AU2003215944A8 - An improved thermal conducting system and laminates produced thereform - Google Patents
An improved thermal conducting system and laminates produced thereformInfo
- Publication number
- AU2003215944A8 AU2003215944A8 AU2003215944A AU2003215944A AU2003215944A8 AU 2003215944 A8 AU2003215944 A8 AU 2003215944A8 AU 2003215944 A AU2003215944 A AU 2003215944A AU 2003215944 A AU2003215944 A AU 2003215944A AU 2003215944 A8 AU2003215944 A8 AU 2003215944A8
- Authority
- AU
- Australia
- Prior art keywords
- improved thermal
- thermal conducting
- conducting system
- laminates produced
- produced thereform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0015645 | 2002-03-22 | ||
KR20020015645 | 2002-03-22 | ||
PCT/KR2003/000549 WO2003095204A1 (en) | 2002-03-22 | 2003-03-21 | An improved thermal conducting system and laminates produced thereform |
KR1020030017643A KR100575546B1 (en) | 2002-03-22 | 2003-03-21 | An improved thermal conducting system and laminates produced therefrom |
KR10-2003-0017643 | 2003-03-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003215944A1 AU2003215944A1 (en) | 2003-11-11 |
AU2003215944A8 true AU2003215944A8 (en) | 2003-11-11 |
Family
ID=29422499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003215944A Abandoned AU2003215944A1 (en) | 2002-03-22 | 2003-03-21 | An improved thermal conducting system and laminates produced thereform |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2003215944A1 (en) |
WO (1) | WO2003095204A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI0820472A2 (en) | 2007-11-09 | 2016-11-08 | Nordam Group Inc | dual panel manufacturing |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0640041B1 (en) * | 1992-05-05 | 1996-10-09 | Cedal S.R.L. | Process for producing plastic laminates with metal laminae, especially for printed circuits |
IT1272106B (en) * | 1993-03-18 | 1997-06-11 | Cedal Srl | SYSTEM FOR THE AUTOMATIC CONNECTION BETWEEN THE ELECTRICITY SOURCE AND THE STACKS OF PLASTIC LAMINATE PACKAGES, IN THE ENDOTHERMAL HEATING. |
-
2003
- 2003-03-21 WO PCT/KR2003/000549 patent/WO2003095204A1/en not_active Application Discontinuation
- 2003-03-21 AU AU2003215944A patent/AU2003215944A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2003095204A1 (en) | 2003-11-20 |
AU2003215944A1 (en) | 2003-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase | ||
TH | Corrigenda |
Free format text: IN VOL 18, NO 2, PAGE(S) 499 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME CSS TECHNOLOGIES CO., LTD., APPLICATION NO. 2003215944, UNDER INID (71) CORRECT THE NAME TO READ CSS TECHNOLOGIES CO., LTD.; ANICO CORPORATION |
|
TH | Corrigenda |
Free format text: IN VOL 18, NO 2, PAGE(S) 499 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME CSS TECHNOLOGIES CO., LTD., APPLICATION NO. 2003215944, UNDER INID (43) CORRECT THE PUBLICATION DATE TO READ 24.11.2003 |