AU2003248608A1 - Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly - Google Patents

Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly

Info

Publication number
AU2003248608A1
AU2003248608A1 AU2003248608A AU2003248608A AU2003248608A1 AU 2003248608 A1 AU2003248608 A1 AU 2003248608A1 AU 2003248608 A AU2003248608 A AU 2003248608A AU 2003248608 A AU2003248608 A AU 2003248608A AU 2003248608 A1 AU2003248608 A1 AU 2003248608A1
Authority
AU
Australia
Prior art keywords
preplated
constraining
spread
lead frame
flip chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003248608A
Inventor
John Briar
Alex Chew
Kee Kwang Lau
Roman Perez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanpack Solutions Pte Ltd
Original Assignee
Advanpack Solutions Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanpack Solutions Pte Ltd filed Critical Advanpack Solutions Pte Ltd
Publication of AU2003248608A1 publication Critical patent/AU2003248608A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
AU2003248608A 2002-10-30 2003-07-10 Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly Abandoned AU2003248608A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/283,442 US20040084508A1 (en) 2002-10-30 2002-10-30 Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly
US10/283,442 2002-10-30
PCT/SG2003/000165 WO2004040950A1 (en) 2002-10-30 2003-07-10 Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly

Publications (1)

Publication Number Publication Date
AU2003248608A1 true AU2003248608A1 (en) 2004-05-25

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Application Number Title Priority Date Filing Date
AU2003248608A Abandoned AU2003248608A1 (en) 2002-10-30 2003-07-10 Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly

Country Status (5)

Country Link
US (1) US20040084508A1 (en)
CN (1) CN1502439A (en)
AU (1) AU2003248608A1 (en)
TW (1) TW200406902A (en)
WO (1) WO2004040950A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
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DE10332695A1 (en) * 2003-07-18 2005-02-03 Robert Bosch Gmbh Arrangement for fastening a component
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