AU2002228179A1 - Micro-element substrate interconnection - Google Patents

Micro-element substrate interconnection

Info

Publication number
AU2002228179A1
AU2002228179A1 AU2002228179A AU2002228179A AU2002228179A1 AU 2002228179 A1 AU2002228179 A1 AU 2002228179A1 AU 2002228179 A AU2002228179 A AU 2002228179A AU 2002228179 A AU2002228179 A AU 2002228179A AU 2002228179 A1 AU2002228179 A1 AU 2002228179A1
Authority
AU
Australia
Prior art keywords
micro
element substrate
substrate interconnection
interconnection
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002228179A
Inventor
David Barrow
Kostas Bouris
Peter A. Ivey
Nicholas L. Seed
Gavin L. Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Sheffield
Cardiff University
Original Assignee
University of Sheffield
Cardiff University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Sheffield, Cardiff University filed Critical University of Sheffield
Publication of AU2002228179A1 publication Critical patent/AU2002228179A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2002228179A 2001-01-30 2002-01-30 Micro-element substrate interconnection Abandoned AU2002228179A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0102326.6 2001-01-30
GB0102326A GB2371674A (en) 2001-01-30 2001-01-30 Micro-element package
PCT/GB2002/000399 WO2002060810A2 (en) 2001-01-30 2002-01-30 Micro-element substrate interconnection

Publications (1)

Publication Number Publication Date
AU2002228179A1 true AU2002228179A1 (en) 2002-08-12

Family

ID=9907770

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002228179A Abandoned AU2002228179A1 (en) 2001-01-30 2002-01-30 Micro-element substrate interconnection

Country Status (3)

Country Link
AU (1) AU2002228179A1 (en)
GB (1) GB2371674A (en)
WO (1) WO2002060810A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2395196B (en) 2002-11-14 2006-12-27 Univ Cardiff Microfluidic device and methods for construction and application
WO2005001933A2 (en) * 2003-06-28 2005-01-06 Infineon Technologies Ag Multichip semi-conductor component and method for the production thereof
NL1024486C2 (en) * 2003-10-08 2005-04-11 Lionix B V Coupling a component of a module to a component of a motherboard comprises using rigid coupling elements with passages for the exchange of signals between the two components
JP4148201B2 (en) * 2004-08-11 2008-09-10 ソニー株式会社 Electronic circuit equipment
JP2009521123A (en) 2005-12-22 2009-05-28 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Electronic device, housing part, and housing part manufacturing method
US10197465B2 (en) 2017-01-12 2019-02-05 Honeywell International Inc. O-ring internal seal for pressure sensor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2253627A1 (en) * 1972-11-02 1974-05-16 Philips Patentverwaltung ELECTRICAL COMPONENT IN MICRO-TECHNOLOGY, PREFERABLY SEMICONDUCTOR COMPONENT
GB2094005B (en) * 1981-02-03 1985-05-30 Coal Industry Patents Ltd Electrochemical gas sensor
GB2167228B (en) * 1984-10-11 1988-05-05 Anamartic Ltd Integrated circuit package
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5668408A (en) * 1996-04-12 1997-09-16 Hewlett-Packard Company Pin grid array solution for microwave multi-chip modules
JP2828055B2 (en) * 1996-08-19 1998-11-25 日本電気株式会社 Flip chip manufacturing method
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US6065864A (en) * 1997-01-24 2000-05-23 The Regents Of The University Of California Apparatus and method for planar laminar mixing
DE19964218C2 (en) * 1999-10-08 2003-04-10 Hahn Schickard Ges Electromechanical component with a polymer body and method for producing the same

Also Published As

Publication number Publication date
GB2371674A (en) 2002-07-31
GB0102326D0 (en) 2001-03-14
WO2002060810A3 (en) 2003-09-04
WO2002060810A2 (en) 2002-08-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase