AU2003289124A8 - Silica glass jig used in process for manufacturing semiconductor and method of manufacturing silica glass jig - Google Patents
Silica glass jig used in process for manufacturing semiconductor and method of manufacturing silica glass jigInfo
- Publication number
- AU2003289124A8 AU2003289124A8 AU2003289124A AU2003289124A AU2003289124A8 AU 2003289124 A8 AU2003289124 A8 AU 2003289124A8 AU 2003289124 A AU2003289124 A AU 2003289124A AU 2003289124 A AU2003289124 A AU 2003289124A AU 2003289124 A8 AU2003289124 A8 AU 2003289124A8
- Authority
- AU
- Australia
- Prior art keywords
- silica glass
- glass jig
- manufacturing
- manufacturing semiconductor
- jig used
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Melting And Manufacturing (AREA)
- Drying Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-351439 | 2002-12-03 | ||
| JP2002351439 | 2002-12-03 | ||
| PCT/JP2003/015420 WO2004051724A1 (en) | 2002-12-03 | 2003-12-02 | Silica glass jig used in process for manufacturing semiconductor and method of manufacturing silica glass jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003289124A8 true AU2003289124A8 (en) | 2004-06-23 |
| AU2003289124A1 AU2003289124A1 (en) | 2004-06-23 |
Family
ID=32463150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003289124A Abandoned AU2003289124A1 (en) | 2002-12-03 | 2003-12-02 | Silica glass jig used in process for manufacturing semiconductor and method of manufacturing silica glass jig |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP4475581B2 (en) |
| KR (1) | KR100614741B1 (en) |
| AU (1) | AU2003289124A1 (en) |
| TW (1) | TWI249510B (en) |
| WO (1) | WO2004051724A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4889044B2 (en) * | 2005-06-16 | 2012-02-29 | 信越石英株式会社 | Quartz glass jig for heat treatment of recon wafer and method for forming groove cut surface of wafer mounting member provided in the jig |
| JP5026816B2 (en) * | 2007-02-26 | 2012-09-19 | 東ソー・クォーツ株式会社 | Quartz glass jig and manufacturing method thereof |
| JP6326210B2 (en) * | 2013-09-30 | 2018-05-16 | テクノクオーツ株式会社 | Quartz glass part and method for producing quartz glass part |
| JP6586092B2 (en) * | 2013-12-19 | 2019-10-02 | コーニング インコーポレイテッド | Relief surface for display applications |
| CN107074627A (en) * | 2014-10-17 | 2017-08-18 | 旭硝子株式会社 | The evaluation method of the pollution condition on the surface of transparent component, the manufacture method of transparent component and transparent component |
| KR102581501B1 (en) | 2021-04-20 | 2023-09-26 | 주식회사 금강쿼츠 | Quartz glass surface treatment method and quartz glass prepared thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3450112B2 (en) * | 1996-01-24 | 2003-09-22 | 株式会社福井信越石英 | Surface treatment method for quartz glass jig and surface treated jig |
| JPH11130451A (en) * | 1997-10-31 | 1999-05-18 | Shinetsu Quartz Prod Co Ltd | Quartz glass jig for semiconductor heat treatment apparatus |
| JP2001089198A (en) * | 1999-09-22 | 2001-04-03 | Asahi Glass Co Ltd | Silica glass jig for semiconductor device and method for producing the same jig |
| KR100547743B1 (en) * | 2000-09-28 | 2006-01-31 | 신에쯔 세끼에이 가부시키가이샤 | Silica Glass Jig for Semiconductor Industry and Manufacturing Method Thereof |
| JP3824299B2 (en) * | 2001-01-30 | 2006-09-20 | 東芝セラミックス株式会社 | Frost treatment liquid and frost treatment method on quartz glass surface |
-
2003
- 2003-12-02 KR KR1020047020224A patent/KR100614741B1/en active IP Right Grant
- 2003-12-02 JP JP2004556891A patent/JP4475581B2/en not_active Expired - Lifetime
- 2003-12-02 WO PCT/JP2003/015420 patent/WO2004051724A1/en active Application Filing
- 2003-12-02 AU AU2003289124A patent/AU2003289124A1/en not_active Abandoned
- 2003-12-03 TW TW092134064A patent/TWI249510B/en not_active IP Right Cessation
-
2009
- 2009-10-09 JP JP2009234804A patent/JP2010042991A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004051724A1 (en) | 2004-06-17 |
| AU2003289124A1 (en) | 2004-06-23 |
| KR20050016547A (en) | 2005-02-21 |
| JP2010042991A (en) | 2010-02-25 |
| TW200417524A (en) | 2004-09-16 |
| WO2004051724A8 (en) | 2007-06-28 |
| TWI249510B (en) | 2006-02-21 |
| JPWO2004051724A1 (en) | 2006-04-06 |
| JP4475581B2 (en) | 2010-06-09 |
| KR100614741B1 (en) | 2006-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL144806A (en) | Method and apparatus for process control in semiconductor manufacturing | |
| IL162102A0 (en) | Method and apparatus for measuring stress in semiconductor wafers tevet process control | |
| EP1501119A4 (en) | Semiconductor wafer manufacturing method and wafer | |
| EP1501122A4 (en) | High resistance silicon wafer and method for production thereof | |
| EP1554757A4 (en) | Semiconductor apparatus and fabrication method of the same | |
| SG98498A1 (en) | Heat-treating apparatus and method for semiconductor process | |
| EP1580170A4 (en) | Method for producing synthetic quartz glass and synthetic quartz glass article | |
| EP1453096A4 (en) | Pasted wafer and method for producing pasted wafer | |
| AU2003225127A8 (en) | Method and apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates | |
| AU2003256825A1 (en) | Method and apparatus for manufacturing net shape semiconductor wafers | |
| EP1551058A4 (en) | Annealed wafer and annealed wafer manufacturing method | |
| EP1596437A4 (en) | Method for manufacturing soi wafer and soi wafer | |
| EP1408540A4 (en) | Production method for anneal wafer and anneal wafer | |
| EP1471578A4 (en) | Soi wafer manufacturing method and soi wafer | |
| EP1695378A4 (en) | Method for production of semiconductor chip and semiconductor chip | |
| EP1516859A4 (en) | Method and apparatus for producing flat glass | |
| AU2003265862A8 (en) | Semiconductor component and method of manufacture | |
| EP1394124A4 (en) | Method and device for manufacturing glass tube | |
| AU2003207218A1 (en) | Semiconductor manufacturing method and semiconductor manufacturing apparatus | |
| EP1422753A4 (en) | Production method for anneal wafer and anneal wafer | |
| AU2003289124A8 (en) | Silica glass jig used in process for manufacturing semiconductor and method of manufacturing silica glass jig | |
| EP1605510A4 (en) | Soi wafer and method for manufacturing same | |
| EP1557883A4 (en) | Soi wafer and method for manufacturing soi wafer | |
| AU2003253023A8 (en) | Lapping method and lapping tool for glass balls | |
| TWI348217B (en) | Semiconductor component and method of manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase | ||
| TH | Corrigenda |
Free format text: IN VOL 18, NO 29, PAGE(S) 7890 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME SHIN-ETSU QUARTZ PRODUCTS CO., LTD., APPLICATION NO. 2003289124, UNDER INID (71) CORRECT THE NAME TO READ SHIN-ETSU QUARTZ PRODUCTS CO., LTD.; FUKUI SHIN-ETSU QUARTS CO., LTD. |