AU2003225236A1 - Acrylic-based thermally conductive composition, sheet, and process - Google Patents

Acrylic-based thermally conductive composition, sheet, and process

Info

Publication number
AU2003225236A1
AU2003225236A1 AU2003225236A AU2003225236A AU2003225236A1 AU 2003225236 A1 AU2003225236 A1 AU 2003225236A1 AU 2003225236 A AU2003225236 A AU 2003225236A AU 2003225236 A AU2003225236 A AU 2003225236A AU 2003225236 A1 AU2003225236 A1 AU 2003225236A1
Authority
AU
Australia
Prior art keywords
acrylic
sheet
thermally conductive
conductive composition
based thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003225236A
Inventor
Yuji Hiroshige
Mitsuhiko Okada
Tomoya Tanzawa
Yoshinao Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2003225236A1 publication Critical patent/AU2003225236A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
AU2003225236A 2002-05-02 2003-04-30 Acrylic-based thermally conductive composition, sheet, and process Abandoned AU2003225236A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2002-130658 2002-05-02
JP2002130658 2002-05-02
JP2002-220243 2002-07-29
JP2002220243 2002-07-29
JP2003012689A JP4995403B2 (en) 2002-05-02 2003-01-21 Acrylic heat conductive composition forming composition, heat conductive sheet and method for producing the same
JP2003-012689 2003-01-21
PCT/US2003/013391 WO2003093336A1 (en) 2002-05-02 2003-04-30 Acrylic-based thermally conductive composition, sheet, and process

Publications (1)

Publication Number Publication Date
AU2003225236A1 true AU2003225236A1 (en) 2003-11-17

Family

ID=29407515

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003225236A Abandoned AU2003225236A1 (en) 2002-05-02 2003-04-30 Acrylic-based thermally conductive composition, sheet, and process

Country Status (4)

Country Link
JP (1) JP4995403B2 (en)
AU (1) AU2003225236A1 (en)
TW (1) TW200400226A (en)
WO (1) WO2003093336A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200508379A (en) 2003-05-19 2005-03-01 Nippon Catalytic Chem Ind Resin composition for thermally conductive material and thermally conductive material
JP5175022B2 (en) * 2004-06-14 2013-04-03 スリーエム イノベイティブ プロパティズ カンパニー Multi-layer thermal conductive sheet
JP5169293B2 (en) * 2008-02-20 2013-03-27 日本ゼオン株式会社 Acrylic resin composition, heat conductive pressure-sensitive adhesive sheet comprising the acrylic resin composition, method for producing the heat conductive pressure-sensitive adhesive sheet, and composite comprising a substrate and the heat conductive pressure-sensitive adhesive sheet
JP2009120841A (en) * 2008-12-18 2009-06-04 Three M Innovative Properties Co Acrylic thermally conductive composition and article including the same
KR101125266B1 (en) * 2010-02-17 2012-03-21 그린스타 주식회사 Heat radiating sheet comprising adhesives with improved heat conductivity
CN105504187A (en) * 2010-06-16 2016-04-20 旭硝子株式会社 Curable resin composition, laminate comprising same, and process for production of laminate
TWI466967B (en) * 2010-10-27 2015-01-01 Ind Tech Res Inst Temperature resistant low-emissive paint and method for fabricating the same
JP5909911B2 (en) * 2011-07-29 2016-04-27 住友ベークライト株式会社 Liquid resin composition and semiconductor device
CN102433092B (en) * 2011-09-05 2013-06-05 青岛海信电器股份有限公司 Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof
JP6153702B2 (en) * 2012-05-08 2017-06-28 東洋ゴム工業株式会社 Variable thermal conductivity material
JP2014005319A (en) * 2012-06-21 2014-01-16 Nitto Denko Corp Thermally conductive adhesive composition
JP5921970B2 (en) * 2012-06-21 2016-05-24 日東電工株式会社 Thermally conductive adhesive composition
JP6123547B2 (en) * 2013-07-26 2017-05-10 日立化成株式会社 Circuit connection material, circuit connection structure, method for manufacturing circuit connection structure, adhesive composition, and adhesive sheet
CN107851769B (en) * 2015-08-31 2021-06-18 松下知识产权经营株式会社 Nonaqueous electrolyte secondary battery
CN106893017B (en) 2015-12-17 2019-12-24 财团法人工业技术研究院 Protective material, protective structure and protective method
JP6746540B2 (en) * 2017-07-24 2020-08-26 積水化学工業株式会社 Heat conduction sheet
KR102570517B1 (en) * 2018-03-29 2023-08-24 미쯔비시 케미컬 주식회사 Adhesive sheet, laminated sheet, and image display device using the same
WO2024018978A1 (en) * 2022-07-19 2024-01-25 株式会社巴川製紙所 Resin layer, grease composition, and electronic device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3920605A (en) * 1970-12-24 1975-11-18 Mitsubishi Rayon Co Metal-containing organic high molecular compound reinforced with particulate organic or inorganic material
CA2093191A1 (en) * 1992-04-15 1993-10-16 Richard J. Webb Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa
US5395876A (en) * 1993-04-19 1995-03-07 Acheson Industries, Inc. Surface mount conductive adhesives
KR20000057373A (en) * 1996-12-04 2000-09-15 가마이 고로 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same
US5968606A (en) * 1997-06-30 1999-10-19 Ferro Corporation Screen printable UV curable conductive material composition
JPH11269438A (en) * 1998-03-25 1999-10-05 Dainippon Ink & Chem Inc Heat-conductive flame-retardant pressure-sensitive adhesive and pressure-sensitive adhesive tape
JP4333852B2 (en) * 1998-05-11 2009-09-16 綜研化学株式会社 Method for producing solvent-free acrylic sheet
JP4660949B2 (en) * 2001-03-27 2011-03-30 日本ゼオン株式会社 Pressure-sensitive adhesive composition and sheet using the same
JP4736231B2 (en) * 2001-04-27 2011-07-27 日本ゼオン株式会社 Method for producing pressure-sensitive adhesive composition

Also Published As

Publication number Publication date
JP4995403B2 (en) 2012-08-08
TW200400226A (en) 2004-01-01
WO2003093336A1 (en) 2003-11-13
JP2006111644A (en) 2006-04-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase