AU2011244953B2 - Wedge lock for use with a single board computer and method of assembling a computer system - Google Patents

Wedge lock for use with a single board computer and method of assembling a computer system Download PDF

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Publication number
AU2011244953B2
AU2011244953B2 AU2011244953A AU2011244953A AU2011244953B2 AU 2011244953 B2 AU2011244953 B2 AU 2011244953B2 AU 2011244953 A AU2011244953 A AU 2011244953A AU 2011244953 A AU2011244953 A AU 2011244953A AU 2011244953 B2 AU2011244953 B2 AU 2011244953B2
Authority
AU
Australia
Prior art keywords
single board
board computer
move
force
accordance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
AU2011244953A
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English (en)
Other versions
AU2011244953A1 (en
Inventor
Bernd Sporer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abaco Systems Inc
Original Assignee
Abaco Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abaco Systems Inc filed Critical Abaco Systems Inc
Publication of AU2011244953A1 publication Critical patent/AU2011244953A1/en
Application granted granted Critical
Publication of AU2011244953B2 publication Critical patent/AU2011244953B2/en
Assigned to GE Intelligent Platforms Embedded Systems, Inc. reassignment GE Intelligent Platforms Embedded Systems, Inc. Request for Assignment Assignors: GE INTELLIGENT PLATFORMS, INC.
Assigned to ABACO SYSTEMS, INC. reassignment ABACO SYSTEMS, INC. Request to Amend Deed and Register Assignors: GE Intelligent Platforms Embedded Systems, Inc.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
AU2011244953A 2010-11-04 2011-11-03 Wedge lock for use with a single board computer and method of assembling a computer system Active AU2011244953B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/939,208 US8233279B2 (en) 2010-11-04 2010-11-04 Wedge lock for use with a single board computer and method of assembling a computer system
US12/939,208 2010-11-04

Publications (2)

Publication Number Publication Date
AU2011244953A1 AU2011244953A1 (en) 2012-05-24
AU2011244953B2 true AU2011244953B2 (en) 2013-06-27

Family

ID=44862827

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2011244953A Active AU2011244953B2 (en) 2010-11-04 2011-11-03 Wedge lock for use with a single board computer and method of assembling a computer system

Country Status (9)

Country Link
US (1) US8233279B2 (https=)
EP (1) EP2451261B1 (https=)
JP (1) JP5926535B2 (https=)
KR (1) KR101300422B1 (https=)
CN (1) CN102609056B (https=)
AU (1) AU2011244953B2 (https=)
CA (1) CA2756902C (https=)
MX (1) MX2011011761A (https=)
TW (1) TWI548327B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8559178B2 (en) * 2010-10-11 2013-10-15 Lockheed Martin Corporation Cardlock clamp
US10928139B1 (en) 2013-08-16 2021-02-23 Advanced Cooling Technologies, Inc. Assembly and process for heat transfer with three surfaces
US10129996B2 (en) * 2016-03-02 2018-11-13 Creare Llc High-pressure card locks for maximizing heat transfer from electronics cards to card cages
US10433464B1 (en) * 2016-06-06 2019-10-01 ZT Group Int'l, Inc. Air duct for cooling a rear-mounted switch in a rack
JP6828903B2 (ja) * 2018-04-23 2021-02-10 合同会社スイッチオン シングルボードコンピュータ用アダプタ
US11540424B2 (en) * 2018-09-14 2022-12-27 Mitsubishi Electric Corporation Electric power converter
US12557231B2 (en) 2023-12-12 2026-02-17 Bae Systems Information And Electronic Systems Integration Inc. Two-piece separable wedge clamp for thermal mechanical interface
CN117412544B (zh) * 2023-12-15 2024-11-26 成都奇航系统集成有限公司 锁紧条

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4819713A (en) * 1987-04-23 1989-04-11 Calmark Corporation Retainer for electronic modules
US4909752A (en) * 1989-03-31 1990-03-20 Honeywell, Inc. Circuit card retainer
US5162979A (en) * 1989-10-23 1992-11-10 International Business Machines Corp. Personal computer processor card interconnect system
JPH0379496U (https=) * 1989-12-06 1991-08-13
US4994937A (en) 1989-12-22 1991-02-19 Lockheed Corporation Hydraulic thermal clamp for electronic modules
US5220485A (en) * 1990-04-18 1993-06-15 Harris Corporation Heat removing edge guide system and related method
US5141592A (en) * 1990-08-20 1992-08-25 Denco, Inc. Sterile entry/exit total containment process for closed systems using plastic tubes
DE4028003A1 (de) * 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
US5200882A (en) 1992-01-17 1993-04-06 International Electronic Research Corporation Circuit board retainer
JPH07221479A (ja) * 1994-02-08 1995-08-18 Mitsubishi Electric Corp 電子機器
US5892658A (en) * 1998-05-12 1999-04-06 Lockhead Martin Corporation VME eurocard triple printed wiring board single slot module assembly
US6246582B1 (en) 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6212075B1 (en) * 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
IL130775A (en) * 1999-07-02 2007-03-08 Elta Systems Ltd Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling
US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6721182B1 (en) * 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6678159B1 (en) 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
US7988033B2 (en) * 2007-09-25 2011-08-02 Silverbrook Research Pty Ltd Method of reducing wire bond profile height in integrated circuits mounted to circuit boards
EP2061296B1 (en) * 2007-11-16 2014-05-14 GE Aviation Systems LLC Conduction cooled circuit board assembly
JP4941914B2 (ja) 2007-11-28 2012-05-30 多摩川精機株式会社 カード検出装置
TWM390208U (en) * 2010-05-19 2010-10-11 Xiang-Dun Yu Manual engraving fixture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock

Also Published As

Publication number Publication date
EP2451261A3 (en) 2014-04-02
CA2756902A1 (en) 2012-05-04
KR101300422B1 (ko) 2013-08-26
US20120113589A1 (en) 2012-05-10
JP2012099817A (ja) 2012-05-24
CA2756902C (en) 2014-02-25
TW201242495A (en) 2012-10-16
TWI548327B (zh) 2016-09-01
AU2011244953A1 (en) 2012-05-24
JP5926535B2 (ja) 2016-05-25
CN102609056B (zh) 2015-11-25
EP2451261B1 (en) 2016-07-06
EP2451261A2 (en) 2012-05-09
MX2011011761A (es) 2012-05-22
US8233279B2 (en) 2012-07-31
CN102609056A (zh) 2012-07-25
KR20120047831A (ko) 2012-05-14

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Legal Events

Date Code Title Description
FGA Letters patent sealed or granted (standard patent)
PC Assignment registered

Owner name: GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC.

Free format text: FORMER OWNER WAS: GE INTELLIGENT PLATFORMS, INC.

HB Alteration of name in register

Owner name: ABACO SYSTEMS, INC.

Free format text: FORMER NAME(S): GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC.