AU2003263695A1 - Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board - Google Patents

Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board

Info

Publication number
AU2003263695A1
AU2003263695A1 AU2003263695A AU2003263695A AU2003263695A1 AU 2003263695 A1 AU2003263695 A1 AU 2003263695A1 AU 2003263695 A AU2003263695 A AU 2003263695A AU 2003263695 A AU2003263695 A AU 2003263695A AU 2003263695 A1 AU2003263695 A1 AU 2003263695A1
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
electronic elements
mounting
mounting electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003263695A
Other versions
AU2003263695A8 (en
Inventor
Ryszard HORBOWSKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Digital Broadcast Polska Sp zoo
Advanced Digital Broadcast Ltd
Original Assignee
Advanced Digital Broadcast Polska Sp zoo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Digital Broadcast Polska Sp zoo filed Critical Advanced Digital Broadcast Polska Sp zoo
Publication of AU2003263695A1 publication Critical patent/AU2003263695A1/en
Publication of AU2003263695A8 publication Critical patent/AU2003263695A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AU2003263695A 2002-08-08 2003-07-29 Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board Abandoned AU2003263695A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PLP.355404 2002-08-08
PL02355404A PL355404A1 (en) 2002-08-08 2002-08-08 Pronted circuit board with electronic components to be fitted on a pronted circuit board and method of fitting electronic components on printed circuit board
PCT/PL2003/000071 WO2004016056A1 (en) 2002-08-08 2003-07-29 Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board

Publications (2)

Publication Number Publication Date
AU2003263695A1 true AU2003263695A1 (en) 2004-02-25
AU2003263695A8 AU2003263695A8 (en) 2004-02-25

Family

ID=31713222

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003263695A Abandoned AU2003263695A1 (en) 2002-08-08 2003-07-29 Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board

Country Status (3)

Country Link
AU (1) AU2003263695A1 (en)
PL (1) PL355404A1 (en)
WO (1) WO2004016056A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3108228B1 (en) * 2020-03-12 2023-07-28 St Microelectronics Grenoble 2 Electronic device comprising surface-mounted component-type dipoles, and method of assembling the same.

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1449653A (en) * 1965-04-15 1966-05-06 Radiotechnique Improvements to insulating boards carrying printed circuits
DE3115303A1 (en) * 1981-04-15 1982-11-04 Becker Autoradiowerk Gmbh, 7516 Karlsbad Method for populating printed-circuit boards with miniature components having no wires, and a printed-circuit board populated with such miniature components
USH416H (en) * 1981-08-31 1988-01-05 Rogers Corporation High capacitance flexible circuit
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors
JPH0212889A (en) * 1988-06-30 1990-01-17 Mini Pairo Denki:Kk Circuit connecting method and circuit board
JPH0391907A (en) * 1989-09-04 1991-04-17 Matsushita Electric Ind Co Ltd Chip part
DE4026233A1 (en) * 1990-08-18 1992-02-20 Peter Hiller CIRCUIT BOARD WITH ELECTRICAL COMPONENTS, ESPECIALLY IN SMD VERSION
DE4033199A1 (en) * 1990-10-19 1992-04-23 Kawe Electronic Gmbh & Co Kg PCB mfr. using miniature through-pins - achieves high component density using vertical solder dipping process
US5074799A (en) * 1991-03-27 1991-12-24 Amp Incorporated Gel connector of laminar construction
US5809641A (en) * 1996-04-25 1998-09-22 International Business Machines Corporation Method for printed circuit board repair
US6806428B1 (en) * 1999-04-16 2004-10-19 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
US6621012B2 (en) * 2001-02-01 2003-09-16 International Business Machines Corporation Insertion of electrical component within a via of a printed circuit board

Also Published As

Publication number Publication date
PL355404A1 (en) 2004-02-09
AU2003263695A8 (en) 2004-02-25
WO2004016056A1 (en) 2004-02-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase