AU2001288660A1 - Rapid surface cooling of solder droplets by flash evaporation - Google Patents

Rapid surface cooling of solder droplets by flash evaporation

Info

Publication number
AU2001288660A1
AU2001288660A1 AU2001288660A AU8866001A AU2001288660A1 AU 2001288660 A1 AU2001288660 A1 AU 2001288660A1 AU 2001288660 A AU2001288660 A AU 2001288660A AU 8866001 A AU8866001 A AU 8866001A AU 2001288660 A1 AU2001288660 A1 AU 2001288660A1
Authority
AU
Australia
Prior art keywords
flash evaporation
surface cooling
rapid surface
solder droplets
droplets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001288660A
Inventor
Gerard R. Minogue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Frys Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frys Metals Inc filed Critical Frys Metals Inc
Publication of AU2001288660A1 publication Critical patent/AU2001288660A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
AU2001288660A 2000-09-01 2001-08-31 Rapid surface cooling of solder droplets by flash evaporation Abandoned AU2001288660A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23028400P 2000-09-01 2000-09-01
US60230284 2000-09-01
PCT/US2001/027326 WO2002018085A1 (en) 2000-09-01 2001-08-31 Rapid surface cooling of solder droplets by flash evaporation

Publications (1)

Publication Number Publication Date
AU2001288660A1 true AU2001288660A1 (en) 2002-03-13

Family

ID=22864609

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001288660A Abandoned AU2001288660A1 (en) 2000-09-01 2001-08-31 Rapid surface cooling of solder droplets by flash evaporation

Country Status (5)

Country Link
US (2) US6635101B2 (en)
EP (1) EP1313587A1 (en)
JP (1) JP2004512952A (en)
AU (1) AU2001288660A1 (en)
WO (1) WO2002018085A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1313587A1 (en) * 2000-09-01 2003-05-28 FRY'S METALS, INC. d/b/a ALPHA METALS, INC. Rapid surface cooling of solder droplets by flash evaporation
DE10246540B4 (en) * 2002-09-30 2012-03-15 Rehm Thermal Systems Gmbh Device for cleaning process gas of a reflow soldering machine
EP1597005A2 (en) * 2003-02-28 2005-11-23 Central Research Institute of Electric Power Industry Method and apparatus for producing fine particles
KR20040053080A (en) * 2004-05-31 2004-06-23 김성진 Manufacturing method of metal ball and its apparatus
US20080075777A1 (en) * 2006-07-31 2008-03-27 Kennedy Michael T Apparatus and methods for preparing solid particles
WO2010026840A1 (en) * 2008-09-02 2010-03-11 株式会社ラスコ Heat exchanging device
US20160054064A1 (en) * 2013-04-10 2016-02-25 Outotec (Finland) Oy Gas slide heat exchanger
US9331430B2 (en) 2013-10-18 2016-05-03 JTech Solutions, Inc. Enclosed power outlet
CN104999197B (en) * 2015-08-06 2018-04-17 厦门理工学院 A kind of solder micro-spray device and soldered ball manufacturing system
JP6908706B2 (en) 2016-08-24 2021-07-28 ５エヌ プラス インコーポレイテッド Low melting point metal or alloy powder atomizing manufacturing process
US10205283B2 (en) 2017-04-13 2019-02-12 JTech Solutions, Inc. Reduced cross-section enclosed power outlet
US10356950B2 (en) 2017-12-18 2019-07-16 Ge Aviation Systems, Llc Avionics heat exchanger
WO2019157594A1 (en) 2018-02-15 2019-08-22 5N Plus Inc. High melting point metal or alloy powders atomization manufacturing processes
USD841592S1 (en) 2018-03-26 2019-02-26 JTech Solutions, Inc. Extendable outlet
USD843321S1 (en) 2018-03-26 2019-03-19 JTech Solutions, Inc. Extendable outlet
USD999742S1 (en) 2021-04-01 2023-09-26 JTech Solutions, Inc. Safety interlock outlet box

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
DE2144220C3 (en) * 1971-08-31 1974-04-25 Mannesmann Ag, 4000 Duesseldorf Method and apparatus for producing low-oxygen metal powders
US4347199A (en) * 1981-03-02 1982-08-31 Dow Corning Corporation Method and apparatus for rapidly freezing molten metals and metalloids in particulate form
USH1146H (en) 1990-06-22 1993-03-02 The United States Of America As Represented By The Secretary Of The Army Plasma spraying tungsten heavy alloys
DE4022648C2 (en) * 1990-07-17 1994-01-27 Nukem Gmbh Method and device for producing spherical particles from a liquid phase
US5147448A (en) 1990-10-01 1992-09-15 Nuclear Metals, Inc. Techniques for producing fine metal powder
US5482532A (en) * 1991-06-05 1996-01-09 Kubota Corporation Method of and apparatus for producing metal powder
US5229016A (en) * 1991-08-08 1993-07-20 Microfab Technologies, Inc. Method and apparatus for dispensing spherical-shaped quantities of liquid solder
US5294242A (en) * 1991-09-30 1994-03-15 Air Products And Chemicals Method for making metal powders
US5266098A (en) 1992-01-07 1993-11-30 Massachusetts Institute Of Technology Production of charged uniformly sized metal droplets
JP3583462B2 (en) 1993-04-05 2004-11-04 フォード モーター カンパニー Micro soldering apparatus and method for electronic components
GB9316767D0 (en) 1993-08-12 1993-09-29 Davy Mckee Stockton Slag granulation
SE509049C2 (en) * 1996-04-18 1998-11-30 Rutger Larsson Konsult Ab Process and plant for the production of atomized metal powder, metal powder and use of the metal powder
US6224180B1 (en) * 1997-02-21 2001-05-01 Gerald Pham-Van-Diep High speed jet soldering system
US5891212A (en) * 1997-07-14 1999-04-06 Aeroquip Corporation Apparatus and method for making uniformly
US6648216B2 (en) 2000-08-21 2003-11-18 Matsushita Electric Industrial Co., Ltd. Process and apparatus for flow soldering
EP1313587A1 (en) * 2000-09-01 2003-05-28 FRY'S METALS, INC. d/b/a ALPHA METALS, INC. Rapid surface cooling of solder droplets by flash evaporation

Also Published As

Publication number Publication date
EP1313587A1 (en) 2003-05-28
US20050097990A1 (en) 2005-05-12
JP2004512952A (en) 2004-04-30
US20020064572A1 (en) 2002-05-30
US6635101B2 (en) 2003-10-21
WO2002018085A1 (en) 2002-03-07
US7097806B2 (en) 2006-08-29

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