AU2003252342A1 - Work transfer means, image recognition device, and positioning method - Google Patents

Work transfer means, image recognition device, and positioning method

Info

Publication number
AU2003252342A1
AU2003252342A1 AU2003252342A AU2003252342A AU2003252342A1 AU 2003252342 A1 AU2003252342 A1 AU 2003252342A1 AU 2003252342 A AU2003252342 A AU 2003252342A AU 2003252342 A AU2003252342 A AU 2003252342A AU 2003252342 A1 AU2003252342 A1 AU 2003252342A1
Authority
AU
Australia
Prior art keywords
image recognition
recognition device
transfer means
positioning method
work transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003252342A
Inventor
Shoji Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Machinery Inc
Original Assignee
NEC Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Machinery Corp filed Critical NEC Machinery Corp
Publication of AU2003252342A1 publication Critical patent/AU2003252342A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
AU2003252342A 2003-07-30 2003-07-30 Work transfer means, image recognition device, and positioning method Abandoned AU2003252342A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/009668 WO2005013354A1 (en) 2003-07-30 2003-07-30 Work transfer means, image recognition device, and positioning method

Publications (1)

Publication Number Publication Date
AU2003252342A1 true AU2003252342A1 (en) 2005-02-15

Family

ID=34113457

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003252342A Abandoned AU2003252342A1 (en) 2003-07-30 2003-07-30 Work transfer means, image recognition device, and positioning method

Country Status (2)

Country Link
AU (1) AU2003252342A1 (en)
WO (1) WO2005013354A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2284863B1 (en) * 2009-08-11 2012-04-04 Kulicke & Soffa Die Bonding GmbH Method and apparatus for inspecting a chip prior to bonding
US9093549B2 (en) 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
KR102231293B1 (en) * 2014-02-10 2021-03-23 삼성전자주식회사 Die bonding apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60191785A (en) * 1984-03-13 1985-09-30 富士機械製造株式会社 Suction head for electronic part
JPH0718544Y2 (en) * 1988-07-05 1995-05-01 日本電気株式会社 Suction device for positioning system
JPH02185327A (en) * 1989-01-09 1990-07-19 Matsushita Electric Ind Co Ltd Parts installing device
JPH05162094A (en) * 1991-12-10 1993-06-29 Tokyo Electron Ind Co Ltd Suction transport device for image measuring parts

Also Published As

Publication number Publication date
WO2005013354A1 (en) 2005-02-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase