AU2001290424A1 - A method for wet etching - Google Patents

A method for wet etching

Info

Publication number
AU2001290424A1
AU2001290424A1 AU2001290424A AU9042401A AU2001290424A1 AU 2001290424 A1 AU2001290424 A1 AU 2001290424A1 AU 2001290424 A AU2001290424 A AU 2001290424A AU 9042401 A AU9042401 A AU 9042401A AU 2001290424 A1 AU2001290424 A1 AU 2001290424A1
Authority
AU
Australia
Prior art keywords
wet etching
etching
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001290424A
Inventor
Bjarni Bjarnason
Per Pettersson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Obducat AB
Original Assignee
Obducat AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE0003345A external-priority patent/SE517275C2/en
Application filed by Obducat AB filed Critical Obducat AB
Publication of AU2001290424A1 publication Critical patent/AU2001290424A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
AU2001290424A 2000-09-20 2001-09-20 A method for wet etching Abandoned AU2001290424A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23418400P 2000-09-20 2000-09-20
US60234184 2000-09-20
SE0003345A SE517275C2 (en) 2000-09-20 2000-09-20 Wet etching of substrate involves arranging on the substrate a passivating substance comprising active substance reacting with component contained in etchant to form etch protecting compound
SE0003345 2000-09-20
PCT/SE2001/002012 WO2002024977A1 (en) 2000-09-20 2001-09-20 A method for wet etching

Publications (1)

Publication Number Publication Date
AU2001290424A1 true AU2001290424A1 (en) 2002-04-02

Family

ID=26655241

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001290424A Abandoned AU2001290424A1 (en) 2000-09-20 2001-09-20 A method for wet etching

Country Status (3)

Country Link
CN (1) CN1243849C (en)
AU (1) AU2001290424A1 (en)
WO (1) WO2002024977A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1303793B1 (en) 2000-07-17 2015-01-28 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279702A (en) * 1992-09-30 1994-01-18 Texas Instruments Incorporated Anisotropic liquid phase photochemical copper etch
WO1999045179A1 (en) * 1998-03-05 1999-09-10 Obducat Ab Method of etching

Also Published As

Publication number Publication date
WO2002024977A1 (en) 2002-03-28
CN1469939A (en) 2004-01-21
CN1243849C (en) 2006-03-01

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