AU2002315828A1 - Rotary heat sink - Google Patents

Rotary heat sink

Info

Publication number
AU2002315828A1
AU2002315828A1 AU2002315828A AU2002315828A AU2002315828A1 AU 2002315828 A1 AU2002315828 A1 AU 2002315828A1 AU 2002315828 A AU2002315828 A AU 2002315828A AU 2002315828 A AU2002315828 A AU 2002315828A AU 2002315828 A1 AU2002315828 A1 AU 2002315828A1
Authority
AU
Australia
Prior art keywords
heat sink
rotary heat
rotary
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002315828A
Inventor
Hidetaka Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of AU2002315828A1 publication Critical patent/AU2002315828A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Motor Or Generator Cooling System (AREA)
AU2002315828A 2002-06-20 2002-06-20 Rotary heat sink Abandoned AU2002315828A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/006186 WO2004001845A1 (en) 2002-06-20 2002-06-20 Rotary heat sink

Publications (1)

Publication Number Publication Date
AU2002315828A1 true AU2002315828A1 (en) 2004-01-06

Family

ID=29808126

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002315828A Abandoned AU2002315828A1 (en) 2002-06-20 2002-06-20 Rotary heat sink

Country Status (3)

Country Link
JP (1) JP4141439B2 (en)
AU (1) AU2002315828A1 (en)
WO (1) WO2004001845A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9207023B2 (en) 2007-12-18 2015-12-08 Sandia Corporation Heat exchanger device and method for heat removal or transfer
CN102112939B (en) * 2008-08-04 2016-01-13 桑迪亚国家实验室 Remove for heat or the heat exchanger device of heat trnasfer and method
KR101414642B1 (en) * 2009-11-20 2014-07-03 엘지전자 주식회사 Heat-dissipating apparatus
US9244065B1 (en) 2012-03-16 2016-01-26 Sandia Corporation Systems, devices, and methods for agglutination assays using sedimentation

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH056950A (en) * 1991-02-28 1993-01-14 Mitsubishi Electric Corp Heat exchanger and heat exchanging method and cooling device
JPH06132434A (en) * 1992-10-20 1994-05-13 Hitachi Ltd Fan-mounted semiconductor device
JP2727957B2 (en) * 1994-03-16 1998-03-18 日本電気株式会社 Heat sink for semiconductor device
JP2000009090A (en) * 1998-06-23 2000-01-11 Matsushita Electric Ind Co Ltd Cooling fan and heat sink device using it
JP2001178075A (en) * 1999-12-13 2001-06-29 Seiko Instruments Inc Method and device for heat-treating fluid bearing motor

Also Published As

Publication number Publication date
JP4141439B2 (en) 2008-08-27
WO2004001845A1 (en) 2003-12-31
JPWO2004001845A1 (en) 2005-10-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase