AU2003215944A1 - An improved thermal conducting system and laminates produced thereform - Google Patents

An improved thermal conducting system and laminates produced thereform

Info

Publication number
AU2003215944A1
AU2003215944A1 AU2003215944A AU2003215944A AU2003215944A1 AU 2003215944 A1 AU2003215944 A1 AU 2003215944A1 AU 2003215944 A AU2003215944 A AU 2003215944A AU 2003215944 A AU2003215944 A AU 2003215944A AU 2003215944 A1 AU2003215944 A1 AU 2003215944A1
Authority
AU
Australia
Prior art keywords
improved thermal
thermal conducting
conducting system
laminates produced
produced thereform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003215944A
Other versions
AU2003215944A8 (en
Inventor
Myung Chul Chu
W. Jaewoo Shim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANICO Corp
CSS TECHNOLOGIES Co Ltd
Original Assignee
CSS TECHNOLOGIES CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CSS TECHNOLOGIES CO Ltd filed Critical CSS TECHNOLOGIES CO Ltd
Priority claimed from KR1020030017643A external-priority patent/KR100575546B1/en
Publication of AU2003215944A1 publication Critical patent/AU2003215944A1/en
Publication of AU2003215944A8 publication Critical patent/AU2003215944A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
AU2003215944A 2002-03-22 2003-03-21 An improved thermal conducting system and laminates produced thereform Abandoned AU2003215944A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR20020015645 2002-03-22
KR10-2002-0015645 2002-03-22
KR1020030017643A KR100575546B1 (en) 2002-03-22 2003-03-21 An improved thermal conducting system and laminates produced therefrom
PCT/KR2003/000549 WO2003095204A1 (en) 2002-03-22 2003-03-21 An improved thermal conducting system and laminates produced thereform
KR10-2003-0017643 2003-03-21

Publications (2)

Publication Number Publication Date
AU2003215944A1 true AU2003215944A1 (en) 2003-11-11
AU2003215944A8 AU2003215944A8 (en) 2003-11-11

Family

ID=29422499

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003215944A Abandoned AU2003215944A1 (en) 2002-03-22 2003-03-21 An improved thermal conducting system and laminates produced thereform

Country Status (2)

Country Link
AU (1) AU2003215944A1 (en)
WO (1) WO2003095204A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2704004C (en) * 2007-11-09 2015-07-21 The Nordam Group, Inc. Dual panel fabrication

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0640041B1 (en) * 1992-05-05 1996-10-09 Cedal S.R.L. Process for producing plastic laminates with metal laminae, especially for printed circuits
IT1272106B (en) * 1993-03-18 1997-06-11 Cedal Srl SYSTEM FOR THE AUTOMATIC CONNECTION BETWEEN THE ELECTRICITY SOURCE AND THE STACKS OF PLASTIC LAMINATE PACKAGES, IN THE ENDOTHERMAL HEATING.

Also Published As

Publication number Publication date
WO2003095204A1 (en) 2003-11-20
AU2003215944A8 (en) 2003-11-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
TH Corrigenda

Free format text: IN VOL 18, NO 2, PAGE(S) 499 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME CSS TECHNOLOGIES CO., LTD., APPLICATION NO. 2003215944, UNDER INID (71) CORRECT THE NAME TO READ CSS TECHNOLOGIES CO., LTD.; ANICO CORPORATION

TH Corrigenda

Free format text: IN VOL 18, NO 2, PAGE(S) 499 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME CSS TECHNOLOGIES CO., LTD., APPLICATION NO. 2003215944, UNDER INID (43) CORRECT THE PUBLICATION DATE TO READ 24.11.2003