AU2003263316A8 - Improvements in or relating to cooling of electronic components - Google Patents
Improvements in or relating to cooling of electronic componentsInfo
- Publication number
- AU2003263316A8 AU2003263316A8 AU2003263316A AU2003263316A AU2003263316A8 AU 2003263316 A8 AU2003263316 A8 AU 2003263316A8 AU 2003263316 A AU2003263316 A AU 2003263316A AU 2003263316 A AU2003263316 A AU 2003263316A AU 2003263316 A8 AU2003263316 A8 AU 2003263316A8
- Authority
- AU
- Australia
- Prior art keywords
- relating
- cooling
- electronic components
- electronic
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0221123.3 | 2002-09-12 | ||
| GB0221123A GB0221123D0 (en) | 2002-09-12 | 2002-09-12 | Improvements in or relating to cooling of electronic components |
| PCT/GB2003/003859 WO2004025728A2 (en) | 2002-09-12 | 2003-09-05 | Improvements in or relating to cooling of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003263316A8 true AU2003263316A8 (en) | 2004-04-30 |
| AU2003263316A1 AU2003263316A1 (en) | 2004-04-30 |
Family
ID=9943902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003263316A Abandoned AU2003263316A1 (en) | 2002-09-12 | 2003-09-05 | Improvements in or relating to cooling of electronic components |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2003263316A1 (en) |
| GB (1) | GB0221123D0 (en) |
| WO (1) | WO2004025728A2 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4069498A (en) * | 1976-11-03 | 1978-01-17 | International Business Machines Corporation | Studded heat exchanger for integrated circuit package |
| EP0054069A1 (en) * | 1980-06-19 | 1982-06-23 | Digital Equipment Corporation | Heat pin integrated circuit packaging |
| EP0130279B1 (en) * | 1983-03-25 | 1989-03-08 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly for cooling electronic parts |
| JP2536657B2 (en) * | 1990-03-28 | 1996-09-18 | 三菱電機株式会社 | Electric device and manufacturing method thereof |
| US5646826A (en) * | 1995-01-26 | 1997-07-08 | Northern Telecom Limited | Printed circuit board and heat sink arrangement |
| US5999407A (en) * | 1998-10-22 | 1999-12-07 | Lockheed Martin Corp. | Electronic module with conductively heat-sunk components |
-
2002
- 2002-09-12 GB GB0221123A patent/GB0221123D0/en not_active Ceased
-
2003
- 2003-09-05 AU AU2003263316A patent/AU2003263316A1/en not_active Abandoned
- 2003-09-05 WO PCT/GB2003/003859 patent/WO2004025728A2/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004025728A2 (en) | 2004-03-25 |
| WO2004025728A3 (en) | 2004-05-06 |
| GB0221123D0 (en) | 2002-10-23 |
| AU2003263316A1 (en) | 2004-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |