AU2003295659A8 - Method, system, and article of manufacture for implementing metal-fill - Google Patents
Method, system, and article of manufacture for implementing metal-fillInfo
- Publication number
- AU2003295659A8 AU2003295659A8 AU2003295659A AU2003295659A AU2003295659A8 AU 2003295659 A8 AU2003295659 A8 AU 2003295659A8 AU 2003295659 A AU2003295659 A AU 2003295659A AU 2003295659 A AU2003295659 A AU 2003295659A AU 2003295659 A8 AU2003295659 A8 AU 2003295659A8
- Authority
- AU
- Australia
- Prior art keywords
- fill
- article
- manufacture
- implementing metal
- implementing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/300,715 US7328419B2 (en) | 2002-11-19 | 2002-11-19 | Place and route tool that incorporates a metal-fill mechanism |
US10/300,544 US7231624B2 (en) | 2002-11-19 | 2002-11-19 | Method, system, and article of manufacture for implementing metal-fill with power or ground connection |
US10/300,544 | 2002-11-19 | ||
US10/300,724 US20040098688A1 (en) | 2002-11-19 | 2002-11-19 | Method, system, and article of manufacture for implementing long wire metal-fill |
US10/300,715 | 2002-11-19 | ||
US10/300,722 | 2002-11-19 | ||
US10/300,724 | 2002-11-19 | ||
US10/300,722 US7287324B2 (en) | 2002-11-19 | 2002-11-19 | Method, system, and article of manufacture for implementing metal-fill on an integrated circuit |
PCT/US2003/036989 WO2004047001A2 (en) | 2002-11-19 | 2003-11-19 | Method, system, and article of manufacture for implementing metal-fill |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003295659A1 AU2003295659A1 (en) | 2004-06-15 |
AU2003295659A8 true AU2003295659A8 (en) | 2004-06-15 |
Family
ID=32330032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003295659A Abandoned AU2003295659A1 (en) | 2002-11-19 | 2003-11-19 | Method, system, and article of manufacture for implementing metal-fill |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1573605A4 (en) |
AU (1) | AU2003295659A1 (en) |
TW (1) | TWI354901B (en) |
WO (1) | WO2004047001A2 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5892249A (en) * | 1996-02-23 | 1999-04-06 | National Semiconductor Corporation | Integrated circuit having reprogramming cell |
US5763955A (en) * | 1996-07-01 | 1998-06-09 | Vlsi Technology, Inc. | Patterned filled layers for integrated circuit manufacturing |
US5923563A (en) * | 1996-12-20 | 1999-07-13 | International Business Machines Corporation | Variable density fill shape generation |
US6093631A (en) * | 1998-01-15 | 2000-07-25 | International Business Machines Corporation | Dummy patterns for aluminum chemical polishing (CMP) |
US6189133B1 (en) * | 1998-05-14 | 2001-02-13 | International Business Machines Corporation | Coupling noise reduction technique using reset timing |
US6305000B1 (en) * | 1999-06-15 | 2001-10-16 | International Business Machines Corporation | Placement of conductive stripes in electronic circuits to satisfy metal density requirements |
US6609235B2 (en) * | 2001-06-22 | 2003-08-19 | Bae Systems Information And Electronic Systems Integration, Inc. | Method for providing a fill pattern for an integrated circuit design |
-
2003
- 2003-11-19 WO PCT/US2003/036989 patent/WO2004047001A2/en not_active Application Discontinuation
- 2003-11-19 TW TW092132437A patent/TWI354901B/en not_active IP Right Cessation
- 2003-11-19 AU AU2003295659A patent/AU2003295659A1/en not_active Abandoned
- 2003-11-19 EP EP03786859A patent/EP1573605A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2004047001A3 (en) | 2004-09-23 |
TWI354901B (en) | 2011-12-21 |
WO2004047001A2 (en) | 2004-06-03 |
TW200417874A (en) | 2004-09-16 |
EP1573605A4 (en) | 2006-08-16 |
AU2003295659A1 (en) | 2004-06-15 |
EP1573605A2 (en) | 2005-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |