AU2003263316A1 - Improvements in or relating to cooling of electronic components - Google Patents

Improvements in or relating to cooling of electronic components

Info

Publication number
AU2003263316A1
AU2003263316A1 AU2003263316A AU2003263316A AU2003263316A1 AU 2003263316 A1 AU2003263316 A1 AU 2003263316A1 AU 2003263316 A AU2003263316 A AU 2003263316A AU 2003263316 A AU2003263316 A AU 2003263316A AU 2003263316 A1 AU2003263316 A1 AU 2003263316A1
Authority
AU
Australia
Prior art keywords
relating
cooling
electronic components
electronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003263316A
Other versions
AU2003263316A8 (en
Inventor
Peter Dalglish
William Eric Ferguson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
BAE Systems PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BAE Systems PLC filed Critical BAE Systems PLC
Publication of AU2003263316A8 publication Critical patent/AU2003263316A8/en
Publication of AU2003263316A1 publication Critical patent/AU2003263316A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338Pistons, e.g. spring-loaded members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2003263316A 2002-09-12 2003-09-05 Improvements in or relating to cooling of electronic components Abandoned AU2003263316A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0221123.3 2002-09-12
GB0221123A GB0221123D0 (en) 2002-09-12 2002-09-12 Improvements in or relating to cooling of electronic components
PCT/GB2003/003859 WO2004025728A2 (en) 2002-09-12 2003-09-05 Improvements in or relating to cooling of electronic components

Publications (2)

Publication Number Publication Date
AU2003263316A8 AU2003263316A8 (en) 2004-04-30
AU2003263316A1 true AU2003263316A1 (en) 2004-04-30

Family

ID=9943902

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003263316A Abandoned AU2003263316A1 (en) 2002-09-12 2003-09-05 Improvements in or relating to cooling of electronic components

Country Status (3)

Country Link
AU (1) AU2003263316A1 (en)
GB (1) GB0221123D0 (en)
WO (1) WO2004025728A2 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
EP0054069A1 (en) * 1980-06-19 1982-06-23 Digital Equipment Corporation Heat pin integrated circuit packaging
EP0130279B1 (en) * 1983-03-25 1989-03-08 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts
JP2536657B2 (en) * 1990-03-28 1996-09-18 三菱電機株式会社 Electric device and manufacturing method thereof
US5646826A (en) * 1995-01-26 1997-07-08 Northern Telecom Limited Printed circuit board and heat sink arrangement
US5999407A (en) * 1998-10-22 1999-12-07 Lockheed Martin Corp. Electronic module with conductively heat-sunk components

Also Published As

Publication number Publication date
WO2004025728A2 (en) 2004-03-25
WO2004025728A3 (en) 2004-05-06
GB0221123D0 (en) 2002-10-23
AU2003263316A8 (en) 2004-04-30

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase