AU2004202773B2 - Method for the production of an electrically conductive resistive layer and heating and/or cooling device - Google Patents
Method for the production of an electrically conductive resistive layer and heating and/or cooling device Download PDFInfo
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- AU2004202773B2 AU2004202773B2 AU2004202773A AU2004202773A AU2004202773B2 AU 2004202773 B2 AU2004202773 B2 AU 2004202773B2 AU 2004202773 A AU2004202773 A AU 2004202773A AU 2004202773 A AU2004202773 A AU 2004202773A AU 2004202773 B2 AU2004202773 B2 AU 2004202773B2
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- 238000000034 method Methods 0.000 title claims description 45
- 238000010438 heat treatment Methods 0.000 title claims description 21
- 238000001816 cooling Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title description 14
- 239000000463 material Substances 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000005507 spraying Methods 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 17
- 229910052732 germanium Inorganic materials 0.000 claims description 9
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 238000007751 thermal spraying Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052714 tellurium Inorganic materials 0.000 claims description 5
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 5
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 4
- 238000010285 flame spraying Methods 0.000 claims description 4
- 238000007750 plasma spraying Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- AQLMHYSWFMLWBS-UHFFFAOYSA-N arsenite(1-) Chemical compound O[As](O)[O-] AQLMHYSWFMLWBS-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Resistance Heating (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
An electrically conductive resistive layer (26) is produced by thermally spraying an electrically conductive 5 material (18) onto the surface of a non-conductive substrate (12). Initially, the material layer (14) arising therefrom has no desired shape. The material layer (14) is then removed (24) in certain areas so that an electrically conductive resistive layer (26) having said desired shape 10 is produced. H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04 Fig. 1 Fig 2
Description
AUSTRALIA Patents Act 1990 COMPLETE SPECIFICATION STANDARD PATENT Applicant(s): ELIAS RUSSEGGER Invention Title: METHOD FOR THE PRODUCTION OF AN ELECTRICALLY CONDUCTIVE RESISTIVE LAYER AND HEATING AND/OR COOLING DEVICE The following statement is a full description of this invention, including the best method of performing it known to me/us: -2 METHOD FOR THE PRODUCTION OF AN ELECTRICALLY CONDUCTIVE RESISTIVE LAYER AND HEATING AND/OR COOLING DEVICE 5 FIELD OF THE INVENTION The invention at first covers a method to produce an electrically conductive resistance layer on which an electrically conductive material will be applied, by means of thermal spraying, to a non conductive substrate. 10 BACKGROUND OF THE INVENTION Such a method is already known from the DE 198 10 848 Al patent. This patent describes a heating element which is produced by applying on the surface of a substrate through 15 a plasma-spray method or an electrical arcing method band shaped layers of an electrical conductive and resistance creating material. To achieve the desired shape of the electrical conductive layer, a separation layer is applied first to the substrate by means of a printing method. The 20 separation layer is from such a material that, it does not bond with the electrically conductive layer on those parts of the substrate where it is present. The known method has the disadvantage that it is 25 relatively complex and therefore the parts with the electrically conductive resistance layers are comparably expensive. In addition to this, only more or less level surfaces can be covered with an electrically conductive layer. 30 The invention at hand therefore is to further develop the previously described method in a way that the production of a substrate with an electrically conductive layer can be performed more easily and cheaper and that also 35 complex-shaped objects can be applied with an electrically conductive resistance layer as well. H:\Luisa\Keep\Speci\P53527 Russegger Cony App - S223 E-of-T.doc 23/06/04 - 3 SUMMARY OF THE INVENTION An aspect of the invention provides an electrically conductive resistive layer for use in a heater produced by a process of forming a material layer in the form of 5 particles of a material onto an entire surface of a substrate, and subsequently removing areas of the material using a laser to form a complex contour pattern having a continuous meander shape, wherein removing areas of the material creates a desired resistance of the electrically 10 conductive resistive layer such that at least a portion of the particles are micro-welded along a length of the pattern and local oxides are brought into the pattern through local heat treatment to fine tune an electrical resistance along the length of the pattern. 15 For the above process, no special pre-treatment is necessary to get to the desired shape of the electrically conductive resistance layer. Instead the electrically conductive material which forms the resistance layer is 20 surface-applied essentially evenly to the electrically non-conductive substrate. The application through thermal spraying cares for the high adhesion of the electrically conductive material to the electrically non-conductive substrate. In addition, different materials can be applied 25 quickly and very evenly in this way to the electrically non-conductive surface. After that, the electrically conductive material will be taken-off with an appropriate device from certain areas. 30 In this way, even complex shaping of the electrically conductive layer is achieved in only 2 work-steps. Preferably the electrically conductive resistive layer further comprises a melting fuse formed with the 35 subsequent removal of areas of the material. Preferably the material is selected from a group 2S35267_1 (GHMtters) - 4 consisting of Bismuth (Bi), Tellurium (Te), Germanium (Ge), Silicon (Si), and Gallium Arsenide. Preferably the material is selected from a group that 5 consists of an electrical heating material and an electrical cooling material. Preferably the shape is locally adjusted to provide desired electrical properties along the shape. 10 It is proposed that first the material layer be removed from certain areas by means of a laser beam or a water jet or a powder sand blast. is Using a laser beam, the material will be greatly heated which causes it to evaporate. The use of a laser has the advantage that very quickly very high doses of energy can be brought to the electrically conductive material so that it immediately evaporates. Due to the instant evaporation 20 of the electrically conductive material it is assured that only relatively little heat will be brought to the surface which lies underneath the electrically conductive material. That surface will not be damaged by the method contained in this invention. The evaporation has 25 compared to burning - the advantage that generally no residues remain on the surface of the evaporated areas which makes their insulation effect very good. With the appropriate optics of the device which sends out 30 the laser beam the beam can be directed in an almost unlimited way to the subject. Therefore randomly complex contours can be evaporated from the electrically conductive material so that correspondingly complex electrical resistance layers can be manufactured. In 35 addition even such subjects which themselves are complex three-dimensionally shaped can be worked-on. Therefore, an electrically conductive resistance layer of complex geometry can be manufactured in only two work-steps. 2535267_1 (GHMatters) - 5 Using a water jet will bring no thermal energy to the subject at all. This is especially advantageous when treating heat sensitive plastics. The same is applicable 5 when utilizing powder sand blasting. In another preferred embodiment of the invention it is proposed that during the removal of the material layer the electrical resistance of the electrically conductive 10 resistance layer is at least indirectly obtained. This way a precise quality control is immediately possible during the production of the electrically conductive layer. In further development to this it is proposed to compare 15 the actual resistance value of the electrically conductive resistance layer to a set value and to reduce the difference between set value and actual value by additional removal of the electrically conductive layer. This has the advantage that already during production of 20 the electrically conductive layer deviations from the desired resistance can be adjusted. Such deviations can be created for example when during spraying of the thermally conductive material inconsistent 25 amounts of the electrically conductive material are applied to some areas of the surface in a way that in those areas the thickness of the electrically conductive layer gets to a different thickness than in other areas. With the proposed method deviations of the actual value to 30 the set value can be adjusted up to a precision of +/-1%. The additional removal of zones of electrically conductive material can either imply a shortage or an elongation of the electrically conductive layer and/or it can imply a change in the width of the electrically conductive layer. 35 Herewith it is again especially advantageous when the collection of the actual value of the electrical resistance of the electrically conductive resistance layer 2535267_1 (GHMatters) -6 and reduction in the difference between the actual value and the set value is being done simultaneously. This is possible, because already during the processing of the electrically conductive layer with a laser beam the s electrical resistance value of the electrically conductive layer can be measured. If this method is applied during production of the electrically conductive layer time and consequently money can be saved. 10 In an embodiment of the invention it is proposed that the material-layer be removed in such a way that at least at one spot of the electrically conductive layer, an intended melting spot is created that functions as the melting fuse. Such an integrated melting fuse increases the 15 electrical safety of the electrically conductive resistance layer. That way the melting fuse can be incorporated into the electrically conductive layer practically without any additional cost and expenditure of time. 20 It is also advantageous, when the material layer is removed in such a manner that the electrically conductive resistance layer at least in some areas has the shape of a meander. This enables the creation of a possibly long 25 electrically conductive layer on a small area. It is also proposed that after the removal of some areas of the electrically conductive material and the completion of the electrically conductive resistance layer, the layer 30 be applied by an electrically non-conductive intermediate layer. Next on top of the intermediate electrically non conductive layer another electrically conductive layer can be thermal sprayed in such a way that it essentially does not show the desired shape yet. After this, using a laser 35 beam the material layer will be removed in some areas so a second electrically conductive layer is created which has the desired shape. An embodiment of the invention allows therefore the use of several layers on top of each other. 25352671 (GHMalters) -7 It must be noted that the embodiment not only covers an application with two electrically conductive resistance layers but also is applicable to any desired number of arranged resistance layers. 5 The electrically conductive material comprise preferably Bismuth (Bi), Tellurium (Te), Germanium (Ge), Silicon (Si) and/or Gallium Arsenite. These materials proved to be well suitable for thermal spraying and the following treatment 10 with laser beams. Furthermore, with these materials the known pertinent technical effects are realizable. Well suitable for applying electrically conductive materials on the substrate are plasma-spraying, high speed is flame spraying, arc spraying, autogenious spraying, laser spraying or cold gas spraying. Furthermore it is proposed to apply the electrically conductive material and to remove the material layer in 20 certain areas and that such a material is used in a way that an electrical heating layer or an electrical cooling layer is created. In the production of an electrical cooling layer the "Peltier effect" is beneficially used. 25 One further beneficial embodiment is proposed so that the local electrical resistance of the electrically conductive resistance layer will be adjusted by means of local heat treatment. Through heating local oxides can be brought into the layer, which affects the local electrical 30 conductivity of the material. This makes a specially precise and fine tuning of the electrical resistance possible. It is also beneficial when the electrically conductive 35 layer gets sealed. This is especially advantageous on porous substrates (for example metal with an intermediate layer of A1203). Sealing decreases the risk of electrical sparking due to moisture especially at high voltages. 25352871 (GHMatterS) - 8 Suitable materials to seal the surface are Silicone, Polyimide, soluble Potassium or soluble Sodium. They can be applied through plunging, spraying, painting etc. The tightness of the seal is best when the sealing layer is 5 applied under vacuum. Electrically non-conductive substrates can also be glass or glass-ceramics. The electrically conductive resistance layer can be plasma-sprayed to these materials durably. 10 Due to the good electrical insulation of glass it is unnecessary to ground the resistance layer. Also possible is the use of special high temperature glass such as for example Ceranglas". is In an embodiment, the invention also applies to a heating and/or cooling device with a non conductive substrate and an electrically conductive resistance layer which is thermally sprayed on the substrate. 20 Manufacturing cost for such a heat- and/or cooling device can be reduced when the resistance layer envelops an electrically conductive material, which is surface-applied through thermal spraying and then removed by a laser beam from certain areas and brought into the desired shape. 25 An aspect of the invention also provides a heater comprising: a nonconductive substrate; and an electrically conductive resistive layer formed 30 on the nonconductive substrate by a process of forming a material layer in the form of particles of a material onto an entire surface of a substrate and subsequently removing areas of the material using a laser to form a complex contour pattern including a continuous meander shape, 35 wherein removing areas of the material creates a desired resistance of the electrically conductive resistive layer such that at least a portion of the particles are micro welded along a length of the pattern and local oxides are 2535267.1 (GHMatters) - 9 brought into the pattern by local heat treatment to fine tune an electrical resistance along the length of the pattern. 5 Preferably the heater further comprises a sealing layer formed over the electrically conductive resistive layer. Preferably the heater further comprises an electrically nonconductive intermediate layer formed over the io electrically conductive resistive layer, and a second electrically conductive resistive layer formed over the electrically nonconductive intermediate layer, wherein the second electrically conductive resistive layer is formed by the same process as the electrically conductive is resistive layer. Preferably the heater further comprises a plurality of electrically conductive resistive layers separated by a corresponding plurality of electrically nonconductive 20 intermediate layers. Preferably the shape is locally adjusted to provide desired electrical properties along the shape. 25 Preferably the nonconductive substrate is a glass material. Preferably the electrically conductive resistive layer is a material is selected from a group consisting of Bismuth 30 (Bi), Tellurium (Te), Germanium (Ge), Silicon (Si), and Gallium Arsenide. Another aspect of the invention still further provides a method of forming an electrically conductive resistive 35 layer comprising the steps of: forming an electrically conductive material layer in the form of particles of a material onto an entire surface of a substrate; 2535267_1 (GHMatters) - 9a removing areas of the material using a laser to form a complex contour pattern including a continuous meander shape, wherein removing areas of the material 5 creates a desired resistance of the electrically conductive resistive layer such that at least a portion of the particles are micro-welded along a length of the pattern through local heat treatment and local oxides are brought into the pattern to fine tune an electrical 10 resistance along the length of the pattern. Preferably the electrically conductive material layer is formed onto the substrate by a process selected from the group consisting of thermal spraying, plasma spraying, is flame spraying, arc spraying, autogenious spraying, laser 25352571 (GHMatters) - 10 spraying, and cold gas spraying. Preferably the areas of electrically conductive material are removed by a process selected from the group 5 consisting of laser, water jet, and powder sand blasting. Preferably during removal of the electrically conductive material to form the desired shape, an electrical resistance (WIST) of the shape is obtained. 10 Preferably the actual electrical resistance (WIST) of the shape is compared to a desired value (WSOLL) and certain areas of electrically conductive material are removed to reduce the difference between the actual electrical 15 resistance (WIST) and the desired value (WSOLL). Preferably the obtaining of the electrical resistance (WIST) of the shape and the removal of material to reduce the difference between the actual electrical resistance 20 (WIST) and the desired value (WSOLL) are performed in parallel. Preferably the method further comprises the step of locally adjusting the shape with the removal process to 25 provide desired electrical properties along the shape. Preferably the method further comprises the step of sealing the electrically conductive resistive layer. 30 Preferably the step of sealing is conducted under vacuum. Next especially preferred embodiments of the invention illustrate design examples the invention with reference to the attached drawings. The drawings display: 35 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective layout of a tube on H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04 - 11 which an electrically conductive material is sprayed-on; Figure 2 is the tube of Fig.l. Its electrically conductive layer is worked-on with laser beams; Figure 3 is a side view of the tube of Fig. 2 5 after completion; Figure 4 is the top view on a plate-shaped part with a meander-shaped electrically conductive resistance layer; Figure 5 is two diagrams. One shows the 10 progression of time of the electrical resistance and the other shows the progression of time of the length of the electrically conductive resistance layer from Fig. 4 during manufacturing; and Figure 6 shows a section through the plate-shaped 15 part with 2 electrically conductive resistance layers arranged one above the other. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Figures 1 and 2 show the production of a tube shaped flow 20 heater. On a high temperature resistant tube (12) with an electrically non-conductive material an electrically conductive layer is applied (Fig.1). The application is conducted by means of a device (16) which is used to spray particles of Germanium (Ge) (18) on the tube (12). In this 25 case, cold-gas-spray method is used. In the spraying process the unmolten particles of Germanium (Ge) are accelerated to speeds of 300 - 1200 m/sec and sprayed on to the tube (12). On impact the Ge 30 particles (18) as well as the surface of the tube get deformed. Because of the impact surface-oxides of the surface of the tube (12) get broken-up. Through micro friction because of the impact the temperature of the contact area increases and leads to micro-welding. 35 The acceleration of the Ge-particles (18) is done by means of a conveyor-gas whose temperature can be slightly H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04 - 12 increased. Although the Ge-powder (18) never reaches its melting temperature, the resulting temperatures on the surface of the tube (12) are relatively moderate so that for example the tube can be made from a relatively cheap 5 plastic material. In other, not displayed construction examples, methods other than cold-gas-spraying can be used such as plasma spraying, high-speed-flame-spraying, arc-spraying, 10 autogenious-spraying or laser-spraying to apply the electrically conductive material to the substrate. Instead of Germanium (Ge), also Bismuth (Bi), Tellurium (Te), Silicon (Si) and/or Gallium Arsenide can be used, depending on the desired technical effect. 15 The coating of the tube (12) with particles of Germanium (Ge) is done at first in a way that bit by bit the entire surface of the tube (12) is covered with the Germanium layer (14) (compare Fig. 1). This material layer however 20 does not have the desired shape yet: To be able to manufacture a tubular shaped flow heater an electrically conductive resistance layer must be produced which surrounds the tube (12) in a circumferential direction in a spiral shape. To achieve this, as can be seen in Fig. 2, 25 a laser beam is directed to the "unshaped" material layer in a way that a spiral-shaped area (24) around the tube (12) is created in which the sprayed-on electrically conductive material (14) is not present any more. 30 This is achieved by having the material in the material layer (14) met with the laser beam so that it heats and immediately evaporates that part of the layer (14). The laser device on one side and a - in the figure not shown device which holds the tube (12) is one the other so that 35 a continuing work process by the laser device (20) is possible. H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04 - 13 As can be seen from Fig. 3, an electrically conductive layer (26) is created, that stretches spirally from one axial end of the tube (12) to the other. The flow heater (28) is formed by the electrically conductive resistance 5 layer (26) and the tube (12). In Fig. 4 a flat heat plate (28) is shown from a top view. This consists of a - in this view not visible - non conductive substrate on which, analog to the described 10 process of Fig. 1 and 2 at first a sheet-shaped layer of material (14) gets applied, out of which certain areas (24) are being evaporated with a laser beam (for simplicity only one area (24) was marked). Hereby a meander shaped electrically conductive resistance layer 15 (26) was created that stretches from one end of the plate (28) to the other. This, however, has two specialties: On the upper end of Fig. 4 the material layer (14), from which the electrically conductive layer was produced, was 20 evaporated in a way that the conductive track (26) shows a narrowed section. This creates a melting fuse (30) in such a way that the use of the heater plate (28) is protected. The second specialty is that the heating capacity or as 25 the case may be the density of the heat flow was corrected during manufacturing that it corresponds to the desired heat capacity or as the case may be the desired heat flow to very high precision. This is achieved as follows: A voltage is applied to the ends 32 and 34 of the 30 electrically conductive resistance layer (26) during the evaporation process so that the electrical resistance of the electrically conductive layer (26) can be measured continuously. The material layer (14) will be evaporated by the laser beam at first in only small sections (24). 35 The horizontal layers of the evaporated areas (24) of Fig. 4 stretch only from a corner (dashed lines) (36) to the horizontal corner (38) of the electrically conductive H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04 - 14 layer (26) which lies above. (Also here because of illustration purposes only one area (24) is shown). In addition to this, the material layer (14) is processed by the laser beam in a way that the lower electrical end area 5 (34) becomes relatively broad. This is shown with a dotted line with the mark 40. During the evaporation of the areas (24) of the material layer (14) of our present example, it is noted by 10 measuring the resistance of the created layer (26), that the actual electrical resistance WIST (compare Fig. 5) of the electrically conductive layer is lower than the desired electrical resistance WSOLL. Shown in Fig. 4, the lower connection area (34) of the electrically conductive 15 resistance layer (26) is processed by the laser beam in a way that his width decreases. Additional material is evaporated. Herewith the length of the electrically conductive resistance layer (26) increases with the dimension dl (compare Fig. 4 and 5) thus increasing the 20 electrical resistance WIST until it corresponds exactly with the desired electrical resistance WSOLL. The final position of the limiting line of the lower connection (34) is marked in Fig. 4 with the number 42. 25 To adjust the density of the heat flow the evaporated areas (24) shown in Fig. 4 are increased. The final limitation at which the desired density of the heat flow corresponds to the desired density of the heat flow of the electrically conductive layer (26) is marked in Fig. 4 30 with the number 44 [for simplicity reasons only shown once in evaporated area (24)]. Fig. 6 shows a plate-shaped heating device in a cross section. In contrary to the examples described above, it 35 does not only show one electrically conductive resistance layer but two electrically conductive resistance layers (26a and 26b). Between these layers an electrically non H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04 - 15 conductive intermediate layer (46) is positioned. The manufacturing process of these electrical heating plates (28) is described as follows: 5 At first an electrically conductive material is applied to the plate shaped substrate (12) as described above. The material is surface-applied by thermal spraying it in a way that at first the material layer does not show the desired shape in general yet. Following this process the 10 material layer (24a) gets evaporated by laser beam in such a way that an electrically conductive resistance layer (26a) is created which does show the desired shape. On top of the finished electrically conductive resistance 15 layer 26a an electrically isolating intermediate layer (46) gets applied in a following work step. Then the procedure described above gets repeated which means that, again, electrically conductive material is surface-applied by thermal spraying on top of the non conductive 20 intermediate layer (46) in a way that the so created second material layer does not show the desired shape yet. This layer is then processed by a laser beam in certain areas (24b) in such a way that a second electrically conductive resistance layer (26b) is created which does 25 show the desired shape. The material in a non shown example was chosen in a way that - instead of an electrical heating layer - an electrical cooling layer is created. 30 In another not illustrated example, the temperature of the heating layer is controlled by a ceramic switch. In this case, it is understood to mean a non mechanical switch, which consists of an element, whose conductivity is highly 35 dependent on its temperature. Alternatively, a bimetal switch can be used as well. H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04 - 16 In the claims which follow and in the preceding description of the invention, except where the context requires otherwise due to express language or necessary implication, the word "comprise", or variations such as 5 "comprises" or "comprising", is used in an inclusive sense, ie. to specify the presence of the stated features but not to preclude the presence or addition of further features in various embodiments of the invention. 10 It is to be understood that the prior art publications referred to herein, do not constitute an admission that that the publication forms a part of the common general knowledge in the art, in Australia or in any other country. 15 H:\Luisa\Keep\Speci\P53527 Russegger Conv App - S223 E-of-T.doc 23/06/04
Claims (15)
1. An electrically conductive resistive layer for use in a heater produced by a process of forming a 5 material layer in the form of particles of a material onto an entire surface of a substrate, and subsequently removing areas of the material using a laser to form a complex contour pattern having a continuous meander shape, wherein removing areas of the material creates a desired io resistance of the electrically conductive resistive layer such that at least a portion of the particles are micro welded along a length of the pattern and local oxides are brought into the pattern through local heat treatment to fine tune an electrical resistance along the length of the 15 pattern.
2. The electrically conductive resistive layer according to Claim 1, further comprising a melting fuse formed with the subsequent removal of areas of the 20 material.
3. The electrically conductive resistive layer according to Claim 1, wherein the material is selected from a group consisting of Bismuth (Bi), Tellurium (Te), 25 Germanium (Ge), Silicon (Si), and Gallium Arsenide.
4. The electrically conductive resistive layer according to Claim 1, wherein the material is selected from a group that consists of an electrical heating 30 material and an electrical cooling material.
5. The electrically conductive resistive layer according to Claim 1, wherein the shape is locally adjusted to provide desired electrical properties along 35 the shape.
6. A heater comprising:
2535267.1 (GHMatters) - 18 a nonconductive substrate; and an electrically conductive resistive layer formed on the nonconductive substrate by a process of forming a material layer in the form of particles of a material onto 5 an entire surface of a substrate and subsequently removing areas of the material using a laser to form a complex contour pattern including a continuous meander shape, wherein removing areas of the material creates a desired resistance of the electrically conductive resistive layer 10 such that at least a portion of the particles are micro welded along a length of the pattern and local oxides are brought into the pattern by local heat treatment to fine tune an electrical resistance along the length of the pattern. 15
7. The heater according to Claim 6, further comprising a sealing layer formed over the electrically conductive resistive layer. 20
8. The heater according to Claim 6, further comprising an electrically nonconductive intermediate layer formed over the electrically conductive resistive layer, and a second electrically conductive resistive layer formed over the electrically nonconductive 25 intermediate layer, wherein the second electrically conductive resistive layer is formed by the same process as the electrically conductive resistive layer.
9. The heater according to Claim 6, further 30 comprising a plurality of electrically conductive resistive layers separated by a corresponding plurality of electrically nonconductive intermediate layers.
10. The heater according to Claim 6, wherein the 35 shape is locally adjusted to provide desired electrical properties along the shape. 2535267_1 (GHMatters) - 19
11. The heater according to Claim 6, wherein the nonconductive substrate is a glass material.
12. A method of forming an electrically conductive 5 resistive layer comprising the steps of: forming an electrically conductive material layer in the form of particles of a material onto an entire surface of a substrate; removing areas of the material using a laser to 10 form a complex contour pattern including a continuous meander shape, wherein removing areas of the material creates a desired resistance of the electrically conductive resistive layer such that at least a portion of the particles are micro-welded along a length of the 15 pattern through local heat treatment and local oxides are brought into the pattern to fine tune an electrical resistance along the length of the pattern.
13. The method according to Claim 12, wherein the 20 electrically conductive material layer is formed onto the substrate by a process selected from the group consisting of thermal spraying, plasma spraying, flame spraying, arc spraying, autogenious spraying, laser spraying, and cold gas spraying. 25
14. The method according to Claim 12, wherein during removal of the material to form the desired shape, an electrical resistance (WIST) of the shape is obtained. 30 15. The method according to Claim 14, wherein the actual electrical resistance (WIST) of the shape is compared to a desired value (WSOLL) and certain areas of electrically conductive material are removed to reduce the difference between the actual electrical resistance (WIST) 35 and the desired value (WSOLL). 16. The method according to Claim 15, wherein the 2535267.1 (GHMatters) - 20 obtaining of the electrical resistance (WIST) of the shape and the removal of material to reduce the difference between the actual electrical resistance (WIST) and the desired value (WSOLL) are performed in parallel. 5 17. The method according to Claim 12, further comprising locally adjusting the shape with the removal process to provide desired electrical properties along the shape. 10 18. The method according to Claim 12, further comprising sealing the electrically conductive resistive layer.
15 19. The method according to Claim 18, wherein the step of sealing is conducted under vacuum. 2535267_1 (GHMatters)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2004202773A AU2004202773B2 (en) | 2004-06-23 | 2004-06-23 | Method for the production of an electrically conductive resistive layer and heating and/or cooling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2004202773A AU2004202773B2 (en) | 2004-06-23 | 2004-06-23 | Method for the production of an electrically conductive resistive layer and heating and/or cooling device |
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| Publication Number | Publication Date |
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| AU2004202773A1 AU2004202773A1 (en) | 2006-01-12 |
| AU2004202773B2 true AU2004202773B2 (en) | 2011-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| AU2004202773A Ceased AU2004202773B2 (en) | 2004-06-23 | 2004-06-23 | Method for the production of an electrically conductive resistive layer and heating and/or cooling device |
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| AU (1) | AU2004202773B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040060925A1 (en) * | 2000-11-24 | 2004-04-01 | Yanling Zhou | Ceramic heater and manufacturing method of ceramic heater |
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2004
- 2004-06-23 AU AU2004202773A patent/AU2004202773B2/en not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040060925A1 (en) * | 2000-11-24 | 2004-04-01 | Yanling Zhou | Ceramic heater and manufacturing method of ceramic heater |
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| Publication number | Publication date |
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| AU2004202773A1 (en) | 2006-01-12 |
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| PC1 | Assignment before grant (sect. 113) |
Owner name: WATLOW ELECTRIC MANUFACTURING COMPANY Free format text: FORMER APPLICANT(S): RUSSEGGER, ELIAS |
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| FGA | Letters patent sealed or granted (standard patent) | ||
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |