AU2002216937A1 - Method for treating carrier films by means of heavy ion irradiation - Google Patents

Method for treating carrier films by means of heavy ion irradiation

Info

Publication number
AU2002216937A1
AU2002216937A1 AU2002216937A AU1693702A AU2002216937A1 AU 2002216937 A1 AU2002216937 A1 AU 2002216937A1 AU 2002216937 A AU2002216937 A AU 2002216937A AU 1693702 A AU1693702 A AU 1693702A AU 2002216937 A1 AU2002216937 A1 AU 2002216937A1
Authority
AU
Australia
Prior art keywords
ion irradiation
heavy ion
carrier films
treating carrier
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002216937A
Other languages
English (en)
Inventor
Manfred Danziger
Michael Kirschstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2002216937A1 publication Critical patent/AU2002216937A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
AU2002216937A 2000-11-27 2001-11-27 Method for treating carrier films by means of heavy ion irradiation Abandoned AU2002216937A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2000158822 DE10058822A1 (de) 2000-11-27 2000-11-27 Verfahren zur Bearbeitung von Trägerfolien durch Bestrahlen mit Schwerionen
DE10058822 2000-11-27
PCT/DE2001/004443 WO2002042514A1 (fr) 2000-11-27 2001-11-27 Procede pour le traitement de films support par irradiation aux ions lourds

Publications (1)

Publication Number Publication Date
AU2002216937A1 true AU2002216937A1 (en) 2002-06-03

Family

ID=7664817

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002216937A Abandoned AU2002216937A1 (en) 2000-11-27 2001-11-27 Method for treating carrier films by means of heavy ion irradiation

Country Status (3)

Country Link
AU (1) AU2002216937A1 (fr)
DE (1) DE10058822A1 (fr)
WO (1) WO2002042514A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10234614B3 (de) * 2002-07-24 2004-03-04 Fractal Ag Verfahren zur Bearbeitung von Trägermaterial durch Schwerionenbestrahlung und nachfolgenden Ätzprozess
DE102004011567A1 (de) 2004-03-02 2005-09-22 Ist - Ionen Strahl Technologie Gmbh Haftfester Verbund und Verfahren zur Herstellung
DE102006050023B4 (de) * 2006-10-19 2008-11-13 Ist - Ionen Strahl Technologie - Gmbh Verfahren zur Bearbeitung von Material durch Schwerionenbestrahlung und nachfolgenden Ätzprozess
DE102006052192B4 (de) * 2006-11-02 2009-01-15 Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh Schichtenverbund mit nicht durchgängigen Öffnungen, Verfahren zur Herstellung und Bauelement damit
DE102013005827A1 (de) * 2013-04-04 2014-10-09 Bae Innovation Gmbh Elektrode und Elektrodenanordnung für einen Blei-Säure-Akkumulator
DE102014005441A1 (de) 2014-04-11 2015-10-29 Elena Danziger Verfahren zur Herstellung eines haftfesten Verbundes
CN110923624B (zh) * 2019-12-13 2020-11-24 北京师范大学 一种基于离子束印刷系统的离子束印刷方法
CN111816538B (zh) * 2020-07-17 2022-03-25 兰州大学 一种基于重离子辐照的透射电镜微栅以及制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2916006C2 (de) * 1979-04-20 1983-01-13 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur Herstellung von haftfesten Metallschichten auf Unterlagen, insbesondere aus Kunststoffen
DE2951287A1 (de) * 1979-12-20 1981-07-02 Gesellschaft für Schwerionenforschung mbH, 6100 Darmstadt Verfahren zur herstellung von ebenen oberflaechen mit feinsten spitzen im mikrometer-bereich
DE4210486C1 (fr) * 1992-03-31 1993-05-06 Gesellschaft Fuer Schwerionenforschung Mbh, 6100 Darmstadt, De

Also Published As

Publication number Publication date
DE10058822A1 (de) 2002-06-20
WO2002042514A1 (fr) 2002-05-30

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