AU2003243737A1 - Shared sensors for detecting substrate position/presence - Google Patents

Shared sensors for detecting substrate position/presence

Info

Publication number
AU2003243737A1
AU2003243737A1 AU2003243737A AU2003243737A AU2003243737A1 AU 2003243737 A1 AU2003243737 A1 AU 2003243737A1 AU 2003243737 A AU2003243737 A AU 2003243737A AU 2003243737 A AU2003243737 A AU 2003243737A AU 2003243737 A1 AU2003243737 A1 AU 2003243737A1
Authority
AU
Australia
Prior art keywords
substrate position
detecting substrate
shared sensors
shared
sensors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003243737A
Other languages
English (en)
Inventor
Shinichi Kurita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of AU2003243737A1 publication Critical patent/AU2003243737A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2003243737A 2002-06-21 2003-06-20 Shared sensors for detecting substrate position/presence Abandoned AU2003243737A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39076402P 2002-06-21 2002-06-21
US60/390,764 2002-06-21
PCT/US2003/019723 WO2004001818A2 (en) 2002-06-21 2003-06-20 Shared sensors for detecting substrate position/presence

Publications (1)

Publication Number Publication Date
AU2003243737A1 true AU2003243737A1 (en) 2004-01-06

Family

ID=30000614

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003243737A Abandoned AU2003243737A1 (en) 2002-06-21 2003-06-20 Shared sensors for detecting substrate position/presence

Country Status (8)

Country Link
US (1) US6856858B2 (zh)
EP (1) EP1522088A2 (zh)
JP (1) JP4490263B2 (zh)
KR (1) KR100743322B1 (zh)
CN (1) CN100423180C (zh)
AU (1) AU2003243737A1 (zh)
TW (1) TWI283453B (zh)
WO (1) WO2004001818A2 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4486507B2 (ja) * 2003-01-02 2010-06-23 ローマ リンダ ユニヴァーシティ メディカル センター 陽子線治療システムのための構成管理及び読み出しシステム
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
US7107125B2 (en) * 2003-10-29 2006-09-12 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US7792350B2 (en) * 2003-11-10 2010-09-07 Brooks Automation, Inc. Wafer center finding
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US8634633B2 (en) 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US8313277B2 (en) * 2003-11-10 2012-11-20 Brooks Automation, Inc. Semiconductor manufacturing process modules
US7440091B2 (en) * 2004-10-26 2008-10-21 Applied Materials, Inc. Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
JP2007227781A (ja) * 2006-02-24 2007-09-06 Tokyo Electron Ltd 基板の位置ずれ検査機構，処理システム及び基板の位置ずれ検査方法
US20080219807A1 (en) * 2007-03-05 2008-09-11 Van Der Meulen Peter Semiconductor manufacturing process modules
US8099190B2 (en) * 2007-06-22 2012-01-17 Asm International N.V. Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured
JP2010016340A (ja) * 2008-07-02 2010-01-21 Advanced Display Process Engineering Co Ltd 基板感知方法、基板処理装置及び基板処理方法
US8276959B2 (en) 2008-08-08 2012-10-02 Applied Materials, Inc. Magnetic pad for end-effectors
US20100177076A1 (en) * 2009-01-13 2010-07-15 Metrologic Instruments, Inc. Edge-lit electronic-ink display device for use in indoor and outdoor environments
JP2011139074A (ja) * 2011-01-07 2011-07-14 Applied Materials Inc 基板の破損及び移動中の基板のずれを動的に検出するセンサ
WO2012124803A1 (ja) * 2011-03-16 2012-09-20 株式会社アルバック 搬送装置、真空装置
JP5639958B2 (ja) * 2011-05-27 2014-12-10 日東電工株式会社 半導体ウエハマウント方法および半導体ウエハマウント装置
CN104241162A (zh) * 2013-06-09 2014-12-24 上海和辉光电有限公司 撞片防护装置、涂布平台及其撞片防护方法
KR101548345B1 (ko) * 2014-04-10 2015-09-01 피에스케이 주식회사 기판 처리 장치, 기판 처리 방법, 그리고 기록 매체
US11862499B2 (en) * 2020-08-19 2024-01-02 Applied Materials, Inc. Multiplexing control of multiple positional sensors in device manufacturing machines
KR102487639B1 (ko) * 2022-05-03 2023-01-11 주식회사 이서 챔버의 상태를 모니터링하기 위한 참조 상태 데이터 생성 방법, 챔버의 상태를 모니터링하는 방법 및 챔버의 상태를 모니터링하는 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials Inc System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5452521A (en) * 1994-03-09 1995-09-26 Niewmierzycki; Leszek Workpiece alignment structure and method
JPH09102530A (ja) * 1995-06-07 1997-04-15 Varian Assoc Inc ウェーハの向き検査システム
EP0891840A4 (en) 1996-03-18 2000-01-19 Komatsu Mfg Co Ltd DEVICE FOR CONTROLLING A PARTS TRANSPORTATION SYSTEM
TW350115B (en) * 1996-12-02 1999-01-11 Toyota Automatic Loom Co Ltd Misregistration detection device and method thereof
US6190037B1 (en) * 1999-02-19 2001-02-20 Applied Materials, Inc. Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system
JP4389305B2 (ja) * 1999-10-06 2009-12-24 東京エレクトロン株式会社 処理装置
US6629053B1 (en) * 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
US6502054B1 (en) * 1999-11-22 2002-12-31 Lam Research Corporation Method of and apparatus for dynamic alignment of substrates
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
US6556887B2 (en) * 2001-07-12 2003-04-29 Applied Materials, Inc. Method for determining a position of a robot

Also Published As

Publication number Publication date
CN100423180C (zh) 2008-10-01
US20040055397A1 (en) 2004-03-25
CN1675743A (zh) 2005-09-28
KR100743322B1 (ko) 2007-07-26
US6856858B2 (en) 2005-02-15
WO2004001818A3 (en) 2004-02-19
TW200403793A (en) 2004-03-01
JP2005531150A (ja) 2005-10-13
EP1522088A2 (en) 2005-04-13
WO2004001818A2 (en) 2003-12-31
JP4490263B2 (ja) 2010-06-23
KR20050013598A (ko) 2005-02-04
TWI283453B (en) 2007-07-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase