrier with an aperture 42 so that a fluid stream may enter through an intake port. 64a and may be directed towards (e.g„ laterally) the opening of the barrier 42 in the direction (E) (as indicated ih Fig.SB). The gas stream may exit through an exhaust port 64b, (0063] The vapor protector device 32 may he operated ih an intermittent manner, allowing periodic, direct line-of-slght exposure (via one or more pin-hole, aperture 1.Q2, of the detector to ihe Object being sensed. The' fluid may be geheraljy optically transparent, thereby allowing an image to be received through the. aperture. For example, periodic bursts of a fluid (e.g.,a substantially inert gas such as helium) may be blown to effectively blanket the pinhole aperture 102- In this manner, if.may be possible to clear vapor away from'exposed componentry. The vapor protector device:32, preferably^ may be; operated in a continuous manner. For example, one or more pumps (he' a vacuum pump) may be used to. create a periodic a nd/or continuous flow Of the fluid that exits through the pinhole aperture 102, and may generate a positive pressure inside of the vapor protector device 32. The one or more pumps may be operated so that the pumps are not overwhelmed while still maintaining the flow of the fluid at a constant rate and. pressure such that the yapor particles are prevented from building up on the internal surfaces of the vapor protector devtcel The pumps may be . controlled fey the. dosed loop control system that operates the various components herein or independent of such system.. (0064] The monitoring system may Include a barrier with an aperture· 42 :{e.g., v^atris regarded herein as a pin-hole aperture 102), For example, the pin-hole aperture.may be an aperture having a diameter qt width (e.g,. circular, oval, slit, or otherwise) of.about 0,SQ mm dr greater;, of about 2.0 mm or greater,.of about 3.0 mm or greater.· or even about 5,0 mm or greater) and any associated optics. Other components of the vapor protection device may also include a pin-hole, aperture, which may be .axially aligned with the pin-hols aperture of the barrier 42 along axis (f3). The barrier with an aperture 42 may be, for example;, an optical aperture, a standard aperture, or both for controlling the diameter of a beam from a light source (e,g., for modulating the beam by limiting the light admitted therethrough), pimducing.optimai diffraction patterns, of both^preferabiy during the course of detecting by the detector i 8. For'example, a barrier with an aperture of a various size(e,g., adjustable) or a eebatarjt size,. where size (e.g., diameter) may be determined from the equation:

Da - (KAab) / (a + b); where: D = Diameter of the opening (e.g., pin hole) (e.g., about 0.076 mm) 18 2017204522 30 Jun2017 K ~ Constant between 1 end 4 (e.g,, about 3.24) λ ~ Wavelength of the light (e.g.., about 66Qnmji, .a = pistdh&amp;eTrash the subjeei (e.g,, ννόΛ piece, such as the moitain pcbl daposst).to:ihei opening (e.g., about 330 mm) b * Distance froth the opening to the image plane (e;.g., deflector such as the mirror) (e.g., about 12.7 mm) (0068] With reference to Fi$.-3A»SB, the vapor protection device 32 may include a block that includes a base portion 60 and cover portion 62 (particularly a pin bole retainer member (jsuch as illustrated in FIG. 46)) that may be attached to ah outer surface of the base portion. The base portion may include at least .one port 64 (e,g,..penetrating from a side waif, of for receiving a gas stream that may be contrpflabiy regulated). The .port; 64 may be in communication with a passage 66 which may be configured for receiving the barrier member with an aperture 4.2. The passage may be recessed so that the barrier member with the aperture 42 may be generally maintained In place once the .cover portion '82 is secured to the base portiort '(e;g., the barrier member is. fixed between the cover and the base portions, as can be seen hi FIG. 3B). the passage 6.6 may include an opening (e.g,, hole) so that gas received by the .port 64 may be directed through thepassage, -and may contact the. barrier with an aperture 42 and more specifically the pin hoie aperture 102. Optionally, as can beseen.inFigs. 4A-4B the cover portion, the base ; portion, or :b.oth m ay incl ude one or more shoulder 88 upon which the.;barrier with an aperture may be rested, and the cover 62 may be attached onto a suffadeBOa. The cover and barrier with an aperture.may be held: in place by a pin-hole retainer 106. The pin-hole retainer 106 may include one or more retaining ring i 12. The vapor protection device 32 may be further configured as a mounting staicturefbr the barrier with art aperture 42 relative td the other components of the apparatus. The base portion 60 may bfe designed to provide a complementary fit with the barrier With anbperture 42, The base portion' 60 may act as p protective structure directing, the exhausted gas from the port 8.4 to adjacent components (e,g,, mirror,, windows, camera lens, or otherwise), (8088) One dr more suitable cond uits may be employed for supplying the fluid, the one or more .suitable conduits may be Syoused.separata or independent from, the components.of the detector. For example, the one or more suitable-conduits may bs independentof(e,,g,,.!ipt attached directly) the detector ho,using (e.g., a camera 'housing;). Rather, the vapor protection device andthe housing (though possibly carried by a common structure) may not be commonly enciosed with each other. Thus, the vapor protection device may be longitudinally separated 1¾ 2017204522 30 Jun2017 from the detector housing (p.g,v cSthera housing), and one or more suitable oondidffs may be connected directly .to the vapor protection device but not the housing, [0067] As discussed,.the mbhitoring·system may ioeiyde a surtable struciure that.aiiows the sensing deviceof the detector to be oriented away from the djreptjina of sight ;with ah object-being monitored, but which still captures an image substantially overhead of the melt poo! deposit in this oase, it may be possible to employ a reflective substrate:34such as a mirror {©,0,, flat, concave, or convex), more particuiariy a Silver mirror available from Edmund Optics. The reflective substrate 34. may bpeohiigured to deflect light according to an indirect path from the work- piece (e,g„ molteh pool or otherwise) to the detector. The vapor protection deyice-32 may further include a reflective· substrhie adjustment .{jinob SO (pig, a threaded device that connects adjoining pieces and is translatable to adjust/pdsitidn the adjoining pieces relative to each other) so that the reflective substrate may be.kept in1he:.direct line..Df'sight with the object· being monitored. The reflective substrate is substantially resistant to image distortion when subjected to operating conditions of the system. For example, the reflective substrate may exhibit a relatively low thermal expansion, e.g., within about +/-0,10 x 10'8 per °C.

[006$] The reflective substrate 34' may be mounted in a housing 44, The housing may create a. line of sight to the reflective substrate. The tine of sight may he ad artgfefjjJ} fSee ·Ε[{3,.38). between about 0 and about 180 degrees, more particularly between about 30 and about 150. degrees, and even more particularly between'about.60 and about 120 degrees (e.g., about 90 degrees), [0060] The housing 44 (e.g., a. 16 mm, right angle, kinematic'mount) may be a generally seated unit so that contamination and/or vapor deposition: buildupsmay be substantially reduced or eliminated j’n one embodiment;; the reflective substrate :34 may b.e generally sealed within a housing, 44 having Pf least two openings with a fltefopening36 for receiving the beam of light from a predetermined ideation (0¾ the work piece, the work piece support, or otherwise) and a second opening 38 for reflecting the beam of light to the detector 18. The first opening 36 and, second openingSS may include. a generaliy-transparent substrate 40 or dthefwise for allowing the light beam to be directed through the housing 44 while generaliy maintaining a sealed environment. More particularly, the generallytransparent substrate 40 may be a glass window (e.g. a glass window or a borofloat giass optical window) Or a Jens (e.g. an Esco Doublet #A912150). The transparent substfptfe may be a com ponent of the detector or may be separate therefrom. The transparent substrate may be held in place by one dr mote retaining ring 50. In one preferred embodiment, the transparent substrate 40 may include, a resistant material (p.g., coating) that substantially prevents or eliminates vapor disposition buildup. The resistant 20 2017204522 30 Jun2017 material may exhibit Oh'e or mors of the.following characteristics;: visibility to near' Infrared transmissions, a High resistance to thermal shook,, chemical resistance,, an anti-reflection,,or any combination thereof. The resistant material may include borosslicate, [00703 As^wili be described in further detail, the detector 18 or any of its sensing devices may be partiaiiy or completely encased in a detector housing’ 48, WhitSiiireWiy:Isei*;tfve^nrnyty- re^ui^^cl so that the temperature of the detector or its components may be controlled (e.g., for cooling Its electronic components). As seen In FIGS) 2-and 3A, there may be a suitable support member 108 (e.g., a flange) for supporting the housing 48 relative to the support, base 82.. The m onitoring system 3d may be attached to the housing of the energy emission device: using an attachment· structure 110 (e.g., a flange). For exampib, as depleted thefa is a support’bade 82 from' Which .a mount wali 84 projects away-fe.g:* upward). Th©;'supporrbase 82 and the mount waji -84 may be substantially perpendicular to each other. At one end of the attachment structure,; such as at an end 86 of the support waii there may.be a mechanism 88 {e.g., a fastener) for removable attachment) Attached, to.the mounting wall 84 may be ope or.more rotational mounts 90. Tho support base 82 may include one dr more..adjustment mechanism 114 that· alfow axial translation. For example, the supporfbase may incfude two opposing' members that are slidable relative to each Other, but provide-opposing, support surfaces,; An example may include a dovetail adjustment structure as seen in FIG. 3A. The support base 82 may be attached to a common carrier with the energy emission .device. The mesnitonng system 30 may be secured to the energy emission device .14 so that at least, a portion of the monitoring system 30 (e.g., the vapor protection device 32) may be positioned Within the. housing of fhe energy emission device, or at least substantially adjacent to the part of any emitted beam, [0071J The monitoring, system 30 may further include one or more lens tdbes.§2 extending between the detector 18 and the vapor deletion device 32, as iliustrated in FiG>-3A·,· A lefts tube 52 may be configured to Isolate, the light beam associated with, an -image from the , surrounding's. The lens tubes may include ondor more transparent substratal 40 (e.g., a lens) that may be held in the lens tube using one or more retaining rings 50. The lens tube may be Spaced apart from and is, not housed With the·.reflective substrateofthe. vapor protection devicev as illustrated in FIG. 3A.

[0Θ721 The monitoring, system 30 may furifterlneiudriorie or mere support members 54 and 84’ (ri,g.,. elongated members such as rsii carriers, a edge system, dr a i^ge stfueture fas iliystmted in FiGS. 3A-3B)) to provide connecting support for the detector 1 % the tens.tube 52, the vapor protection device 32, or any combination thereof. It is possible that the cage system created, by the one or more support members 54 will have no overiying housing. Thus, the vapor protective 21 2017204522 30 Jun2017 device and the camera may be separated by an open cage structure, A plurality of elongated support members 54 and 54’may be tetescopicaily dOniiedted to each Other for allowing istera! translation arid adjustment,. The support members 54 may be configured so that they allow the detector 18 to receive an image from the reflective substrate 34, white protecting the: monitoring system 30. The support members 54 may allow for a,gensralfy linear path through the lenS tube 52 to the reflective. substrate 34. The monitoring system may include an adjustment mechanism 5β (e.g, an axiaiiy translatable mechanism) to adjust the position of components of tie optical system (e.g.,,.the.vapor protection device 32 (e.g., iineariy towards.of away from the defector 18)}. The support members 54 may further be configured. to provide axial adjustments. In this manner, a fluid line may be maintained separately from the detector (arid, particularly a temperature controlled housing) aaced'ean be manipulated vHfh<^dN&amp;jrbfng fhe’fietefctofc Though the yapor protection device and the cooled, camera' housing may be carried on a common support structure, the vapor protection device may be decoupled from the cooled camera housing; (¢073] Optionally, it is appreciated that the LM apparatus TO may further include one or more cooling mechanisms such as a heat sink to absorb and dissipate heat rn regions Where heat build-up is expected. For example, the detector TS may further include a water cooled housing (e.g., within the. camera ‘housing) with a direct chip level heat sink, to generality maintain the-defector Within normal operating conditions, [0074) in general, such a cooled camera housing, may include a housing that surrouAds electronic components (e.g.. dt least-one printed circuit board) associated With the detector (e.g., electronic- components of a camera). The housing preferably Includes a passage defined in at least one wall through which a heat:exchange medium (e,g., sr suitable:liquid coolant) is: flowed. Desirably, the heat exchange medium is passed through a wall at a locraflon· between any beam from the energy emission device (e.g., an electron beam from an electron beam gun) and the electronic components). By way of example, the cooled housing may include a plurality of stacked flanges,, at least one of which has a passage ai least partially iatferaily defined.lh^ein through which The heat exchange medium is flowed, As illustrated, some or all of the flanges, may define a generally ring shaped peripheral portion.that surrounds at least one through hole that defines a cavity. The flanges may be configured to include one or more· support surfaces, brackets, or Other structures to which a eomponent(:e.g„ an efectronio component) may be mounted or otherwise Supported. The flanges may. adjoin each Other and be separated by a relatively resilient but thermaily conductive layer, and particularly a .polymeric (e,;g., acrylic based)spacer pad. 22 2017204522 30 Jun2017 £007¾ An example of a cooled housing may include a pluraiityefflanges,·and more; preferably ft least three axially aligned flanges: thatmay be separated by spacers. At least one cavity may be defined within the assembled flanges·, within, which ai.ieast one electronic component is housed, such as one or more printed circuit board's. An image detector (such , as an a may of pixel ..sensors may also be contained therein, and be in at least temporary visual communication with an object to be imaged. At least one flange (e.g,, a front flange) niay include an Inlet and an outlet so that a fluid may be circulated through the front flange £e.g., at least, across the ieftgthOfwidth of the flange). The front flange may further include a mount. adapter (which may be located in a central region of the front flange.) that enables moUnthg'of the associated, hardware: to the housing. The flanges may be assembled together and·connected SUch-aS-by way of a plurality of suitable fasteners. Two or more of the Internal components may be connected to each other in signaling communication· The rear flange:· may include suitable structure configured to afford connection of powered components With a suitable energy source, or through which cables or other signal lines may be.passed. The housing may have a generally rectangular cross sectional outer profile along the longitudinal direction of the housing, other shapes are also possible. The housing may belongitudinally spaced apart fromthe vapor protection device described herein, and may not share a cornroon enclosure vdih the vapor protection device. Thus,.anypinhdie aperture for resisting Vapor buildup and asso:dated with mirror or other refiectiveeptics may be housed in a separate enclosure., The housing may be free of any line or other conduit for supplying a gas to the. vapor protection device; thus, the housing, may be free of any fluid (e.g., gas) that passes through it for resisting vapor build-up. [0Q76J FIBS, 6A-6C illustrates'an example of a cooled housing 2&amp;b that tnciudes a front flange 2QQ (shown wiflra lens opening and an adapter) having a. plurality of spacers 21 G oonnected to the front flange 200. A plurality of seats 214 (e.g.polyrneno interface seals) maybe located in-between the spacers, in-between The front' flange and a spacer, in-between the rear, flange and. a spacer, or any combination ,thereof. A rear flange 230 may .be connected to the plurality of spacers and/or seals and located toward a remote end of the camera housing. The front flange, seals, spacer, and back flange form at feast one. cavity 26,0 info which at least one electronic component may be contained (e.g,, a plurality pf printed circuit boards 220rnsybe located within the cavity). The printed circuit boards may include at least one· interface pad 2:22, ah energy source 240, an image detector-260 (such as art affay of pixel sensors located forward of the pad 222). One or more flanges (e.g, the front flange 200) may include· an inlet 202 and an outlet 204 so that a fluid'may be circulated through the front· flange |e.g,i at least across the length or width of the flange). For example, the Inlet and the outlet are iijysimtiveiy depicted as. 23 2017204522 30 Jun2017 inducting a. substantially perpendicular elbow joint fitting, The front flange may further include a suitable mount adapter 206 (e.g., a C-mourit adapter, S-moUnt adapter^ F-mount' aciapter, or the like (which may be located in a centra! region of the front flange)) that enables mounting of the associated hardware (not. shown) (e.g., a cameraiens) to the housing {!.©„ front flange). The mount adapter may be secured in or to the front flange using a plurality of pins 208. For instance, one or more pins or other members may penetrate the side walls of the front flange so that the pins or other members can he brought into contact with the mount adapter 206 to resist the adapter from being pulled out. The flanges may be assembled together and connected such as by way of a plurality of suitable fasteners. For example, some or all of the front flange, seals, spacers, and bask flange may b©: connected t6ge|he.rby a fastening device 234. The fastening device may be a bolt, screw, pin, rivet; cHhe like, One: dr: more of the printed Circuit boards may be attached to the spacers or seals by a suitable connection device 224 (e.g, a fastener). The rear flange 236 may include one or more connection ports 232 that are configured to connect with a. suitable energy source .240, or through which cables dr other signal lines may be passed. The front flange 200, spacers;210, rear flange 230, or a combination thereof may include a vent hole 270 (e,g. through a side wali). The housing may be vented by applying a negative pressure to thovent hole 270, the housing may be vented by applying a positive pressures the vent hole 270·, or the housing may be ve'hted without any forced ventilation. {0077j As indicated, the flanges or the spacers iba-y be configured to indude one or more surfaces, brackets, or other support structures 212 to which, a po'mpbnenf '(e.g., an electronic component) may be mounted or otherwise supported. For example, a support stmdture'2’12 niay be configured with, a recess, well, •Window', or other opening into which a component may be inserted (e,g., so that it achieves a friction fit, an interfereni^ fit, Or both) so that at feast a portion Of the component is surrounded by the· support structure when assembled. The support structure may be cantilevered relative, to the surrounding wall, .it.may have openings .therein,, it may include a fiat surface, or any combination thereof, The spacers and/or seals may further be configured to include one or more heat: Sinks(216). {0:678) The. front flange, spacers, seats·,.and rear flange are geniraiiyteciahguiarin their peripheral shppo,. though other shapes may be used. Thus, they may haveari aspect ratio that is the ratio Of the width (W) to the Ibrigth (L) of the rectangu lar periphery, For example, the housing may have an aspect ratio of about 2 to 1 ^preferably abbut 1,5 to 1, and more preferably about 1.2 to 1. intermediate flanges may be generally rectangular rings. 24 2017204522 30 Jun2017 £0G?9J The frontfiange, rearffange, and spacers maybe made of an insulating; materia} ora material that conducts heat (i.e. aluminum). The materials desirably will resist degradation throughout the temperature range to which they are exposed; The front flange, fear flange, or spacers may contain an inlet,, outiet, or both. The inlet and outlet may be located on opposite sides of the front flange facing each other (FIGS. BA-60). suitable fittings tor attachment to tubing for circulating a heat exchange medium. Of course, the image detector may include a charge coupled device (CCD) for sensing.a complementary metal oxide semiconductor sensor (CMOS), or some other active pixel sensor. One approach contemplates the selection of materials and configuration for the seals, so that the seals function to conduct heat rather than insulate. For example, one dr more of the seals: may be made of ceramic, glass, acrylic, fiberglass, silicone, metal, or the like. £80801 Either or both of the seals 214 of the interface pads 222 may be thermally conductive and generally resilient. For example, they may be polymeric. The at least oneMerfaoe.pad 222 may function as an interface pad, parBdulariya thermally conductiye.interface pad, and more pattiailartya'tH^tiSlly conductive polymeric interface pad, 0ome preperties fhat the at least one interface pad 222 may exhibit include having: good softness, confocmability to pondM surfaces, excellent compressive stress relation, high thermal' conductivity, good surface tack that leads to a low thermal resistance at its surface, good dielectric performance, and excellent durability for both long term, thermal conductivity and electric ihsuiation stability. The .at feast one interface pad 222 may be a rwn-sillcone acrylic elastomer, arid may be flame resistant (e.g,-,, it meets requirements forcerfificatioh under UL94). For example, the at leas| pne inteffacd pad 222 may include a flarnrnabilfty of about V-0, measured iisingThei UL94'fiamhiability test method. fOOrStl One or more printed circuit, boards may be disposed on a support 212,· with an interface pad 222 between them (e,g, the interface- pad is compressed between the circuit board and the support). The interface pads 222 maybe interferifigly fit into a complementary receptacle in the support structure 212 of one of the flanges. Thus, it is possible-to achieve a thermal conduction pad (e.g. a continuous therraa). conductive path) within the housing between the electronics and the housing. The interface pads; 222 may effectively ftiiair gaps betweeri the electronic components and their support structures in the housing so thata thermal conduction .path of a relatively large area is realized. The interface pads may havee surface that.croritsets: the opposing, electronic component over at least 30%, 50%, 75%; or more of the outer opposing face of the component, thus, spreading the area for Heat transfer, it is thus possible to see- hbw a compaeigeometry camera bousingcan be achieved by whiCH heat transfer primarily by 26 2017204522 30 Jun2017 conduction (with orwithout convective assistance* -e.g., a drcuiated%iJd)ris real&amp;ed by the’ teachings herein, for cooling the internally housed electronic components, /Meanwhile convective cooling may be; used for cooling the housing that becomes heated by the conducted heat of the housed components, The teachings herein, thus, also contemplate steps of cooling internally housed electronic components by a thefrrfal conduction ^rrangerrieni((e.g; an arrangement that consists essentially of cooling by thermal conduction) to trahMer heat to a housing body, and remove heat from the housing; body using a fluid, 100.821: The at feasfcone interface pad, the seals, or both may have'a density (g(cmJ, of about 0,5 or more, more preferably about. 1.0 or more, and stilt more preferably about 1,5 or more. The density may be about 5,0 or less, more preferably about 3.5' pf less, and stifl.mdre preferably about 2.5 dr less (i.e. from about 1,9 to about 2.1), measured using the J1S K6249 test method. The at least, one interface pad .222 may have a hardness.of about 5 or more, more preferably about 10 or more, and still more preferably about 15 or more. The hardness may be about 100 dr less, more preferably about 60 or less, and still more preferably about 3S or less (i.e. from about 16 to 30), measured using the Asker C test method. The at least one interface pad 222 may include a volume resistivity (ς-cm) of about 1.0 X 10i? or more, more preferably about 1.5 X 10ia or more, stili more preferably about 2.0 X 10t2 or more. The volume resistivity may be aboutO.O X 10u or less, more preferably about 4,5 X 1032 or less, still more:preferably about; 3,5.0 X 1012 or less (le, from about.%1 X i.012 to 3,4 X 10·Τ?), measured using Jis: K6249 test method The at least one interface pad 222 may have:a dielectric strength (kV/mm) of about. 10 or mdre,: even about 45 of fnore, and even about-20 -of .more. The dielectnostrength may be about ?5 or less, about 50or less,, or about 35 or lass {le· from about 21 to 33), when measured using jlS K8249 test metiipd, The thermal, conductivity may be at least 1 (W/ivbK) (e.g. about 2, 3, 4, or even higher), measured using ASTiVi 151225-04, The 'thiqkness dfthe materia! may range from about 0,5 to about T.'5 mm. Smalier dr· larger thicknesses- are: possible also. (0083) The at ieast one iriteifaoe pad 222, the seals 21.4, or both may lhclude one or a plurality of layers. For example, it may lnciude a surface layer and a dore layer. It may aiso Include a liner (e.g., a, film liner). The layers may be polymeric. They may differ in terms of rigidity. For example, the surface layer may be more rigid than .that core layer, or vice versa. They1 may differ chemically. They may be- a thermally conductive elastomeric material. They may he an acrylic material. An example of a materiai that may be used for'the; at··.least one intetface' pad is Thermally Conductive Acrylic Interface Padf;-availabie from 3M under the designations 558SH and 559QH. 26 2017204522 30 Jun2017 [0084:1 Whettihe· housing is assent bl ed-together it wifi have a freight (H) that spans-from a forward face of the forward: fiangeto;a rearward· surface .of the’raarward.flange. The. ratio of the height <H) to the width {.V¥}'andtp the length (LJ may range from about 1:2:¾to about 1:1:1 fiie. about 1:1.2:1.3).' PrafeBably, the· fi^naiflange 200-wilfhay» the.· fafgest hbij^i oqfapara# with the spaders and. the rear flange; The ratio of the height Of the frbfri flahge;fF).t»1he' overall height (H) of the housing when assembled together may range from about 1 to 1.5 to about 1 to 4 (i.e., about 1 to 2.5).

[0085] As discussed the image detector-.2§0 may H any type of device for imaging the. inside of a chamber (i.e. infrared video camera, television camera, CCD, or the like). As discussed, One preferred detector uses a CMOS array, it is further oontenlpiated that the housing may be free of air circulation. However, air may be ejibuiated through the housfhg, the circulated air may be conditioned, or the circulated air may joe. an.inert gas. The,camera may be placed fh the-housing so that the camera is Copied; preferably the housing may be: g part of the camera so that the housing protects and cools the components. (8088] The teachings herein also contemplate the possible use of a Fpraday cup or other metal cup that catches charged particles in an evacuated condit>on( and computer tomography software that· analyzes power distribution therefrom· An example of such a device employs technology from Lawrence. Livermore National Laiaoratory and is available front Sciaky, Inc,, under the designation EBiEAM 20/20 Profiler,, A grounded beat sink may include a Faraday cup or th© like, in an insulated .chamber. The heat sink play have ah opening in its top that ha.s a tungsten sift disk with radial slits (e,g„ about 17 slits) disposed above a copper siif disk with radial slits (e.g,, about 17 sifts). A graphite slit stop may be within theoup, above a copper beam trap and a graphite beam stop. Such device may be employed in a method that includes steps of (1) quantifying, power density .distribution, (2) det'emiinihg the s.harpnes§ of focus of an electron beam, and/or (3) corretating machine settings, with beam properties; (0087] The LM apparatus 10 further may includes ciosad loop diectrohic control device 300 (FiG, 1 A) for controiiing operation of one or more components of the LM apparatus 10' in response to a condition detected by the detector 13. in. one embodiment, one or more of the controls (e.g,, closed foop control device 300) and data acquisition maybe electronically managed through a user interface and display device (0¾ suitable instrumentation, such as one or more computers). The dosed loop electronic control device may operate to: perform one or any combination of functions.; Most 'generally, the closed loop electronic control device may acquire one or more signals obtained by the detecior 18 (e.g., in real tirae(,as the detector or any sensing device is monitoring the work piece). The dosed loop electronic control device 27 2017204522 30 Jun2017 may process the signal by comparing it with a stored value (e.g., a value that is programmed into a database,; a value from a previous reading, or both); Based upon the; step of comparing*, the closed loop electronic control, device may issue a command that may cause the processing parameters to be changed to one or mofe different processing parameters (e.g,, the: dosed loop electronic control includes a: processor that is programmed to perform the comparison and: then issue a certain signal based upon the resul ts of the comparison). For example:, tbs dosed loop electronic control device may issue signals to ohe Or more of the following: the material delivery device, the energy emission device, the work piece support, the detector^ an electrical supply, a va&amp;itirii device, a gas supply,, or the vapor protector. The eommandfrom the closed loop electronic control device may cause the alteration of oneor more conditions,, as have been described previously. The conditions that may be altered may be one or more of theifolioWing: the location of any device for supplying energy to melt the raw material; the location of any device used for feeding the raw material; the location of any platform upon which a work piece is built; the pressure of priy environment· in which the processing is performed; the temperature of any environment in which the processing is performed; the voltage supplied to melt the raw material; the beam used for any electron beam source of energy for melting the raw materia!; the feed rate of the raw materia!, the com position, of the deposited material; changing the temperature of the work piece; the temperature of the. piatfom;; or any eombinatior) thereof. Examples of suitable software that may be used for the programming of devices used in the present.invention include software available from Nations! Instruments (Austin, TX) under the designation Ni Developer Suite (iriciuding LabVIEW PDS, tabWindows/CVl, IVleasu.femeht· Studio; .SighaiExpress, LabVfEW and LabWindows, and opti'onalfy image A6duSsition5 and Machine Vision Option for Ni DevSuite (includes Vision Development Module,. Vision Builder for Automated Inspection, and Vision Builder for Ai Development Kit).

[0088] The control: device: may include machine control and process control functions, An example of a suitable commercially available control system Is pvailabie from Sciaky fnc., under the designation W20XX. The control System may: Include a suitable computer control and interface (which may includeone. or more miProroompufers. servo drive modules, ihput/output modyles. orsignal conditioning module). The control system ;may infclude One or more suitable processors (e.g.,,a processor with atleasfone VMErorother standard bus back plane), such as the 080X0 series of processors (e.g ., 68040) from Motorola,, with the processors including onboard memory (e.g., Random Access Memory-(RAM):).: More prefehably, Pb IntpilfFehtiumigs processor maybe used. The control system may include a user interface c^mpohetli; (e..g,* suitable InpuVoutput hardware, that .communicates with the processor and allows· programming 28 2017204522 30 Jun2017 of the processor, such as by, a systems, otteiberwlse). The control system may Include suitable software (e.g., software a;vaifabte:uifK|er the designation Sctaky Weld 20XX (e.g. W.2O00, W2010, W202O) or some other W2Q family of software), [008¾] The W20XX control system may be in signaling communlcatton with: one or more suitable computer (e.g., Tf’dOQ Workstation PC, by Del!) that may be used to perform dosed loop parameter adjustments sent to operate the overall system {e,.g.t a .power supply {which may include'a solid’state power supply), ah electron beantpurt, any detector or sensing device, any data acquisition electronics, or otherwise)), The. control system maybe in signaling communication with hardware, such as an'eriergy emission device, a monitor,, a work piece support, other hardware that is controllable according to the present teachings, or a combination thereof, [0090] Thus; the computer application software, computer system, and the closed loop electronic cohiroideviee, or a combination thereof may be in communicatton vvifh ihe detector so that process ‘parameters may be monitored as previously discussed herein and contraiied. Controlling may be based upon a detected shape of a melt pool deposit. For example* a detected shape may cause the control system to change a processing condition such as one that affects melt pool surface tension, a feed condition, or both. Surface tension may be a characteristic that ls; detected and upon which adjustments to processing cbrteitions, are made.

[0091] The control device 20 may include a linear PiO (proportionai-iritegraMenvative) style Of control. The control device may be a single input single output system. The Control device 20 may include a multi-input/ muliFputpuf (MlMO) roLftlne which .may havea variety of operating modes., It is appreciated that a futosy logic style of control may offer sevetei advantages.for this process Os may be Weil suited for use with a Mi MO system as well as both linear and. nbndinear processes; in such a eonifoi, input variables, output variables. Or both, may be converted from, hard scalar numbers to “fuzzy” sets which are represented by a suitable linguistic terms (e;g., a descriptive and/or relative terms, such as teig” or "small”). Thus, the control may make rt possibtete.G0nverba^iops''ith^t: a mahu# q(te^r-m^'pe^n-.|nte an automated operation,

For example, the controller may interpolate and/or extmpolateinpiit values, output values, of both by employing a series· of “if-therF' rUies·. Each variable· mpy have its owhronique “fuzzy’ set assigned to it, which may. be arranged and/or processed independently of other variables. For example, a beam power control operation may be independent of an ΧΪΥ deflection operation.

[0092] Examples of sfmple-ahd complex·control inputs; and:control outputs may include one that monitors for a predetermihed condition .and then adjusts obe dr more (e,g.,, preferably·at least two) processing parameters in response to. information from the monitoring, For example, a 29 2017204522 30 Jun2017

Simple Single input Single Output (SiSO) control may be employed where the melt pool width is monitored for a predetermined condition and the control then adjustsone or more processing parameters {©§,, an energy beam condition such' as power) to Piter the monitored condition, A Complex Multiple input/Multipfe. Output control may include'monitoring the melt pool width, melt., pool shape, and/or peak temperature bias. Based; Upon information acquired from'the monitoring, the controller may then adjust oneor more processing parameters (e.g.,, at least two parameters, such as the energy beam condition, the wire feed rate, and/or beam deflection j. A closed loop electronic control device may employ fuzzy feiio, Fast Fouder Transform (FFT):, software signal processing, or any combination thereof to alter a processing condition in response to a detected condition.

[0093} The time iapse between when a melt pool deposit is formed and when a condition . is' alterbd in response to. a detected condition is rapid. For example, the response time may be about one minute or less, about 30 seconds or iess. about 10 seconds or less, about 5 seconds or less, or even about 1 second or less. Thus, substantially real time condition adjustment Is possible, £0094} For testing ahd verification, at least One accelerometer optionally may be attached to the equipment to measure the gravitational forces and accelerations. Additionally, the process parameters may be recorded on the same time basis as the process monitoring instrumentation outputs.. Examples of.process parameters that maybe mbhiiomd .are; sealed housing environmental parameters (for exam pie, temperature); beam parameters (for example, current, voltage,, deflection and focusing coil parameters,, raster patterns); vacuum levels (for example, pressure level); rate and location parameters;· and wire feeder control parameters (for example, rate, start, and stop). A computer, having a user interface, may be employed for commanding and controlling the fabrication process. A human operator may evaluate the overall operation of the energy emission device, the material delivery device, positioning mechanisms, vacuum operating parameters, or any combination thereof. Though the objective Of (he present invention is- to form an automatic system, sortie aspects of the present fhvenfferi may be bseci In a process that· requires human intervention. The closed loop «iectronicbbntroi device may be configured to make the appropriate command inputs through the monitoring system and control software, or both, to manage the various systems of the. layer manufacturing process, [0995} The present teachings also contem plate thb possible use of an aiignment fixture for use with an LM apparatus, and particuiarly an -energyiemissioh deviee'. th general* an alignment fixture may be employed in a process of setting up the LM apparatus, calibrating the LW apparatus, of both. The aiignment' fixture may be positioned relative to the LM apparatus while 30 2017204522 30 Jun2017 adjustments ate mad © to the orientation of on©, or more components of the LiV( apparatus'- the orientation of the adjusted components may be fixed in a secure position and'then the alignment fixture may be removed. 1:0996} h suitable aiigriraenlfixiure may include one or more features fen simulating the posKidn of one or more components of the LM apparatus relative to another, a site where a.work piece may be located, or both, for example, aniaiignment fixture may inciude a support strudprd with a base portion Odd a guide surface portion. The alignment fixture, may include an adjustable, height work, piece.supportsfmulator carried on. the support struoture thaifaises and lexers relative to the,· base portion along the. guide surface portion. TH© alignment fixture may include, an energy emission device orientation simulator disposed above the work piece support simulator on the support structure. The energy emission-device orientation simujatof may include an interface for alignment When mounting a detection device,,an interface for alignment when mounting a deflection coil, a focusing coil,.or a combinaiion thereof. The sUppOit structure may havea perimeter thai defines an interior region that may be accessible from at ieastone side of the support-structure. The base portion may inciude a base member, which may be a plate. The guide surface portion may include at jeast one generafiy upright guide member. The at least one generally upright guide member may fie a shaft; The atieast orie generally Upright guide member maybe temporarily or permanently mounted to the base member. The work piece support simulator may inciude a member that is mounted on 'the at least one generally upright guide member anti is gusdingiy translated on the guide member. The work piece support simuiator may inciude at feast one piate having an opening through which -the· at least phe generally upright guide member passes. The Work piece support simuiator may include'a suitable bearing for allowing translation, for .example, there may beat least one linear' bearing •disposed above arid/or below the'mounted member. The work piece, support simulator may inciude at least one:position ad}ustahte'd.eMce'that-}riferferasfWlth translation,of fire work piece support simuiator. For example, flyea«^{abJe'-4^c^-r0ay,b^%q^Itarihi^t:#t'.lSi^t.|^®rfly surrounds at feast one of the generally uprightguide members! The work piece support simulator may inciude a piate having at least one target alignment feature defined thereon for simulating a characteristic of the work piece support, a work piece on the support, or both. [0097] The orientation simulator may include at least one first piate attached toward an upper end the support structure. For example, the at least one first plate may be attached (e.g... by press fib weld, fastener,; or otherwise} to the Support structure via at least one Shaft,. The at least one first plate may have a (1) a generaily upright waii for simulating mounfing,hardware tor 31 2017204522 30 Jun2017 a detector; (if) a second (State disposed beneath the plate and at toast partially in the.interior1 portion for simulating mounting hardware-for a deflection coil; or( ilij (?oth (i) and (ii).

[00983 in use, the.fixture:viouid allow vertical adjustment of pomponente of the sydfem. .Further, the fixture structure allows it to receive one or more components of the LM apparatus and support the components While an adjustment is made. For example, one or any combination of steps may be employed by loosening or otherwise: releasing at feast one fastening attachment of at least one component,, supporting (e.g., in a substantially flush fit) the at least one component, on. the aiignment fixttfre.whHeihe at least one fastening attachment, is in the loosened state, adjusting the orientation of the at [east one component, re-securing the least one fastening attachment of the at feast one component.

[OOSSj, With specific reference to .FID., 7, there is depicted in more particular detail an example of one-such ailghnibniifixiure 5TQ ih accordance with the present teachings. The alignment •fixture 510 includes a support structure 512 .including a base portion. 514 and a guide ;Syrface portion 516. An adjustable height work piece support simulator 518 is carried on the support structure 512 that raises and lowers relative to the base portion along the guide surface portion 518.

[001003 An energy emission device orientation .simuiator 520 Is disposed aN>ve the. work piece support simulator 518 on the support structure 512, The energy emission device orientation simuiatof 520 may include a first interface 522 for alignment of mounting a detection device, a second interface 524 for alignment of mounting of a deflection coil, or both. The support structure;ma.y have a perimeter that defines an interior region 526 that may be accesslbie from at least one side of the support, structure. The base portion may include, a base member,, which is illustrated as a plate 528. The .guide surface portion 618 may include a number of generally upright guide shafts 530/ [00101J The work piece support simulator 518 may inclnde a msmber 532 that may be mounted on the at least one generally upright guide member and may beguidingiyiransiatedon the guide member. The. wort piece support simulator 518 may include a plate 534 that may have openings through which the guide shafts may pass, and-which-the plate· may bear against the shafts; The wort piece support slrriuiator 5.1¾ is depicted as having muStipie linear bearings 536 for" allowing translation.

The wdfk piece support· simulator 518 may also include a collar 538 that may interfere With translation of the work piece support simulator. The plate 534 of the work piece support simulator 518 may have at least one target: alignment feature 540 defined thereon for simulating a. characteristic of the work piece support, a work piece on the support, or both. 32 2017204522 30 Jun2017 [001023 The orientation simulator 520 is iiiustratsd as: having atleasf one first plate 542 attached; toward an Upper end the support structure, The at ieasfeone first piatb 542 may have a generally upright waltsHtor simulating mounting hardware-for a detector and a second plate 546 disposed berieath the-plate and at feastpartialjy in the rrierior portion for simulating mounting hardware for a deflection coil.

[00103J The present invention may further provider method (eig., process) for layer' manufacturing of a tli#!6^dlfn©n^enat'''We^:-[rfece. For example, the.fayer manufacturing process may include feeding raw material jii a solid state to a first predetermined location,: The raw materiel may be deposited onto a substrate [evg., wori< piece support 16) as a molten pool deposit under a first processing condition. The molten pool deposit may be monitored for a preselected condition (e.g., using the monitoring system as described previously). Information about the preselected condition of the monitored molten pool deposit may be compared with a predetermined desired value for the preselected condition of the monitored molten pool deposit, such as by use dfthe closed loop control device previously described, and the first:processing condition may be automatically altered (0¾ by the closed (pop control device) based upon infonnation obtained from the comparing step. The molten pool deposit may be solidified and/or .allowed to soiidify. The Steps may be repeated at one or more second locations for build ing up layer by layer a three-dimensional work piece.

[00104] Any comparing step petforatod by the control device may be performed in any suitable, manner. As indicated, one possible approach is to use TF X ANDY THEN Z" rules, which may employ linguistic variables. £00105] The process may further indude the step of translating one or any cdfribinatlon of the previously described apparatus components such as the material delivery device, the energy emission device, the work piece support'fe.g., .substrate), or tedetsctor during use Of the apparatus.

[00105] The step of feeding raw material, may include advancing a metal wire feedstock (e.g., having an average diameter of iess than about :5 mm) through a Wire feed device that may include a plurality of opposing spaced apart: rollers, 100407] During the monitoring step, the detector 18 may optically monitor at least ode molten pool deposit More particularly. the morijtprihg step may Include monitoring a condition associated with the mgiiCn poo! deposit ebtected.!fibW.byll?^yerage^Wpei^!rev#ithe·rnoiten pool deposit, temperature gradient within the molten poo) deposit, ·surface topography of the molten pool deposit, the presence of any liquid-solid interface in the molten pool deposit, .surface prpfila of the molten pool deposit, chemical analysis of the molten pool deposit, or any 33 2017204522 30 Jun2017 combination thereof. The Vresstected 'condition- of the- monitored· molten pool deposit may be a predetermined value that is stored in memory of a computer processing system, the preselected .condition ofthe monitored molten pool deposit may also be a value of a previously measured motten pool depositor the sameore 'different Work piece,· or both, the information obta ined from any monitoring step may he stdi^'1h.m^1i©f^.aijd aday-fes» ussd subeegbenfly to repair or replace a portion of the work piece. Any monitoring Step may include mOhitPilng at least one molten poof .deposit in the. absence of applying an external influence to induce oscillations of the weld pool deposit- [00108] In the monitoring step, the orientation ofthe detector 18. the reflective substrate, or both, relative to a .first location about the melt pool, may be generally constant do that information about the preselected condition Ofthe molten pool maybe obtained from generally similar locations ofthe meit pool as the meif pool progresses during the-deposition. In another feature of the monitoring stepi the orientation of the detector 18., the reflective substrate, or both relative to a first location about the melt pool may be generally variable so that information about the preselected condition of the molten pool may be obtained from various locations (e.g., progressively scanning) ofthe melt pool as the meif pool progresses du ring the deposition.

[00109] the step of automatically altering the first processing condition to «.different processing condition may be performed by one or more electronic processing units Ce.g::, Computer). The step of automatically altering the first processing.condition to a· different processing condition may include-altering ohe or.more conditions previously discussed herein, For example, the location of any device for supplying energy to melt the raw.materiai;the location, of any device used for fs.ed.ing.the raw material; the iocation of any platform upon which a work, piece· is built; the pressure of any environment In which-the; processing is-peifOrmed-;tbe temperatum of any envimnmerit in vyHlch the processing is performed.; thevpitage supplied to meit the raw material; the beam used for any electron beam source of energy for melting the· raw material; the feed rate of the rhw material; the composition of the deposited «fatsriai; changing the temperature of the work piece; the temperature of the platform; or any combination thereof, may be altered.

[00110] The methods may further ihcludethe step of· repairing.a damaged portion ofthe work piece by locating a stbred monitored iocation that is relative to the.damaged portion of the work piece, changing the preselected value to the stored monitored value; depositlhg, melted raw material at the damaged portion while monitoring the deposited material until a. sOeond monitored value is determined that is the same as the preselected value; and advancing the deposition of 'mailed raw material ..until a second monitored-value is determined that is the same · 34 2017204522 30Jun2017 as the preselected value, The method mayinclude the step of utilizing a proximity device (e.g., laser) to measure the substrate distortion and subsequently map out the Z location for each deposition pass. The closed loop control may be used to maintain a consistent melt pooi, wherein height profiling may also be incorporated. Height profiiirr|;raay; fee utilized in a pre-scan mode with a measurement accuracy of generally up to about 0.8 mm (e.g., about Q.1Q mm to about 0.30 mm).

[00111) The? establishment of processing parameters may be by trial and. error. It may be

based upon historical experience, it may be based upon one. or more test methodology. By way of example, one approach may include comparing results of atleast one deposition test run with, known values obtained from a reference strupture,hayingtaowmvalues. The reference structure having known values may be placed in a.-predetermined'known locatleft within the system, images may be taken with a detectarahd compared against khbwn data about the reference structure having known values, and adjustments may be made to reduce the differences between the measured, data and the known data. For example, the parameters may be varied above and below the baseline parameters (e.g,, in terms of focus) to iteraiivelyfind optimal settings. Each test ifiayprodtfea digiteffiie A test log may be employed for manual entry by an observing operator.: Resulting Images may be evaluated agaihst,known values; (e.g., contrast between known features/ signal to noisd, accuracy of features ip-the X-V plane, and deptirofJeld sensitivity in the Zfdifectidn).

[0011¾] The present inventioantay irieiude an afticie pt manufacture made using the LM method, the LM apparatus, or both. The method of making the articles may result in a near net shape part that may be ready for finish machining. The article of manufacture may be art original equipment component, a replacement part, ora repaired original equipment component. The article may be heat-treated subsequent to its layer by layer manufacture. The article may be an aircraft component, a rocket component, a marine craft component, a railcar component, an automotive vehicle component, a chemical processing component, a turbine component, or a space vehide.compGhent, [001.13] in one embodiment, the article may exhibit a resulting Substantiaify homogeneous microstructura, which is obtained throughout at least about 50% (and more, preferably at least dboUb80%),of a section thickness of fho article, For example, the:article may be a substantially, homogeneous microstructure having a plurality of columnar grains that Is obtained throughout at least about 50% (and more preferably at least about 80%) of a section thickness of the-article. 35 2017204522 30 Jun2017 [00114] [e,g,( grater than 7S0 em3) may be metallic and may be made (e.g., the processes being completed) in a period of less thanabout 156 hours (&amp;·§., lass than about 100 hours, preferably (ess.than about SO hours, or even more preferably less than about 20 hours) for each article. Theartide may be prepared directly from computer-aided design data, The article of manufacture may have an overall weight of at least about 10 kg, and may be made ip a period of less: than about 20 hours: For example, art article weighing about 60 to about 150 kg (or more) may be made in a period of no longer than about 20 hours.

[0011:3] The article may be prepared using a process, apparatus, or both that may be: free of a laser, prepared from a continuous deposition, of each individual layer, prepared from an fntermftterit.depositidn of each individual layer, prepared in the absence of processing condition adjustment by a humanduring layer by layer buildup, or any. wmbinatiqnlhereof. it may befree of an ultrasonic detection method.

[00116] Any depositing step may be performed so that the molten pool deposit undergoes a substantially eontinupus. change in lhermal condition in.three-dimensions throughout the process, The. steps may be performed at a rate sufficient to deposit successive Idyers atiebst about 2,5 kg of the raw material per hour, preferably at least 3 kg per. hour (e.g., about 3.3 to about 6,8 kg per hour). The steps may be-performed ata rate sufficafeht to.deposit the raw materiel as a plurality of beads that define successive layers having an average-bead width of about 10 to about 15 mm (e.g., about 12.7 mm) at a. rate Of -at least about.25 cm of bead per minute (e.g,, about 35 to 80 cm per minute or higher), the process;may be: interrupted for a period (e.g., of at feast one-minute, one hour, two hours, one day, or longer) prior to completion of the work piece,-and. may be resumed after cpmplete eolidlSGatibn of the work piece has occurred. {00117] Any material delivery device may include a wire-feed device (e,g. a wire guide 26) that includes a plurality of opposing spaced apart rollers that advances a Wire feedstock.

Any detector or sensing device may include a mechanism that intermittently acquires .data about deposited material (e.g., at a rate faster than about 25 images per second). Any bbtectoror sensing device may include a shutter mechanism located within an evacuated chamber that reduces exposure of the detector to vapors from foe raw material. {001,18] The fallowing process steps and features may be .employed With any of the embodiments or devices taught herein, the following features may be employed separately or In combiriatlon with any of the embodiments taught herein. The process may use a row material that includes a metal selected from one or any combination or alloy of. metals selected from titanium, aluminum, iron, inconel, cobalt, stainless steel, niobium, tantalum, Popper, bronze, 36 2017204522 30 Jun2017 brass, beryllium copper, of tungsten. The.process may be interrupted for e period {«-.g., of at (east one minute, one hour, tyro hours, one day, or longer)’ prior to completion of the work piece, and Is resumed after complete solidification of the: work piece has occurred. The 'monitoring step may include, employing as the image generating device,, a digitai capTeira, a charged coupled device.(CCD), a complementary metal oxide semiconductor (CMOS), or a combination thereof and includes generating images substantially «treat time at a rate of at least 25 frames per second. The monitoring step may include monitoring a condition associafedwith the molten pool deposit1 from a location substantially overhead of themolten poof deposit,: and' optionally the condition is selected from bulk average temperature of the molten pool deposit, temperature gradient within the molten pool deposit, surface topography of the molten pool deposit, the presence of any liquid-solid interface in the molten pool deposit, surface profile of the moiten pooi deposit, chemical analysis of the molten pool deposit, or any combination thereof. A preselected condition of the monitored molten pool deposit may be a predetermined value that Is stored in memory of a computer processing systemv the preseiecfed condition of the monitored moiten pool deposit is a value of a previously measured molten pool deposit of the samp or a different work piece, or both. The step of automatically altertrig^the first processing condition to a different processing 0ndition includes altering;one: or more conditions selected from the location of any device for supplying energy to melt the raw material; the location of any deyice used for feeding the raw materia!; the locatloh of any platform upon which a work piece; is built; the pressure of any environment in which the processing Is performed; the temperature of any environment in which the processing is performed; the voltage and/or current supplied to melt the raw material; the beam. used for iahy electron beam source of energy for melting the raw material (e.s.,-b^dwging,^e-poi^t&amp;.®5fwiigtei%#-|)^rtu the-beam ysdfii, dr both); the feed rate of the raw material; the feed angle of the raw material;· the composition of the deposited material; changing the temperature of the work piece; the temperature of the platform; or any combination thereof, The Information obtained from any monitoring step may be stored in themOfy and optionally is used subsequently to repair or replace a portion of the work piece, £001193 The following process steps and’ features may besernployed with any of the embodiments or devices taught herein The following features'may be employed separately .or hi combination with any of the embodiments taught herein. The process may further comprising the step of repairing a damaged portion of the work piece by locating a stored monitored location that is relative to the damaged portion of the work piece; changing the preselected value to the stored monitored value; depositing melted raw material at the damaged portion while monitoring the deposited materia! until d second moniiored value is. detemiinerf that:is the 37 2017204522 30 Jun2017 sarrie as the praseieGtad -vaiuei -ahti advancing the deposition of .melted raw material until a second monitored value is determined that is the same as the preselected value. The monitoring step may include, a step of protecting at least one exposed optical component of a detector from vapor disposition build-up onto the exposed componentry, s© that the vapor does not build up and adverfelyaffeGt measurement integrity; The monitoring step may include a. step of codilhg a detector by flowing a fluid in a h0us1ng .ftf .tfe detector for rftmowng Heat from the detector and the housing is separate and Spaded apart from any block with an aperturft of any vapor protection device. The process may further: comprise a step Of aligning components of an apparatus for performing the process using an alignment fixture. The step of monitoring· may include a step of obtaining an optical image from a point of view that is substantially overhead of;the rneif deposit. The step of obtaihlng an optical Image wherein the substantially overhead view of the molten poof deposit IS generally shaped to include a generally C-shaped portion with a generally cimuiar or elliptical shaped portion, which corresponds to an image of the feed material, that is. within the C-shaped portion, and possibly extending outside the opening Of the Oshaped portion, (it) the step of automaticatiy altering includes changing a process condition, so that the shape of the image is subsmntialjy axially symmetrical; or both (i) and; (ii). The orientation ftf any feed of the raw materiaj may fee automatidally changed in response to information obtained during the monitoring step.

[0012¾ The foliowing features of the camera cooled housing may fee employed With any of the embodiments taught herein. The following features may be employed: separately or .in combination With any of the embodiments taught herein. The eddied housing may include a front flange', seals, spacers, and back flange that are connected together by a fastening device, and the printed circuit boards are attached to the spacer by a connection device. The rear flange may include an opening for receiving an energy source. The coded housing may include; (i) the mount adapter is located in the center of the front flange, (ii) the mount adapter is secured in the front flange Using a plurality of pins; or (iii) both (1) and (if). The cooled housing may include; a.front flange, spa^m, seals,.and rear flahge that am generally rectanguiar» shaped:. The housing may have a height to-width' aspad ratio of about 2 to T, preferably about' 1,5 to 1, and more preferably about 1 to 1.2, The inlet and outlet may be located on opposite' sides of the front. flange in generally opposing facing relationship to each other. The'-cooled housing may include; (i) the, spacers and seals include one or more, heat sinks;: (ii) one or more of the seals conduct, heat; or both (i) and (ii). The cooied housing may include: a thermally conductive (e.g., at least about 2 VWni-K per ASTP 0225)4) polymeric-based interface seal is employed between the flanges, andoptionally wherein the interface seal, includes a relatively 38 2017204522 30 Jun2017 rigid polymeric (e,g,r acrylic) elastomer surface layer haying.:a relatively tow tack surface, and an undertying relatively flexible polymeric (e.g., acrylic) support layer having a.relatively tow tack surface that may; be,more tacky than the surface layer.. The camerafoooted housing may be used in any of the process steps described herein.

[00121} The followng features of the vapor protection device may be employed with any of the embodiments taught herein·. The following features may be employed separately or in combination With any of the embodiments taught herein, The vapor pretedtoh device may include a gas supply conduit connected with the at least one fluid port tor supplying the.gas stream. The base portion and the. cover portion may be separable from each ether for accessing a flow chamber defined in the block and through which the gas stream is flowed. The vapor protection device may include a protective window, which is optionally edge seated by opposing spaced seals, is housed in the base portion between'the apertures of the cover portion and the base portion arid the reflective substrate. The at least one fluid port may be defined by an elongated bore formed in a side wai! of the base portion, -and the bore has a longitudinal axis generally in .the direction of elongation. The longitudinal axis of the elongated bore is substantially parallel· with the· optical path of an image between the reflective substrate and a camera.. TbO'yapcr protod&amp;dn'^evipe'^ughta. ceded herein. The:vapor protection devicehiay be carried, Oh a, common frame as with the cooled housing, but is spaced apart from the cooled housing so that the vapor protective device is located generally overhead of the molten pool deposit while the Cooled housing is longitudinally' separated from the vapor protective device .and any gas supply line for the vapor protection device is free of connection with the copied housing.. The common frame may include a plurality of spaced apart elongated members along which the cooied housirig., the-vapor protection device or both may be mounted for adjustable and slidable translation relative to each other,

The vapor protection, device may be used in any of the process steps discussed herein.

[00122) Tlie fol lowing features of the alignment fixture may fee employed with arty of the embodiments taught herein. The following features may be employed separately or in combination with any of toe embodiments fought, herein. The alighfhent fixture may include support structure has a perimeter that defines an interior region that is accessible from at ieast one side of the support structure, The alignment fixture may include: fi) the base 'portion, includes a base member that is a plate; («) the guide surface portion1 includes at least one generally upright, guide member; or both (if.) and: 0i}. The-aiignment fixture may include;; {J), the at least one' generally upright guide member is a shaft;' (ii) the at 'teaft on© generally upright.guide member is temporarily or permanently mounted: to the babe member; or both (ifarid (ii). The 39 2017204522 30 Jun2017

Work piece '6up'portsirnHJa{0k;m^y;1hte)yd.ta.Tnem^r^tis-m©Urfted on the at least one generaliy upright guide member and is glidingiy translated on the guide member. The alignment fixture may include at least one plate having an opening through which the at iedst one .generally upright guide, member passes. The alignment fixture may include one or,mere suitable bearings for allowing translation, which optionally may fee linear hearings disposed above or below the mounted member. The-alignment fixture may include at least one position adjustable device that interferes With translation of the work piece support simuiatori 'which pptjonaiiymay. be a collar that at least partially surrounds at least one of the generaliy upright guide members, The alignment fixture; may inelude a plate having at least one target alignment feature defined thereon for simulating a GharacteustiC ipf: the wprk piees;;support,,e; work piece oh tHesupport, or both.· The alignment-fixture may be used with anygf the teachings of the cooled camera housing, -the vapor protection device, offedth. The alignment fixture may be used with dny of the process steps discussed, herein.

[00123] The following features of the apparatus for layer manufacturing: a three- dimensionai article may berempipyed with any of the embodiments taught herein, the following features may be employed separately of in combination With any ofifee embodiments taught herein. The material delivery' device includes a wire feed device thaf includes a ^lurslity of opposing spaced apart rollers that advances a wire feedstock. The apparatus includes a detector that consists essentially..-of acamera that acquires images that are substantially overhead of the molten pool deposit at a rate of at least about 2S frames per second. The. apparatus may be used with a cooied camera housing, a vapor .protection device, an alignment fixture, or a combination thereof. The apparatus may be used td perform any of the process steps described herein. The apparatus may assembled using ah alignment fixture described herein. The apparatus ;may be used to manufacture an angina! equipment component a repaired original equipment: component, or a replacement componentmade using the process described; herein.

[00124] The foil owi ng features of an article of manufacture may be manufactured, using any of the embodiments taught herein. The following features may be employed separately or. in-combination with any of the embodiments taughthereir». The article of manufacture: may fee heat-treated .subsequentfo Its layer fey layer manufacture. The article may.'be an aircraft component,- a rocket component, a marine craft component, a railcar component, an automotive vehicle component, a chemical processing component, afurhihe t»mponentv or a space vehicle component; and wherein the article is metallic. 40 2017204522 30 Jun2017 [001253 Structural relations, proportions,, dimensions and geometries shown in the accompanying drawings-ard part of the teachings herein, even if not arficulated verbally in the present detailed description. The teachings herein also contempiste variations to any relative proportidns-aRd dfedriSions shown irtthe drawings; e.g,, variatiohs within about £ 1Q%, about i 25%, or eventeouii:,ijd% are possible, [0012¾ Unies^otherwise stated, ail ranges Include both ehdpoints'and all numbers between the endpoints, The useof “abouf pr “approximately” 1¾ connection with b rpoge applies to both ends of the, range. Thus, “about 20 to 30” is intended to cover “about 20 to about :30”, inclusive of at least the specified endpoints. The specification of ranges Herein also contemplates individual amounts falling within the range. Thus, for example, a range of 1Q to 1S contemplates individually the amounts of 10,. 11,12,1.3, 14, and 15, £00127] The disclosures of ait adicies and references, including paterit applications and, publications, are incorporated by reference- for all purposes. References to the tpifri “consisting, essentially of" to describe a,combination shall include the elements, ihgredieritSi components dr steps identified, and such other elements ingredients, components or steps that do not materially affect the basic and novel characteristics of the. combination. The use of the terms "comρΠείηρ” or "including" to describe combinations of elements, ingredients, components or steps herein- also contemplates embodiments tel cdnSsst essentialjy of; or even consist of, the elements, ingredients, components or steps. |0Q128j Plural elements, ingredients. Components, or steps cah be provided by a single' integrated element, ingredient, compdhertt, or step. Alternatively, a:single iniegmted element, ingredient, component or step might be divided into separate plural elements, ingredients, components Or steps. The disclosure of “a” or “One" to describe-a;n elerri^rtt*. ingredient,, component or step is not Intended to foreclose additional e(enTents, :ingrediahtSi ;compQrientS.Or steps, Likewise, any reference to “first” or “second' items is not intended to foreclose additional items (e.g,, third, fourth, or more items);·.sach addliional items are also eohtempiaied, unless otherwise stated. Any references herein to elements or metals belbngingTo a certain ©roup refer to the Periodic Table of the Elements pubpsjied.arid copyrighted by CR© Press, (ne,„1989; Ah.y reference to the Group or Groups shall be to the Group or Groups as reflected in this Periodic Table of the Elements using the iUPAG system for numbering groups.

[00129] The teachings of the relative positions, orientations, and proportions of components depicted in the accompanying drawings also form .part of the teachings herein even if not expressly stated. 41 2017204522 30 Jun2017 J00130) It .is understood that the above description is intended to be illustrative and not restrictive. Many embodiments as well as many appiicaitons.besides, the examples provided will be apparent to those of skill in the art upon reading the above description. :lf is furtfierlntended' that any combination of the features of different aspeets or embodiments of the invention may ba combined. The scope of the invention, should, therefore, be determined not with reference to the above description, but should instead be .determined with reference, to the .appended claims, along with the full scope of equivalents tp which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are Incorporated by reference for all purposes. The omission in the following claims of any aspect of subject matter that; is disclosed herein is not a disdaimerof such subject matter, nor should it be regarded that the inventors did not. consider such subject matter to be part of the disclosed inventive ^subject matter; 42

Claims (20)

1. An apparatus for layer manufacturing a metallic three-dimensional work piece, comprising: a) a housing defining a chamber capable of evacuation and within which the metallic three-dimensional work piece is formed layer by layer from a plurality of successively deposited molten pool deposits, the housing enclosing: A. a plurality of wires fed from one or more material delivery devices; B. an electron beam gun that melts the plurality of wires; C. a table upon which the metallic three-dimensional work piece is formed, the table and the electron beam gun being adjustably spaced relative to each other so that as the metallic three-dimensional work piece is formed layer by layer from the plurality of successively deposited molten pool deposits, the spacing incrementally increases; D. an optical assembly including: i. a first enclosure, ii. optics housed in the first enclosure, iii. an aperture in a wall of the first enclosure for allowing access, into the first enclosure, of light emitted by the plurality of successively deposited molten pool deposits so that the light reaches the optics, and iv. a vapor protection device that substantially avoids build-up of metal vapor on the optics during operating of the apparatus; E. an imaging device including: i. a detector array, ii. thermally regulated electronic componentry, and iii. a second enclosure that substantially encloses the detector array and the thermally regulated electronic componentry, and also includes an opening through which light that is emitted by the plurality of successively deposited molten pool deposits can communicate with the detector array; and F. a frame that carries the enclosures of the optical assembly and the imaging device in spaced apart relation from each other so that the aperture of first enclosure is substantially overhead of the plurality of successively deposited molten pool deposits, and the first and second enclosures are separated from each other; b) a closed loop control device configured to automatically adjust one or more processing parameters of the apparatus in response to data obtained from the imaging device.

2. The apparatus of claim 1, wherein the vapor protection device, includes: (a) a block that includes a base portion and a cover portion, the base portion including at least one fluid port that receives a gas stream that is controllably regulated, the base portion and the cover portion each having an aperture that is generally axially aligned with each other and is adapted to be axially aligned substantially overhead of the plurality of successively deposited molten metal pool deposits; wherein the gas stream enters the at least one fluid port and exits the block through one of the apertures, and provides an optically transparent protective barrier to prevent passage of metal vapor through one of the apertures.

3. The apparatus of claim 2, wherein the system includes a gas supply conduit connected with the at least one fluid port for supplying the gas stream.

4. The apparatus of claim 2, wherein the base portion and the cover portion are separable from each other for accessing a flow chamber defined in the block and through which the gas stream is flowed.

5. The apparatus of claim 1, wherein the detector array is located in a cooled camera housing comprising: a front flange; at least one spacer pad connected to the front flange ; at least one seal adjoining the spacer pad; a rear flange connected to the front flange and sandwiching therebetween the at least one spacers and seals; Wherein the front flange, the at least one seal, the at least one spacer pad, and the rear flange form an interior cavity; one or more printed circuit boards located within the interior cavity; and an image detector.

6. The apparatus of claim 5, wherein the front flange, seals, spacers, and back flange are connected together by a fastening device, and the printed circuit boards are attached to the spacer by a connection device.

7. The apparatus of claim 5, wherein the cooled camera housing includes a mount adapter and (i) the mount adapter is located in the center of the front flange, (ii) the mount adapter is secured in the front flange using a plurality of pins; or (iii) both (i) and (ii).

8. The apparatus of claim 5, wherein (i) the spacers and seals include one or more heat sinks; (ii) one or more of the seals conduct heat; or both (i) and (ii), and a thermally conductive polymeric-based interface seal is employed between the flanges.

9. The apparatus of claim 5 wherein the frame includes a plurality of spaced apart elongated members along which the Cooled housing, the vapor protection device or both is mounted for adjustable and slidable translation relative to each other.

10. The apparatus of claim 2, wherein the detector array is located in a cooled camera housing comprising: a front flange; at least one spacer pad connected to the front flange ; at least one seal adjoining the spacer pad; a rear flange connected to the front flange and sandwiching therebetween the at least one spacers and seals; wherein the front flange, the at least one seal, the at least one spacer pad, and the rear flange form an interior cavity; one or more printed circuit boards located within the interior cavity; an image detector; and wherein at least one of the flanges includes an inlet, an outlet, a fluid passage between the inlet and the outlet through which a heat exchange fluid is passed for cooling the printed circuit boards during their operation.

11. The apparatus of claim 10, wherein the image detector is a digital camera, a charged coupled device, a complementary metal oxide semiconductor, or a combination thereof, and generates images substantially in real time at a rate of at least about 25 frames per second.

12. The apparatus of claim 11, wherein a predetermined condition that is monitored is selected from bulk average temperature of the plurality of successively deposited molten pool deposits, temperature gradient within the plurality of successively deposited molten pool deposits, surface topography of the plurality of successively deposited molten pool deposits, the presence of any liquid-solid interface in the plurality of successively deposited molten pool deposits, surface profile of the plurality of successively deposited molten pool deposits, chemical analysis of the plurality of successively deposited molten pool deposits, or any combination thereof.

13. The apparatus of claim 12, wherein the closed loop electronic control device controls one or more components of the apparatus by altering one or more process conditions selected from a location of any device for supplying energy to melt the plurality of wires; a location of any device used for feeding the plurality of wires; a location of any platform Upon which a work piece is built; pressure of any environment in which the processing is performed; temperature of any environment in which the processing is performed; voltage and/or current supplied to melt the plurality of wires; a beam used for any electron beam source of energy for melting the plurality of wires; feed rate of the plurality of wires; feed angle of the plurality of wires; composition of the deposited material; changing a temperature of the work piece; temperature of the platform; entry location of the plurality of wires, beam raster pattern, or any combination thereof.

14. The apparatus of claim 1, wherein the plurality of wires are a same material type.

15. The apparatus of claim 1, wherein the plurality of wires are a different material type.

16. The apparatus of claim 1, wherein the plurality of wires are fed from the one or more material delivery devices at one or more angles and/or distances from the plurality of successively deposited molten pool deposits.

17. The apparatus of claim 1, wherein the one or more material delivery devices are a plurality of material delivery devices and the plurality of wires are fed from the plurality of material delivery devices.

18. The apparatus of claim 16, wherein the detector array monitors an entry location of the plurality of wires.

19. A process for layer manufacturing a three-dimensional work piece with the apparatus of claim 1, wherein the process includes the steps of feeding the plurality of wires from a plurality of delivery devices at one or more angles and/or distances from the plurality of successively deposited molten pool deposits and adjusting the angles and/or the distance of the plurality of wires relative to the plurality of successively deposited molten pool deposits.

20. The process of claim 19, wherein the method includes a step of rastering the electron beam in a pattern.