AU2003291243A8 - Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards - Google Patents

Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards

Info

Publication number
AU2003291243A8
AU2003291243A8 AU2003291243A AU2003291243A AU2003291243A8 AU 2003291243 A8 AU2003291243 A8 AU 2003291243A8 AU 2003291243 A AU2003291243 A AU 2003291243A AU 2003291243 A AU2003291243 A AU 2003291243A AU 2003291243 A8 AU2003291243 A8 AU 2003291243A8
Authority
AU
Australia
Prior art keywords
ltcc
boards
structures
temperature control
high power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003291243A
Other versions
AU2003291243A1 (en
Inventor
Joseph Mazzochette
Barry Jay Thaler
Ellen Schwartz Tormey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lamina Ceramics Inc
Original Assignee
Lamina Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lamina Ceramics Inc filed Critical Lamina Ceramics Inc
Publication of AU2003291243A8 publication Critical patent/AU2003291243A8/en
Publication of AU2003291243A1 publication Critical patent/AU2003291243A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
AU2003291243A 2002-11-12 2003-11-06 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards Abandoned AU2003291243A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42559902P 2002-11-12 2002-11-12
US60/425,599 2002-11-12
PCT/US2003/035317 WO2004045016A2 (en) 2002-11-12 2003-11-06 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards

Publications (2)

Publication Number Publication Date
AU2003291243A8 true AU2003291243A8 (en) 2004-06-03
AU2003291243A1 AU2003291243A1 (en) 2004-06-03

Family

ID=32313022

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003291243A Abandoned AU2003291243A1 (en) 2002-11-12 2003-11-06 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards

Country Status (5)

Country Link
EP (1) EP1568070A4 (en)
JP (1) JP2006506810A (en)
KR (1) KR20050086589A (en)
AU (1) AU2003291243A1 (en)
WO (1) WO2004045016A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7269017B2 (en) * 2004-11-19 2007-09-11 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
CN114614228A (en) * 2020-12-09 2022-06-10 深南电路股份有限公司 Coupler and electronic equipment
CN114804643A (en) * 2022-03-14 2022-07-29 重庆科技学院 High-bending-strength microcrystalline glass-based low-temperature co-fired ceramic material and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US5256469A (en) * 1991-12-18 1993-10-26 General Electric Company Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US5386339A (en) * 1993-07-29 1995-01-31 Hughes Aircraft Company Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
US5604673A (en) * 1995-06-07 1997-02-18 Hughes Electronics Low temperature co-fired ceramic substrates for power converters
JPH09153679A (en) * 1995-11-30 1997-06-10 Kyocera Corp Stacked glass ceramic circuit board
DE19640959A1 (en) * 1996-10-04 1998-04-09 Bosch Gmbh Robert Multilayer circuit or sensor substrate of glass-ceramic
DE29623190U1 (en) * 1996-11-28 1997-12-11 Siemens AG, 80333 München Multi-layer circuit board
JP2959506B2 (en) * 1997-02-03 1999-10-06 日本電気株式会社 Multi-chip module cooling structure

Also Published As

Publication number Publication date
KR20050086589A (en) 2005-08-30
WO2004045016A2 (en) 2004-05-27
JP2006506810A (en) 2006-02-23
AU2003291243A1 (en) 2004-06-03
EP1568070A2 (en) 2005-08-31
WO2004045016A3 (en) 2005-07-07
EP1568070A4 (en) 2008-05-07

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase