AU2002218795A1 - Method for producing an led light source - Google Patents
Method for producing an led light sourceInfo
- Publication number
- AU2002218795A1 AU2002218795A1 AU2002218795A AU1879502A AU2002218795A1 AU 2002218795 A1 AU2002218795 A1 AU 2002218795A1 AU 2002218795 A AU2002218795 A AU 2002218795A AU 1879502 A AU1879502 A AU 1879502A AU 2002218795 A1 AU2002218795 A1 AU 2002218795A1
- Authority
- AU
- Australia
- Prior art keywords
- producing
- light source
- led light
- led
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA1205/2000 | 2000-07-12 | ||
AT0120500A AT413062B (en) | 2000-07-12 | 2000-07-12 | METHOD FOR PRODUCING A LED LIGHT SOURCE |
PCT/AT2001/000223 WO2002005350A1 (en) | 2000-07-12 | 2001-07-06 | Method for producing an led light source |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002218795A1 true AU2002218795A1 (en) | 2002-01-21 |
Family
ID=3687125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002218795A Abandoned AU2002218795A1 (en) | 2000-07-12 | 2001-07-06 | Method for producing an led light source |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP2270856B1 (en) |
AT (1) | AT413062B (en) |
AU (1) | AU2002218795A1 (en) |
WO (1) | WO2002005350A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6977396B2 (en) | 2003-02-19 | 2005-12-20 | Lumileds Lighting U.S., Llc | High-powered light emitting device with improved thermal properties |
AT501081B8 (en) * | 2003-07-11 | 2007-02-15 | Tridonic Optoelectronics Gmbh | LED AS WELL AS LED LIGHT SOURCE |
US7462861B2 (en) | 2004-04-28 | 2008-12-09 | Cree, Inc. | LED bonding structures and methods of fabricating LED bonding structures |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2805245B2 (en) * | 1989-08-28 | 1998-09-30 | エルエスアイ ロジック コーポレーション | Flip chip structure |
US5060844A (en) * | 1990-07-18 | 1991-10-29 | International Business Machines Corporation | Interconnection structure and test method |
US5265792A (en) * | 1992-08-20 | 1993-11-30 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
GB2276032B (en) * | 1993-03-08 | 1997-04-16 | Prp Optoelectronics Limited | High intensity light source |
JPH06349892A (en) * | 1993-06-10 | 1994-12-22 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
US5438477A (en) * | 1993-08-12 | 1995-08-01 | Lsi Logic Corporation | Die-attach technique for flip-chip style mounting of semiconductor dies |
JP3267045B2 (en) * | 1994-03-24 | 2002-03-18 | 日亜化学工業株式会社 | LED element |
JPH08148723A (en) * | 1994-11-24 | 1996-06-07 | Matsushita Electric Ind Co Ltd | Optical print head and its manufacture |
US5936353A (en) * | 1996-04-03 | 1999-08-10 | Pressco Technology Inc. | High-density solid-state lighting array for machine vision applications |
JP3572924B2 (en) * | 1997-03-06 | 2004-10-06 | 松下電器産業株式会社 | Light emitting device and recording device using the same |
US5997152A (en) * | 1997-09-15 | 1999-12-07 | Oki Electric Industry Co., Ltd. | Light emitting element module and printer head using the same |
US5909057A (en) * | 1997-09-23 | 1999-06-01 | Lsi Logic Corporation | Integrated heat spreader/stiffener with apertures for semiconductor package |
JPH11161197A (en) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | Picture display device |
JPH11320962A (en) * | 1998-05-19 | 1999-11-24 | Canon Inc | Led exposing head |
DE19854899C1 (en) * | 1998-11-27 | 1999-12-30 | Siemens Ag | Lighting unit for automobile |
US6514782B1 (en) * | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
US6517218B2 (en) * | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
-
2000
- 2000-07-12 AT AT0120500A patent/AT413062B/en not_active IP Right Cessation
-
2001
- 2001-07-06 EP EP10184279.7A patent/EP2270856B1/en not_active Revoked
- 2001-07-06 WO PCT/AT2001/000223 patent/WO2002005350A1/en active Application Filing
- 2001-07-06 AU AU2002218795A patent/AU2002218795A1/en not_active Abandoned
- 2001-07-06 EP EP01984193.1A patent/EP1299908B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1299908A1 (en) | 2003-04-09 |
EP1299908B1 (en) | 2013-09-11 |
EP2270856A1 (en) | 2011-01-05 |
ATA12052000A (en) | 2005-03-15 |
WO2002005350A1 (en) | 2002-01-17 |
AT413062B (en) | 2005-10-15 |
EP2270856B1 (en) | 2015-01-14 |
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