US6373740B1
(en)
*
|
1999-07-30 |
2002-04-16 |
Micron Technology, Inc. |
Transmission lines for CMOS integrated circuits
|
US7554829B2
(en)
*
|
1999-07-30 |
2009-06-30 |
Micron Technology, Inc. |
Transmission lines for CMOS integrated circuits
|
US6555858B1
(en)
*
|
2000-11-15 |
2003-04-29 |
Motorola, Inc. |
Self-aligned magnetic clad write line and its method of formation
|
DE10059181C2
(en)
*
|
2000-11-29 |
2002-10-24 |
Infineon Technologies Ag |
Integrated magnetoresistive semiconductor memory and manufacturing process therefor
|
US6413788B1
(en)
*
|
2001-02-28 |
2002-07-02 |
Micron Technology, Inc. |
Keepers for MRAM electrodes
|
US6475812B2
(en)
*
|
2001-03-09 |
2002-11-05 |
Hewlett Packard Company |
Method for fabricating cladding layer in top conductor
|
US6780652B2
(en)
*
|
2001-03-15 |
2004-08-24 |
Micron Technology, Inc. |
Self-aligned MRAM contact and method of fabrication
|
US6689661B2
(en)
*
|
2001-04-10 |
2004-02-10 |
Micron Technology, Inc. |
Method for forming minimally spaced MRAM structures
|
US6682943B2
(en)
*
|
2001-04-27 |
2004-01-27 |
Micron Technology, Inc. |
Method for forming minimally spaced MRAM structures
|
US6504221B1
(en)
*
|
2001-09-25 |
2003-01-07 |
Hewlett-Packard Company |
Magneto-resistive device including soft reference layer having embedded conductors
|
JP4032695B2
(en)
*
|
2001-10-23 |
2008-01-16 |
ソニー株式会社 |
Magnetic memory device
|
US6636436B2
(en)
*
|
2001-10-25 |
2003-10-21 |
Hewlett-Packard Development Company, L.P. |
Isolation of memory cells in cross point arrays
|
US6717194B2
(en)
*
|
2001-10-30 |
2004-04-06 |
Micron Technology, Inc. |
Magneto-resistive bit structure and method of manufacture therefor
|
US6661688B2
(en)
*
|
2001-12-05 |
2003-12-09 |
Hewlett-Packard Development Company, L.P. |
Method and article for concentrating fields at sense layers
|
KR100450794B1
(en)
*
|
2001-12-13 |
2004-10-01 |
삼성전자주식회사 |
Magnetic random access memory and operating method thereof
|
US6743641B2
(en)
|
2001-12-20 |
2004-06-01 |
Micron Technology, Inc. |
Method of improving surface planarity prior to MRAM bit material deposition
|
US6735111B2
(en)
*
|
2002-01-16 |
2004-05-11 |
Micron Technology, Inc. |
Magnetoresistive memory devices and assemblies
|
US7101770B2
(en)
*
|
2002-01-30 |
2006-09-05 |
Micron Technology, Inc. |
Capacitive techniques to reduce noise in high speed interconnections
|
US6927072B2
(en)
|
2002-03-08 |
2005-08-09 |
Freescale Semiconductor, Inc. |
Method of applying cladding material on conductive lines of MRAM devices
|
US6812040B2
(en)
*
|
2002-03-12 |
2004-11-02 |
Freescale Semiconductor, Inc. |
Method of fabricating a self-aligned via contact for a magnetic memory element
|
US6846738B2
(en)
*
|
2002-03-13 |
2005-01-25 |
Micron Technology, Inc. |
High permeability composite films to reduce noise in high speed interconnects
|
US7235457B2
(en)
*
|
2002-03-13 |
2007-06-26 |
Micron Technology, Inc. |
High permeability layered films to reduce noise in high speed interconnects
|
US6900116B2
(en)
*
|
2002-03-13 |
2005-05-31 |
Micron Technology Inc. |
High permeability thin films and patterned thin films to reduce noise in high speed interconnections
|
US6897532B1
(en)
*
|
2002-04-15 |
2005-05-24 |
Cypress Semiconductor Corp. |
Magnetic tunneling junction configuration and a method for making the same
|
US6783995B2
(en)
*
|
2002-04-30 |
2004-08-31 |
Micron Technology, Inc. |
Protective layers for MRAM devices
|
JP2003324187A
(en)
*
|
2002-05-01 |
2003-11-14 |
Sony Corp |
Method for manufacturing magnetic memory device and magnetic memory device
|
US7160577B2
(en)
|
2002-05-02 |
2007-01-09 |
Micron Technology, Inc. |
Methods for atomic-layer deposition of aluminum oxides in integrated circuits
|
US6846683B2
(en)
*
|
2002-05-10 |
2005-01-25 |
Infineon Technologies Ag |
Method of forming surface-smoothing layer for semiconductor devices with magnetic material layers
|
US6716644B2
(en)
*
|
2002-05-17 |
2004-04-06 |
Micron Technology, Inc. |
Method for forming MRAM bit having a bottom sense layer utilizing electroless plating
|
US6770491B2
(en)
*
|
2002-08-07 |
2004-08-03 |
Micron Technology, Inc. |
Magnetoresistive memory and method of manufacturing the same
|
US6914805B2
(en)
*
|
2002-08-21 |
2005-07-05 |
Micron Technology, Inc. |
Method for building a magnetic keeper or flux concentrator used for writing magnetic bits on a MRAM device
|
US6737283B2
(en)
*
|
2002-08-29 |
2004-05-18 |
Micron Technology, Inc. |
Method to isolate device layer edges through mechanical spacing
|
US6822278B1
(en)
*
|
2002-09-11 |
2004-11-23 |
Silicon Magnetic Systems |
Localized field-inducding line and method for making the same
|
KR100496860B1
(en)
*
|
2002-09-19 |
2005-06-22 |
삼성전자주식회사 |
Magneto-resistive memory device and method for fabricating the same
|
KR100515053B1
(en)
*
|
2002-10-02 |
2005-09-14 |
삼성전자주식회사 |
Magnetic memory device implementing read operation tolerant of bitline clamp voltage(VREF)
|
JP3906139B2
(en)
*
|
2002-10-16 |
2007-04-18 |
株式会社東芝 |
Magnetic random access memory
|
US20040087163A1
(en)
*
|
2002-10-30 |
2004-05-06 |
Robert Steimle |
Method for forming magnetic clad bit line
|
US7183120B2
(en)
*
|
2002-10-31 |
2007-02-27 |
Honeywell International Inc. |
Etch-stop material for improved manufacture of magnetic devices
|
US6740947B1
(en)
*
|
2002-11-13 |
2004-05-25 |
Hewlett-Packard Development Company, L.P. |
MRAM with asymmetric cladded conductor
|
US6943038B2
(en)
*
|
2002-12-19 |
2005-09-13 |
Freescale Semiconductor, Inc. |
Method for fabricating a flux concentrating system for use in a magnetoelectronics device
|
US6841826B2
(en)
*
|
2003-01-15 |
2005-01-11 |
International Business Machines Corporation |
Low-GIDL MOSFET structure and method for fabrication
|
US6765823B1
(en)
|
2003-01-29 |
2004-07-20 |
Micron Technology Incorporated |
Magnetic memory cell with shape anisotropy
|
US6818549B2
(en)
*
|
2003-03-05 |
2004-11-16 |
Hewlett-Packard Development Company, L.P. |
Buried magnetic tunnel-junction memory cell and methods
|
US6798004B1
(en)
*
|
2003-04-22 |
2004-09-28 |
Freescale Semiconductor, Inc. |
Magnetoresistive random access memory devices and methods for fabricating the same
|
US6970053B2
(en)
*
|
2003-05-22 |
2005-11-29 |
Micron Technology, Inc. |
Atomic layer deposition (ALD) high permeability layered magnetic films to reduce noise in high speed interconnection
|
US6784091B1
(en)
*
|
2003-06-05 |
2004-08-31 |
International Business Machines Corporation |
Maskless array protection process flow for forming interconnect vias in magnetic random access memory devices
|
JP4329414B2
(en)
*
|
2003-06-06 |
2009-09-09 |
ソニー株式会社 |
Method for manufacturing magnetic storage device
|
JP2005072139A
(en)
*
|
2003-08-21 |
2005-03-17 |
Sony Corp |
Magnetic storage and its manufacturing method
|
KR100555514B1
(en)
*
|
2003-08-22 |
2006-03-03 |
삼성전자주식회사 |
Semiconductor memory device having tungsten line with low resistance and method for manufacturing the same
|
US7078239B2
(en)
|
2003-09-05 |
2006-07-18 |
Micron Technology, Inc. |
Integrated circuit structure formed by damascene process
|
US7264975B1
(en)
|
2003-09-25 |
2007-09-04 |
Cypress Semiconductor Corp. |
Metal profile for increased local magnetic fields in MRAM devices and method for making the same
|
KR20060125713A
(en)
*
|
2003-10-06 |
2006-12-06 |
코닌클리즈케 필립스 일렉트로닉스 엔.브이. |
Magnetic field shaping conductor
|
US6900491B2
(en)
*
|
2003-10-06 |
2005-05-31 |
Hewlett-Packard Development Company, L.P. |
Magnetic memory
|
US6937506B2
(en)
*
|
2004-01-08 |
2005-08-30 |
Hewlett-Packard Development Company, L.P. |
Magnetic memory device
|
KR20050077157A
(en)
*
|
2004-01-27 |
2005-08-01 |
삼성전자주식회사 |
Mram device and method of fabricating the same
|
JP2005260082A
(en)
*
|
2004-03-12 |
2005-09-22 |
Toshiba Corp |
Magnetic random access memory
|
US6946698B1
(en)
|
2004-04-02 |
2005-09-20 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
MRAM device having low-k inter-metal dielectric
|
US7330369B2
(en)
*
|
2004-04-06 |
2008-02-12 |
Bao Tran |
NANO-electronic memory array
|
US7211874B2
(en)
*
|
2004-04-06 |
2007-05-01 |
Headway Technologies, Inc. |
Magnetic random access memory array with free layer locking mechanism
|
US7102921B2
(en)
*
|
2004-05-11 |
2006-09-05 |
Hewlett-Packard Development Company, L.P. |
Magnetic memory device
|
US20060039183A1
(en)
*
|
2004-05-21 |
2006-02-23 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Multi-sensing level MRAM structures
|
JP2005340366A
(en)
*
|
2004-05-25 |
2005-12-08 |
Toshiba Corp |
Magnetic storage device and its manufacturing method
|
US20070279971A1
(en)
*
|
2004-06-04 |
2007-12-06 |
Micron Technology, Inc. |
Modified pseudo-spin valve (psv) for memory applications
|
US7374952B2
(en)
*
|
2004-06-17 |
2008-05-20 |
Infineon Technologies Ag |
Methods of patterning a magnetic stack of a magnetic memory cell and structures thereof
|
US7368299B2
(en)
*
|
2004-07-14 |
2008-05-06 |
Infineon Technologies Ag |
MTJ patterning using free layer wet etching and lift off techniques
|
US7132707B2
(en)
|
2004-08-03 |
2006-11-07 |
Headway Technologies, Inc. |
Magnetic random access memory array with proximate read and write lines cladded with magnetic material
|
JP4828807B2
(en)
*
|
2004-07-20 |
2011-11-30 |
ルネサスエレクトロニクス株式会社 |
Magnetic storage device and manufacturing method thereof
|
KR100660539B1
(en)
*
|
2004-07-29 |
2006-12-22 |
삼성전자주식회사 |
Magnetic memory devices and methods of forming the same
|
US7221584B2
(en)
*
|
2004-08-13 |
2007-05-22 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
MRAM cell having shared configuration
|
TWI266413B
(en)
*
|
2004-11-09 |
2006-11-11 |
Ind Tech Res Inst |
Magnetic random access memory with lower bit line current and manufacture method thereof
|
US7623319B2
(en)
*
|
2004-11-30 |
2009-11-24 |
Hitachi Global Storage Technologies Netherlands B.V. |
Electrical connection structure for magnetic heads and method for making the same
|
US7751333B2
(en)
*
|
2004-12-29 |
2010-07-06 |
Intel Corporation |
Method and apparatus to couple a module to a management controller on an interconnect
|
US7087972B1
(en)
*
|
2005-01-31 |
2006-08-08 |
Freescale Semiconductor, Inc. |
Magnetoelectronic devices utilizing protective capping layers and methods of fabricating the same
|
KR100626390B1
(en)
*
|
2005-02-07 |
2006-09-20 |
삼성전자주식회사 |
Magnetic random access memory devices and methods of forming the same
|
US7545662B2
(en)
*
|
2005-03-25 |
2009-06-09 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method and system for magnetic shielding in semiconductor integrated circuit
|
US7241632B2
(en)
|
2005-04-14 |
2007-07-10 |
Headway Technologies, Inc. |
MTJ read head with sidewall spacers
|
US8237140B2
(en)
|
2005-06-17 |
2012-08-07 |
Macronix International Co., Ltd. |
Self-aligned, embedded phase change RAM
|
US7696503B2
(en)
*
|
2005-06-17 |
2010-04-13 |
Macronix International Co., Ltd. |
Multi-level memory cell having phase change element and asymmetrical thermal boundary
|
US7927948B2
(en)
|
2005-07-20 |
2011-04-19 |
Micron Technology, Inc. |
Devices with nanocrystals and methods of formation
|
US7444738B2
(en)
*
|
2005-07-29 |
2008-11-04 |
Everspin Technologies, Inc. |
Method for tunnel junction sensor with magnetic cladding
|
US7541804B2
(en)
*
|
2005-07-29 |
2009-06-02 |
Everspin Technologies, Inc. |
Magnetic tunnel junction sensor
|
US7880249B2
(en)
|
2005-11-30 |
2011-02-01 |
Magic Technologies, Inc. |
Spacer structure in MRAM cell and method of its fabrication
|
US7741636B2
(en)
|
2006-01-09 |
2010-06-22 |
Macronix International Co., Ltd. |
Programmable resistive RAM and manufacturing method
|
UA90089C2
(en)
*
|
2006-02-08 |
2010-04-12 |
Григорий БЕРЕЗИН |
Method for production of coke from the non-coking ranks of coal and the apparatus for its realization
|
KR100763910B1
(en)
|
2006-02-23 |
2007-10-05 |
삼성전자주식회사 |
Magnetic memory device using magnetic domain dragging
|
US8395199B2
(en)
*
|
2006-03-25 |
2013-03-12 |
4D-S Pty Ltd. |
Systems and methods for fabricating self-aligned memory cell
|
US7608848B2
(en)
|
2006-05-09 |
2009-10-27 |
Macronix International Co., Ltd. |
Bridge resistance random access memory device with a singular contact structure
|
US7732800B2
(en)
*
|
2006-05-30 |
2010-06-08 |
Macronix International Co., Ltd. |
Resistor random access memory cell with L-shaped electrode
|
US7772581B2
(en)
*
|
2006-09-11 |
2010-08-10 |
Macronix International Co., Ltd. |
Memory device having wide area phase change element and small electrode contact area
|
KR100883806B1
(en)
*
|
2007-01-02 |
2009-02-17 |
삼성전자주식회사 |
Semiconductor device and method of forming the same
|
US8138028B2
(en)
|
2007-02-12 |
2012-03-20 |
Macronix International Co., Ltd |
Method for manufacturing a phase change memory device with pillar bottom electrode
|
JP5080102B2
(en)
*
|
2007-02-27 |
2012-11-21 |
ルネサスエレクトロニクス株式会社 |
Magnetic storage device manufacturing method and magnetic storage device
|
US20080308885A1
(en)
*
|
2007-06-12 |
2008-12-18 |
United Microelectronics Corp. |
Magnetic random access memory and fabricating method thereof
|
KR100881055B1
(en)
*
|
2007-06-20 |
2009-01-30 |
삼성전자주식회사 |
Phase-change memory unit, method of forming the phase-change memory unit, phase-change memory device having the phase-change memory unit and method of manufacturing the phase-change memory device
|
US8178386B2
(en)
|
2007-09-14 |
2012-05-15 |
Macronix International Co., Ltd. |
Phase change memory cell array with self-converged bottom electrode and method for manufacturing
|
US8158965B2
(en)
*
|
2008-02-05 |
2012-04-17 |
Macronix International Co., Ltd. |
Heating center PCRAM structure and methods for making
|
DE102008044964B4
(en)
*
|
2008-08-29 |
2015-12-17 |
Globalfoundries Dresden Module One Limited Liability Company & Co. Kg |
Reduction of leakage currents and dielectric breakdown in dielectric materials of metallization systems of semiconductor devices through the production of recesses
|
US8829646B2
(en)
*
|
2009-04-27 |
2014-09-09 |
Macronix International Co., Ltd. |
Integrated circuit 3D memory array and manufacturing method
|
JP2011009531A
(en)
*
|
2009-06-26 |
2011-01-13 |
Tdk Corp |
Spin transport device
|
US8169816B2
(en)
*
|
2009-09-15 |
2012-05-01 |
Magic Technologies, Inc. |
Fabrication methods of partial cladded write line to enhance write margin for magnetic random access memory
|
JP2009296010A
(en)
*
|
2009-09-17 |
2009-12-17 |
Renesas Technology Corp |
Semiconductor device
|
JP2011233835A
(en)
*
|
2010-04-30 |
2011-11-17 |
Toshiba Corp |
Semiconductor memory and method of manufacturing the same
|
US8310864B2
(en)
|
2010-06-15 |
2012-11-13 |
Macronix International Co., Ltd. |
Self-aligned bit line under word line memory array
|
US9082954B2
(en)
|
2010-09-24 |
2015-07-14 |
Macronix International Co., Ltd. |
PCRAM with current flowing laterally relative to axis defined by electrodes
|
US8497182B2
(en)
|
2011-04-19 |
2013-07-30 |
Macronix International Co., Ltd. |
Sidewall thin film electrode with self-aligned top electrode and programmable resistance memory
|
KR20130016827A
(en)
*
|
2011-08-09 |
2013-02-19 |
에스케이하이닉스 주식회사 |
Semiconductor device and method for fabricating the same
|
EP2743092A4
(en)
*
|
2011-08-10 |
2015-04-01 |
Taiyo Chemical Industry Co Ltd |
Structure including thin primer film, and process for producing said structure
|
US8987700B2
(en)
|
2011-12-02 |
2015-03-24 |
Macronix International Co., Ltd. |
Thermally confined electrode for programmable resistance memory
|
US8981330B2
(en)
|
2012-07-16 |
2015-03-17 |
Macronix International Co., Ltd. |
Thermally-confined spacer PCM cells
|
US8901687B2
(en)
|
2012-11-27 |
2014-12-02 |
Industrial Technology Research Institute |
Magnetic device with a substrate, a sensing block and a repair layer
|
US9214351B2
(en)
|
2013-03-12 |
2015-12-15 |
Macronix International Co., Ltd. |
Memory architecture of thin film 3D array
|
US8916414B2
(en)
|
2013-03-13 |
2014-12-23 |
Macronix International Co., Ltd. |
Method for making memory cell by melting phase change material in confined space
|
CN104716257A
(en)
*
|
2013-12-12 |
2015-06-17 |
中芯国际集成电路制造(上海)有限公司 |
Semiconductor device manufacturing method
|
CN104733607B
(en)
*
|
2013-12-20 |
2017-08-01 |
中芯国际集成电路制造(上海)有限公司 |
A kind of semiconductor devices and its manufacture method
|
CN104810325B
(en)
*
|
2014-01-23 |
2018-11-16 |
中芯国际集成电路制造(上海)有限公司 |
A kind of manufacturing method of semiconductor devices
|
CN104966717B
(en)
|
2014-01-24 |
2018-04-13 |
旺宏电子股份有限公司 |
A kind of storage arrangement and the method that the storage arrangement is provided
|
US9472749B2
(en)
|
2014-03-20 |
2016-10-18 |
International Business Machines Corporation |
Armature-clad MRAM device
|
US9559113B2
(en)
|
2014-05-01 |
2017-01-31 |
Macronix International Co., Ltd. |
SSL/GSL gate oxide in 3D vertical channel NAND
|
US9716064B2
(en)
*
|
2015-08-14 |
2017-07-25 |
International Business Machines Corporation |
Electrical fuse and/or resistor structures
|
US10418415B2
(en)
*
|
2016-03-28 |
2019-09-17 |
Intel Corporation |
Interconnect capping process for integration of MRAM devices and the resulting structures
|
US9793323B1
(en)
|
2016-07-11 |
2017-10-17 |
Macronix International Co., Ltd. |
Phase change memory with high endurance
|
US10403424B2
(en)
|
2017-06-09 |
2019-09-03 |
Texas Instruments Incorporated |
Method to form magnetic core for integrated magnetic devices
|
US10361120B2
(en)
|
2017-11-30 |
2019-07-23 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Conductive feature formation and structure
|