AU2002224425A1 - Pad quick release device for chemical mechanical planarization - Google Patents

Pad quick release device for chemical mechanical planarization

Info

Publication number
AU2002224425A1
AU2002224425A1 AU2002224425A AU2442502A AU2002224425A1 AU 2002224425 A1 AU2002224425 A1 AU 2002224425A1 AU 2002224425 A AU2002224425 A AU 2002224425A AU 2442502 A AU2442502 A AU 2442502A AU 2002224425 A1 AU2002224425 A1 AU 2002224425A1
Authority
AU
Australia
Prior art keywords
chemical mechanical
quick release
release device
mechanical planarization
pad quick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002224425A
Inventor
David G. Halley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Strasbaugh Inc
Original Assignee
Strasbaugh Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Strasbaugh Inc filed Critical Strasbaugh Inc
Publication of AU2002224425A1 publication Critical patent/AU2002224425A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B24D9/085—Devices for mounting sheets on a backing plate

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2002224425A 2000-10-20 2001-10-16 Pad quick release device for chemical mechanical planarization Abandoned AU2002224425A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/693,040 US6464574B1 (en) 1999-10-28 2000-10-20 Pad quick release device for chemical mechanical planarization
US09693040 2000-10-20
PCT/US2001/032509 WO2002034471A1 (en) 2000-10-20 2001-10-16 Pad quick release device for chemical mechanical planarization

Publications (1)

Publication Number Publication Date
AU2002224425A1 true AU2002224425A1 (en) 2002-05-06

Family

ID=24783063

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002224425A Abandoned AU2002224425A1 (en) 2000-10-20 2001-10-16 Pad quick release device for chemical mechanical planarization

Country Status (4)

Country Link
US (1) US6464574B1 (en)
AU (1) AU2002224425A1 (en)
TW (1) TW536456B (en)
WO (1) WO2002034471A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602121B1 (en) 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
US7018268B2 (en) 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US7040952B1 (en) * 2002-06-28 2006-05-09 Lam Research Corporation Method for reducing or eliminating de-lamination of semiconductor wafer film layers during a chemical mechanical planarization process
US7541826B2 (en) * 2005-05-13 2009-06-02 Kla-Tencor Corporation Compliant pad wafer chuck
US10207389B2 (en) * 2014-07-17 2019-02-19 Applied Materials, Inc. Polishing pad configuration and chemical mechanical polishing system
US10105812B2 (en) 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
US10076817B2 (en) * 2014-07-17 2018-09-18 Applied Materials, Inc. Orbital polishing with small pad
US9873179B2 (en) 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
CN108883515A (en) 2016-03-24 2018-11-23 应用材料公司 The pulvinulus of veining for chemically mechanical polishing
CN109227397A (en) * 2018-09-30 2019-01-18 深圳市诺峰光电设备有限公司 A kind of polishing proof mechanism of water and polishing machine
CN112548848B (en) * 2019-09-26 2022-09-23 清华大学 Bearing head and chemical mechanical polishing equipment
US11826873B2 (en) * 2020-08-24 2023-11-28 Applied Materials, Inc. Apparatus and methods for susceptor deposition material removal

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522681A (en) * 1968-12-18 1970-08-04 Gerald Lampert Rubbing apparatus
US3864884A (en) * 1973-09-14 1975-02-11 Bernard Weissman Abrading tool and holder therefor
US4138804A (en) * 1976-11-05 1979-02-13 Minnesota Mining And Manufacturing Company Machine head assembly and torque-transmitting device incorporated in the same
US5938504A (en) 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5664987A (en) 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5792709A (en) * 1995-12-19 1998-08-11 Micron Technology, Inc. High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers
US6022807A (en) 1996-04-24 2000-02-08 Micro Processing Technology, Inc. Method for fabricating an integrated circuit
JPH10329012A (en) * 1997-03-21 1998-12-15 Canon Inc Polishing device and polishing method
US6062959A (en) * 1997-11-05 2000-05-16 Aplex Group Polishing system including a hydrostatic fluid bearing support
US6244941B1 (en) * 1999-03-30 2001-06-12 Speedfam - Ipec Corporation Method and apparatus for pad removal and replacement
US6520895B2 (en) * 1999-09-07 2003-02-18 Nikon Corporation Polishing device and polishing pad component exchange device and method

Also Published As

Publication number Publication date
WO2002034471A1 (en) 2002-05-02
US6464574B1 (en) 2002-10-15
TW536456B (en) 2003-06-11

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