AU2009202013A1 - Thermal Dispersing Structure for LED or SMD LED lights - Google Patents

Thermal Dispersing Structure for LED or SMD LED lights Download PDF

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Publication number
AU2009202013A1
AU2009202013A1 AU2009202013A AU2009202013A AU2009202013A1 AU 2009202013 A1 AU2009202013 A1 AU 2009202013A1 AU 2009202013 A AU2009202013 A AU 2009202013A AU 2009202013 A AU2009202013 A AU 2009202013A AU 2009202013 A1 AU2009202013 A1 AU 2009202013A1
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Australia
Prior art keywords
led
light
thermal
smd
lamp
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AU2009202013A
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AU2009202013B2 (en
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Wen-Sung Hu
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Priority to AU2009202013A priority Critical patent/AU2009202013B2/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69Details of refractors forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

P/00/0 11 Regulation 3.2 AUSTRALIA Patents Act 1990 COMPLETE SPECIFICATION FOR A STANDARD PATENT ORIGINAL TO BE COMPLETED BY APPLICANT Name of Applicant: Wen-Sung Hu Actual Inventor(s): Wen-Sung Hu Address for Service: A.P.T. Patent and Trade Mark Attorneys PO Box 222, Mitcham, SA 5062 Invention Title: Thermal dispersing structure for LED or SMD LED lights The following statement is a full description of this invention, including the best method of performing it known to me/us:- 1 THERMAL DISPERSING STRUCTURE FOR LED OR SMD LED 2 LIGHTS 3 BACKGROUND OF THE INVENTION 4 1. Field of the Invention 5 The present invention relates to a thermal dispersing structure, and 6 more particularly to a thermal dispersing structure applied to LED or SMD 7 LED lights. 8 2. Description of Related Art 9 Theoretically, light emitting diode (LED) is a light source has longest 10 lifespan, lowest heat, lowest chemical pollution and electricity consumption 11 so that application of LED is the major trend of present illumination having 12 environmental and energy-saving efficiency. 13 However, taking LEDs to make a conventional bulb still has some 14 drawbacks as below: is 1. The conventional LED bulb is a spot light source and thus usually 16 performs halation phenomenon. Unlike halide bulb and tungsten bulb which 17 are line light sources or high-pressure sodium lamp or fluorescent lamp (such 18 as fluorescent light tube, compact fluorescent lamp), HID bulbs which are 19 activated by sodium, mercury or xenon elements to perform planar light 20 source, the spot light source of LED causes uneven LUX with great drops to 21 the projecting surfaces it projects thereto and has poor illumination 22 uniformity in comparison with the fluorescent light tube, compact 23 fluorescent lamp and tungsten bulb especially serving as reading lights (as 24 shown in Figs. 1 to 4). 2 1 2. The conventional LED illumination lights all embed one or 2 multiple LED units into one or multiple V-shaped recesses in a heat sink base. 3 Although the V-shaped recesses adjust the projecting angles of the light from 4 LED units, wide-angle light is also interrupted and transformed to refraction 5 light. In other words, light from LED spot light source out of direct light 6 range within the V-shaped recess will be refracted by sidewalls therein to 7 cause irregular and uneven fraction light which also damps the uniformity in 8 illumination (as shown in Figs. 5 and 6). 9 3. The conventional LED bulbs or lamps with high lumens all need 10 heat sink base to disperse heat, wherein LED lamps having low watts (take 11 1W as an example) can sufficiently disperse or conduct heat by attaching 12 heat sink base (as shown in Figs. 5 and 6). However, LED lamps having high 13 watts (for example, 3W or 5W) or a small substrate collecting multiple 1W 14 LED units can not sufficiently disperses the high heat even by attaching the is heat sink base made of copper or aluminum boards. Therefore, the 16 conventional LED lamps cannot protect the LED units with chips within the 17 limitation temperature (60 to 65 0 C) to decrease their decay and thus to 18 stabilize their lifespan. 19 For the purposes of this specification the word "comprising" means 20 "including but not limited to", and the word "comprises" has a corresponding 21 meaning. Also a reference within this specification to a document is not to 22 be taken as an admission that the disclosure therein constitutes common 23 general knowledge in Australia. 24 SUMMARY OF THE INVENTION 3 1 A main objective of the present invention is to provide a thermal 2 dispersing structure for LED or SMD LED lights that has excellent heat 3 dispersing efficiency. 4 To achieve the foregoing objective, the thermal dispersing structure 5 comprises: 6 a lamp base being a funnel shape mounted on the lamp head and 7 having an enlarged top edge with an annular cutout defined near the enlarged 8 top edge; 9 a substrate engaged the annular cutout and having at least one LED 10 or SMD LED units each with at least one thermal conducting base and at 11 least one hole defined on the substrate to receive the at least one thermal 12 conducting base correspondingly; and 13 a thermal dispersing body attached under the substrate and having at 14 least one post penetrating a corresponding one of the at least one hole to 15 engage a corresponding one of the at least one thermal conducting base. 16 Further benefits and advantages of the present invention will become 17 apparent after a careful reading of the detailed description with appropriate 18 reference to the accompanying drawings. 19 BRIEF DESCRIPTION OF THE DRAWINGS 20 Fig. 1 is a schematic drawing showing the light uniformity rate of a 21 fluorescent light tube from side and corresponding top in accordance with the 22 prior art; 23 Fig. 2 is a schematic drawing showing the light uniformity rate of a 24 tungsten bulb from side and corresponding top in accordance with the prior 4 1 art; 2 Fig. 3 is a schematic drawing showing the light uniformity rate of a 3 helical compact fluorescent lamp from side and corresponding top in 4 accordance with the prior art; 5 Fig. 4 is a schematic drawing showing the light uniformity rate of a 6 LED lamp from side and corresponding top in accordance with the prior 7 art; 8 Fig. 5 is a schematic side drawing showing the light projection of a 9 LED unit within a V-shaped recess of a heat sink in accordance with the prior 10 art; 11 Fig. 6 is a schematic side drawing showing the light projection of a 12 LED unit within one of multiple V-shaped recesses of a heat sink in 13 accordance with the prior art; 14 Fig. 7 is a cross-sectional side view of a thermal dispersing structure is for LED or SMD LED lights served as a spotlight in accordance with the 16 present invention; 17 Fig. 8 is an exploded perspective view of the LED unit, substrate and 18 thermal dispersing body in accordance with the present invention; 19 Fig. 9 is a cross-sectional side view of a thermal dispersing structure 20 for LED or SMD LED lights served as a wide-angle light in accordance with 21 the present invention; 22 Fig. 9-1 is cross-sectional view of the thermal dispersing structure 23 mounted on a fluorescent light tube; 24 Fig. 9-2 is cross-sectional view of the thermal dispersing structure 5 1 mounted on a dual-socket light tube; 2 Fig. 10 is a partially cross-sectional view of a planar connector of an 3 adjusting lens to combine with a convex; 4 Fig. 11 is a schematic cross-sectional view showing the radial 5 dispersion of the thermal dispersing body and a post combined into a set; 6 Fig. 12 is a partially cross-sectional view of the thermal dispersing 7 structure showing a rim around multiple LED units or multiple SMD LED 8 units; 9 Fig. 12-1 is a top view of the thermal dispersing structure showing 10 the rim around the multiple LED units or the multiple SMD LED units; 11 Fig. 13 is a cross-sectional side view of a metal socket in accordance 12 with the present invention; 13 Fig. 14 is a schematic drawing showing LUX and light uniformity 14 rate of LED or SMD LED lamp in accordance with the present invention; 15 Fig. 15 is a schematic drawing showing LUX and light uniformity 16 rate of LED or SMD LED lamp with a convex lens served as a wide-angle 17 light in accordance with the present invention; 18 Fig. 16 is a schematic drawing showing LUX and light uniformity 19 rate of LED or SMD LED lamp with a concave-convex lens served as a 20 wide-angle light in accordance with the present invention; 21 Fig. 16-1 is a schematic drawing showing LUX and light uniformity 22 rate of LED or SMD LED lamp with a concave-convex lens served as a 23 spotlight in accordance with the present invention; 24 Fig. 17 is a cross-sectional side view of the thermal dispersing 6 1 structure attached to a singular light of a car lamp; 2 Fig. 18 is a cross-sectional side view of the thermal dispersing 3 structure attached to a car headlamp combination; 4 Fig. 18-1 is a cross-sectional side view of the car headlamp 5 combination along line A-A'; 6 Fig. 19 is a cross-sectional side view of the thermal dispersing 7 structure attached to a two-way projection light; 8 Fig. 19-1 is a cross-sectional side view of the two-way projection 9 light; 10 Fig. 20 is a cross-sectional side view of the thermal dispersing 11 structure attached to a road light or a decorative projecting lamp; 12 Fig. 20-1 is a bottom view of the road light or the decorative 13 projecting lamp; and 14 Fig. 20-2 is a cross-sectional side view of the road light or the 15 decorative projecting lamp. 16 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 17 A thermal dispersing structure for LED or SMD LED lights in the 18 present invention is to mount a lamp base at a light head. The lamp base is 19 funnel-shaped and has an interior annular cutout near its top edge. A 20 substrate engages the annular cutout to carry one or multiple LED or SMD 21 (surface-mount device) LED units at a center or other proper locations. 22 Moreover, a rim is formed on the substrate around the LED or SMD LED 23 units. The substrate has multiple holes defined corresponding to thermal 24 conducting bases under the LED or SMD LED units and defined slightly 7 1 larger or smaller than the LED thermal conducting bases. Additionally, a 2 thermal dispersing body is secured under the substrate and has multiple posts 3 corresponding to the holes of the substrate. Each post penetrates the substrate 4 to snugly engage one thermal conducting base so that thermal dispersing 5 efficiency is improved. 6 As shown in Figs. 7 and 9, a preferred embodiment of the thermal 7 dispersing structure is to mount a lamp base 2 to a lamp head 1 which has a 8 vertoro driver 11. The lamp base 2 is funnel-shaped and has an enlarged top 9 edge and an annular cutout 21 defined near the enlarged top edge inside the 10 lamp base 2. A substrate 3 is received inside the annular cutout 21 and has at 11 least one LED or SMD LED units 31 at its center or other proper locations 12 thereon. The substrate 3 has multiple holes 32 corresponding to multiple 13 thermal conducting bases 311 under the LED or SMD LED units 31. 14 Moreover, a thermal dispersing body 4 is secured under the substrate 3 and is is made of conductive material in any shapes or size. The thermal dispersing 16 body 4 in Fig. 8 has multiple posts 41 with high thermal conductive 17 efficiency penetrating the holes 32 corresponding to the thermal conducting 18 bases 311 of the LED or SMD LED units 31. Each post 41 has a height 19 slightly higher than a thickness of the substrate 3 and has an outer diameter 20 slightly smaller than an inner diameter of a corresponding hole 32 of the 21 substrate 3. Moreover, the periphery of the posts 41 is coated with thermal 22 conductive glue and the thermal dispersing body 4 is secured on the substrate 23 3. As shown in Figs. 12 and 12-1, a rim 33 is formed on the substrate 3 24 around the LED or SMD LED units 31 and is selectively shaped to different 8 1 variation according to arrangements of LED or SMD LED units 31. The rim 2 33 has a top slope inclined inwardly and having its top end higher than a top 3 level of the LED or SMD LED units 31 and its bottom end lower than the top 4 level of the LED or SMD LED units 31. The light-conducting glue 34 is 5 filled within the rim 33 over the LED or SMD LED units 31, wherein the 6 light-conducting glue 34 performs a layer having a top surface higher than 7 the top level of the LED or SMD LED units 31. Thereby, light emitting from 8 spot light source of the LED or SMD LED units 31 is reflected and collected 9 by the light-conducting glue 34 and inner surfaces of the rim 33 to perform 10 initial surface light source to increase luminance and improve light 11 uniformity. Moreover, the lamp base 2 has a top and a light-adjusting lens 5 12 mounted at the top over the LED or SMD LED units 31. The light-adjusting 13 lens 5 selectively has an outer convex arc 51 at its upper surface and an inner 14 concave arc 52 at its lower surface as shown in Fig. 7. Otherwise, as shown 15 in Fig. 9, the lower surface of the light-adjusting lens is an inner planar 16 surface. The inner concave arc 52 and the inner planar surface 53 (shown in 17 Fig. 20-2) both are treated with foggy treatment or laminated with foggy 18 paper. Moreover, distance D between the light-adjusting lens 5 and the LED 19 or SMD LED units 31 is adjustable (as shown in Figs. 7 and 9). For example, 20 (as shown in Figs. 16 and 16-1), when the distances D2, D3 between the 21 light-adjusting lens 5 and the LED or SMD LED units 31 are 3 to 10 mm, the 22 light-adjusting lens 5 creates lighting efficiency as a spotlight. As shown in 23 Fig. 15, when the distances DI between the light-adjusting lens 5 and the 24 LED or SMD LED units 31 is 0 to 2.5 mm, the light-adjusting lens 5 creates 9 1 lighting efficiency as a wide-angle lamp. Additionally, as shown in Fig. 9-1, 2 the thermal dispersing structure in this invention is operationally applied to a 3 single-socket light tube or, as shown in Fig. 9-2, applied to a dual-socket 4 light tube. 5 As shown in Fig. 10, the outer convex arc 51 of the light-adjusting 6 lens 5 has its edge performing a planar connector 5 11, wherein the 7 connection between the outer convex arc 51 and the planar connector 511 is 8 a sharp attachment 512. Thereby, luminance outside the projecting angle 9 range is increased. 10 As shown in Fig. 11, the high-conductive posts 41 on the thermal 11 dispersing body 4 are separately created as a sleeving set, i.e. the thermal 12 dispersing body 4 further has multiple engaging holes 42 aligning to the 13 holes 32 on the substrate 3 under the thermal conducting base 311 of LED or 14 SMD LED units 31. Moreover, a cross-shaped thermal conducting post 41' is is clamped between the substrate 3 and the thermal dispersing body 4 and 16 connects to the holes 32 and the engaging holes 42 respectively to service as 17 interface to sufficiently conduct and disperse heat. The described cross 18 shaped thermal conducting post 41' is made of thermal dispersing material 19 with excellent thermal conducting efficiency and the thermal dispersing body 20 4 is selectively made of thermal dispersing material with less thermal 21 conducting efficiency than the one of thermal conducting post 41'. Thereby, 22 heat generated by the LED or SMD LED units 31 is radially dispersed by 23 large surface of the steric periphery of the thermal conducting post 41' and 24 then remained heat is quickly passed to and dispersed by large surface of the 10 1 thermal dispersing body 4. Unlike conventional LED light only has small 2 thermal transmitting spot, the thermal dispersing structure with thermal 3 conducting post 41' enables to rapidly conduct and disperse high heat along 4 X, Y, Z axles. 5 As shown in Fig. 13, the lamp base 2 is integrally made of metal 6 thermal dispersing base and contains an enlarged thermal conducting post 7 41" to make the largest surface and largest volume for thermal dispersion for 8 high illumination or combination of large quantity of LED or SMD LED 9 units 31 with high power consumption. 10 The foregoing light head 1 is selectively in form of a threaded type, a 11 wedging type, a plug type or a T-shaped rotation lock (such as T-shaped 12 rotation lock in the fluorescent light tube) etc. 13 The foregoing thermal dispersing body 4, the posts 41, the thermal 14 conducting post 41', 41", or the lamp base 2 are made of thermal dispersing is material such as aluminum, copper or nano-ferric ceramic in one-piece or in 16 a sleeving piece. 17 As shown in Fig. 17, the thermal dispersing structure for LED or 18 SMD LED lights in the present invention constitutes a single bulb for car 19 lamp 10. Additionally, as shown in Figs. 18 and 18-1, the thermal dispersing 20 structure constitutes a long-distance projecting lamp 6, auxiliary projecting 21 lamp 7, fog lamp 8 or day-light signal lamp 9 on a combination of car head 22 lamp 10'. 23 As shown in Figs. 19 and 19-1, the thermal dispersing structure in 24 this invention is applied to dual-way projecting lamp. 11 1 The thermal dispersing structure in this invention also enables to be 2 applied to assembled LED lamps such as LED road lamp combination or 3 decorative projecting LED lamps etc. (as shown in Figs. 20, 20-1 or 21-2). 4 According to above description, the thermal dispersing structure for 5 LED or SMD LED lamps in this invention has the following advantages: 6 1. The thermal dispersing structure in this invention sufficiently 7 conduct and disperse heat generated by the LED or SMD LED units 31 8 having high watts power to keep the LED or SMD LED units 31 working 9 normally and to extend lifespan thereof. 10 2. By constructing the rim 33, one or multiple LED or SMD LED 11 units 31 are sealed and collected therein to perform an approximate surface 12 light source (as shown in Fig. 12). 13 3. The light-adjusting lens 5 with the inner planar surface or the inner 14 concave surface processes the projecting light from the approximate surface is light source to enlarge the light source to serve as secondary light-collecting. 16 The foggy treatment of the inner planar surface and the inner concave 17 surface enables to eliminate the dark difference outside the projecting light 18 range of the light-adjusting lens, to achieve a surface light source, to have 19 functions of high LUX, light uniformity, and to regulate projecting angle. 20 Thereby, halation can be eliminated and light uniformity and light 21 enhancement to maximum are achieved. 22 4. The sharp angle constituted by the outer convex arc and the planar 23 connector is located at edge having the weakest projecting light but performs 24 light-collecting ring to enhance the illumination. Moreover, the foggy 12
AU2009202013A 2009-05-22 2009-05-22 Thermal Dispersing Structure for LED or SMD LED lights Ceased AU2009202013B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2009202013A AU2009202013B2 (en) 2009-05-22 2009-05-22 Thermal Dispersing Structure for LED or SMD LED lights

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Application Number Priority Date Filing Date Title
AU2009202013A AU2009202013B2 (en) 2009-05-22 2009-05-22 Thermal Dispersing Structure for LED or SMD LED lights

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AU2009202013A1 true AU2009202013A1 (en) 2010-12-09
AU2009202013B2 AU2009202013B2 (en) 2011-11-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107676642A (en) * 2017-10-19 2018-02-09 上海普锐赛司实业有限公司 LED energy-saving bulbs radiating support base and the LED with the radiating support base

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012167440A1 (en) * 2011-06-10 2012-12-13 绿方有限公司 Heat-conducting and heat-dissipating nano-materials, preparing method thereof and heat-dissipating system

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Publication number Priority date Publication date Assignee Title
US20070253202A1 (en) * 2006-04-28 2007-11-01 Chaun-Choung Technology Corp. LED lamp and heat-dissipating structure thereof
US7467878B2 (en) * 2006-06-06 2008-12-23 Jaffe Limited Heat-dissipating structure having multiple heat pipes for LED lamp
US8047686B2 (en) * 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
CN201243015Y (en) * 2008-03-04 2009-05-20 无锡爱迪信光电科技有限公司 Liquid radiating device for high power light-emitting diode
CN201212633Y (en) * 2008-06-04 2009-03-25 丽鸿科技股份有限公司 LED illuminating lamp structure
KR100997760B1 (en) * 2008-12-04 2010-12-02 주식회사 자온지 Illuminating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107676642A (en) * 2017-10-19 2018-02-09 上海普锐赛司实业有限公司 LED energy-saving bulbs radiating support base and the LED with the radiating support base

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