AU2001292332A1 - Abrasive material - Google Patents

Abrasive material

Info

Publication number
AU2001292332A1
AU2001292332A1 AU2001292332A AU9233201A AU2001292332A1 AU 2001292332 A1 AU2001292332 A1 AU 2001292332A1 AU 2001292332 A AU2001292332 A AU 2001292332A AU 9233201 A AU9233201 A AU 9233201A AU 2001292332 A1 AU2001292332 A1 AU 2001292332A1
Authority
AU
Australia
Prior art keywords
polishing material
abrasive grains
polishing
rare earth
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001292332A
Inventor
Shigeru Kuwabara
Yoshitsugu Uchino
Hidehiko Yamasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of AU2001292332A1 publication Critical patent/AU2001292332A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing

Abstract

A polishing material is provided in which the dispersibility of the abrasive grains of the polishing material having, as a major component, rare earth oxides including cerium oxide is made better and the hardness of abrasive grain precipitates is reduced, and at the same time high efficiency of polishing can be achieved stably. According to the present invention, in a polishing material having, as the major component, rare earth oxides including cerium oxide, any one of crystalline cellulose, calcium secondary phosphate, a condensate of sodium beta -naphthalenesulphonate and formalin, and synthetic silica is contained as an anti-solidification agent capable of softening abrasive grain precipitates of the polishing material when the abrasive grains of the polishing material are dispersed into a dispersion medium, and sodium hexametaphosphate or pyrophosphate is contained as a dispersant capable of dispersing the abrasive grains of the polishing material into the dispersion medium.
AU2001292332A 2000-10-06 2001-10-02 Abrasive material Abandoned AU2001292332A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000307100 2000-10-06
JP2000-307100 2000-10-06
PCT/JP2001/008671 WO2002031079A1 (en) 2000-10-06 2001-10-02 Abrasive material

Publications (1)

Publication Number Publication Date
AU2001292332A1 true AU2001292332A1 (en) 2002-04-22

Family

ID=18787662

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001292332A Abandoned AU2001292332A1 (en) 2000-10-06 2001-10-02 Abrasive material

Country Status (11)

Country Link
US (1) US6824578B2 (en)
EP (1) EP1338636B1 (en)
JP (1) JP3986960B2 (en)
KR (1) KR100539007B1 (en)
CN (1) CN1300277C (en)
AT (1) ATE494345T1 (en)
AU (1) AU2001292332A1 (en)
DE (1) DE60143812D1 (en)
MY (1) MY136599A (en)
TW (1) TWI281493B (en)
WO (1) WO2002031079A1 (en)

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US7004819B2 (en) * 2002-01-18 2006-02-28 Cabot Microelectronics Corporation CMP systems and methods utilizing amine-containing polymers
JP3463999B1 (en) * 2002-05-16 2003-11-05 三井金属鉱業株式会社 Manufacturing method of cerium-based abrasive
KR100663781B1 (en) * 2003-01-31 2007-01-02 히다치 가세고교 가부시끼가이샤 ??? polishing compound and polishing method
US7073496B2 (en) * 2003-03-26 2006-07-11 Saint-Gobain Abrasives, Inc. High precision multi-grit slicing blade
US7300478B2 (en) * 2003-05-22 2007-11-27 Ferro Corporation Slurry composition and method of use
KR101072269B1 (en) * 2004-03-30 2011-10-11 주식회사 동진쎄미켐 Chemical mechanical polishing slurry composition containing etchant
CN102585765B (en) * 2004-07-23 2015-01-21 日立化成株式会社 Cmp polishing agent and method for polishing substrate
US7531105B2 (en) * 2004-11-05 2009-05-12 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US7504044B2 (en) * 2004-11-05 2009-03-17 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
TWI271555B (en) * 2005-06-13 2007-01-21 Basf Ag Slurry composition for polishing color filter
JP4983603B2 (en) * 2005-10-19 2012-07-25 日立化成工業株式会社 Cerium oxide slurry, cerium oxide polishing liquid, and substrate polishing method using the same
KR100813100B1 (en) * 2006-06-29 2008-03-17 성균관대학교산학협력단 Extensible System ? Method for Stereo Maching in Real Time
JPWO2008004534A1 (en) * 2006-07-04 2009-12-03 日立化成工業株式会社 Polishing liquid for CMP
TWI400142B (en) * 2006-07-28 2013-07-01 Toray Industries Mutual invasive macromolecular reticular construct, grinding pad, and the preparing method thereof
US7696095B2 (en) * 2007-02-23 2010-04-13 Ferro Corporation Auto-stopping slurries for chemical-mechanical polishing of topographic dielectric silicon dioxide
JP5819036B2 (en) * 2008-03-25 2015-11-18 三井金属鉱業株式会社 Cerium-based abrasive slurry
CN101608097B (en) * 2009-07-14 2011-12-21 上海华明高纳稀土新材料有限公司 Nano cerium oxide seriflux for chemical mechanical polishing and preparation method
JP5774283B2 (en) * 2010-04-08 2015-09-09 株式会社フジミインコーポレーテッド Polishing composition and polishing method
JP5516184B2 (en) * 2010-07-26 2014-06-11 信越化学工業株式会社 Method for producing synthetic quartz glass substrate
MY175638A (en) 2010-09-08 2020-07-03 Basf Se Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectic and polysilicon films.
WO2012090510A1 (en) * 2010-12-29 2012-07-05 Hoya株式会社 Manufacturing method for glass substrate for magnetic disk, and manufacturing method for magnetic disk
CN103917332A (en) * 2011-11-01 2014-07-09 旭硝子株式会社 Method for producing glass substrate
SG11201404747UA (en) * 2012-02-10 2014-09-26 Basf Se Chemical mechanical polishing (cmp) composition comprising a protein
KR20140000496A (en) 2012-06-22 2014-01-03 에스케이하이닉스 주식회사 Polishing composition, method for fabricating thereof and method of chemical mechanical polishing using the same
CN103923604A (en) * 2013-01-15 2014-07-16 安阳市岷山有色金属有限责任公司 Cerium based abrasive material
US9281210B2 (en) * 2013-10-10 2016-03-08 Cabot Microelectronics Corporation Wet-process ceria compositions for polishing substrates, and methods related thereto
US9340706B2 (en) * 2013-10-10 2016-05-17 Cabot Microelectronics Corporation Mixed abrasive polishing compositions
CN103756571A (en) * 2013-12-25 2014-04-30 上海华明高纳稀土新材料有限公司 Rare-earth polishing powder and preparation method thereof
WO2015115652A1 (en) * 2014-01-31 2015-08-06 Hoya株式会社 Regenerating method for used polishing slurry and manufacturing method for magnetic disc glass substrate
CN103992743B (en) * 2014-05-09 2018-06-19 杰明纳微电子股份有限公司 Polishing fluid and its preparation process containing cerium dioxide powder Yu colloidal silicon dioxide compound abrasive
JP6357536B2 (en) * 2014-07-31 2018-07-11 Hoya株式会社 Polishing slurry preparation method, glass substrate manufacturing method, and raw material abrasive lump
US20180370848A1 (en) * 2015-12-16 2018-12-27 Rhodia Operations Method for polishing a phosphate glass or a fluorophosphate glass substrate
CN106978089A (en) * 2017-04-20 2017-07-25 德米特（苏州）电子环保材料有限公司 A kind of preparation method of polishing powder from rare earth
WO2019198622A1 (en) * 2018-04-11 2019-10-17 日揮触媒化成株式会社 Polishing composition
CN109227227B (en) * 2018-11-28 2020-10-16 湖南兴龙环境艺术工程有限公司 Preparation method of glass grinding disc
WO2024014425A1 (en) * 2022-07-12 2024-01-18 株式会社レゾナック Cerium-based abrasive material, polishing liquid, polishing liquid production method, and glass polishing method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5645975A (en) 1979-09-20 1981-04-25 Akira Suzuki Additive for abrasive material
JPS56147880A (en) 1980-04-19 1981-11-17 Akira Suzuki Additive for abrasive material
EP0045826A1 (en) 1980-08-12 1982-02-17 Monsanto Company Dicalcium phosphate dihydrate having improved stability and a method for preparing it
FR2624519A1 (en) 1987-12-09 1989-06-16 Rhone Poulenc Chimie CERIUM-IMPROVED POLISHING COMPOSITION AND PROCESS FOR PREPARING THE SAME
JP2783330B2 (en) 1989-11-01 1998-08-06 株式会社フジミインコーポレーテッド Abrasive for glass polishing
JP2832270B2 (en) 1993-05-18 1998-12-09 三井金属鉱業株式会社 Abrasive for glass polishing
JPH09143455A (en) 1995-09-21 1997-06-03 Mitsubishi Chem Corp Composition for polishing magnetic hard disk substrate and polishing magnetic hard disk substrate with the same
JP3856513B2 (en) 1996-12-26 2006-12-13 昭和電工株式会社 Abrasive composition for glass polishing
BR9810241A (en) * 1997-06-04 2000-09-05 Toto Ltd Cleaning agent to clean the surface of a substrate, composition of subcoat to form a subcoat on the surface of a substrate, process to form a photocatalytically hydrophilicable coating on the surface of a substrate, together, and, member
JP3857799B2 (en) * 1998-01-27 2006-12-13 昭和電工株式会社 Abrasive composition for glass polishing and polishing method thereof
US6248143B1 (en) * 1998-01-27 2001-06-19 Showa Denko Kabushiki Kaisha Composition for polishing glass and polishing method
JP2000063806A (en) 1998-08-17 2000-02-29 Okamoto Machine Tool Works Ltd Abrasive slurry and preparation thereof
JP3728950B2 (en) 1998-12-04 2005-12-21 株式会社日立製作所 Semiconductor device manufacturing method and planarization apparatus
JP2000256656A (en) 1999-03-04 2000-09-19 Hitachi Chem Co Ltd Cmp abrasive material and abrasion of substrate
JP2000351956A (en) 1999-06-10 2000-12-19 Seimi Chem Co Ltd Abrasive for semiconductor, obtained by adding thickener

Also Published As

Publication number Publication date
EP1338636A4 (en) 2007-08-29
TWI281493B (en) 2007-05-21
US6824578B2 (en) 2004-11-30
EP1338636B1 (en) 2011-01-05
EP1338636A1 (en) 2003-08-27
US20040010978A1 (en) 2004-01-22
KR20030048032A (en) 2003-06-18
MY136599A (en) 2008-10-31
CN1697869A (en) 2005-11-16
KR100539007B1 (en) 2005-12-26
JP3986960B2 (en) 2007-10-03
WO2002031079A1 (en) 2002-04-18
DE60143812D1 (en) 2011-02-17
JPWO2002031079A1 (en) 2004-02-19
ATE494345T1 (en) 2011-01-15
CN1300277C (en) 2007-02-14

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