AU2001288059A1 - Cutting device for sheet metal drum - Google Patents
Cutting device for sheet metal drumInfo
- Publication number
- AU2001288059A1 AU2001288059A1 AU2001288059A AU8805901A AU2001288059A1 AU 2001288059 A1 AU2001288059 A1 AU 2001288059A1 AU 2001288059 A AU2001288059 A AU 2001288059A AU 8805901 A AU8805901 A AU 8805901A AU 2001288059 A1 AU2001288059 A1 AU 2001288059A1
- Authority
- AU
- Australia
- Prior art keywords
- sheet metal
- cutting device
- metal drum
- drum
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/16—Bushings; Mountings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53961—Means to assemble or disassemble with work-holder for assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T82/00—Turning
- Y10T82/16—Severing or cut-off
- Y10T82/16426—Infeed means
- Y10T82/16967—Infeed means with means to support and/or rotate work
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000306095 | 2000-10-05 | ||
JP2000/306095 | 2000-10-05 | ||
JP2000/308243 | 2000-10-06 | ||
JP2000308243 | 2000-10-06 | ||
JP2000323111 | 2000-10-23 | ||
JP2000/323111 | 2000-10-23 | ||
JP2001003978 | 2001-01-11 | ||
JP2001/3978 | 2001-01-11 | ||
PCT/JP2001/008107 WO2002028580A1 (en) | 2000-10-05 | 2001-09-18 | Cutting device for sheet metal drum |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001288059A1 true AU2001288059A1 (en) | 2002-04-15 |
Family
ID=27481679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001288059A Abandoned AU2001288059A1 (en) | 2000-10-05 | 2001-09-18 | Cutting device for sheet metal drum |
Country Status (6)
Country | Link |
---|---|
US (1) | US6726547B2 (en) |
EP (1) | EP1334788B1 (en) |
JP (1) | JP3834000B2 (en) |
CN (1) | CN1265924C (en) |
AU (1) | AU2001288059A1 (en) |
WO (1) | WO2002028580A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6840136B1 (en) | 2000-10-23 | 2005-01-11 | Earle H Jones | Pedal drive mechanism |
US20030226432A1 (en) * | 2002-06-05 | 2003-12-11 | Majeski Mark J. | Gang saw system for rotating and segmenting a workpiece |
JP3910933B2 (en) * | 2003-04-09 | 2007-04-25 | 本田技研工業株式会社 | Metal sheet cutting machine |
EP1611981A4 (en) * | 2003-04-09 | 2008-08-27 | Honda Motor Co Ltd | Cutting device for thin metallic plate |
JP4619824B2 (en) * | 2004-04-06 | 2011-01-26 | 本田技研工業株式会社 | Ring delivery method and apparatus |
JP4826178B2 (en) * | 2005-09-06 | 2011-11-30 | 富士ゼロックス株式会社 | Cutting apparatus and cutting method |
JP5046772B2 (en) * | 2007-07-27 | 2012-10-10 | 東京電力株式会社 | Iron core cutting device and iron core cutting method |
JP5302036B2 (en) * | 2009-02-10 | 2013-10-02 | 本田技研工業株式会社 | Cylindrical workpiece cutting device |
JP5513923B2 (en) * | 2010-02-16 | 2014-06-04 | 本田技研工業株式会社 | Metal ring manufacturing method |
JP5519316B2 (en) * | 2010-02-16 | 2014-06-11 | 本田技研工業株式会社 | Cylindrical workpiece cutting device |
JPWO2012011322A1 (en) * | 2010-07-22 | 2013-09-09 | 本田技研工業株式会社 | Cylindrical workpiece cutting device and metal ring manufacturing method |
CN102019463A (en) * | 2010-12-15 | 2011-04-20 | 中国包装科研测试中心 | Cutting device for metal can body |
US10052718B2 (en) | 2011-02-10 | 2018-08-21 | Honda Motor Co., Ltd. | Cylindrical workpiece cutting apparatus |
JP5766458B2 (en) * | 2011-02-10 | 2015-08-19 | 本田技研工業株式会社 | Metal sheet drum cutting device |
JP5764343B2 (en) * | 2011-02-10 | 2015-08-19 | 本田技研工業株式会社 | Cylindrical workpiece cutting device |
JP5615943B2 (en) * | 2011-02-14 | 2014-10-29 | 本田技研工業株式会社 | Metal ring manufacturing method and apparatus |
DE102015215624A1 (en) * | 2015-08-17 | 2017-02-23 | Schaeffler Technologies AG & Co. KG | Process for producing bearing components by means of a production line, production line and manufacturing plant |
CN105883351B (en) * | 2016-05-24 | 2018-01-19 | 安庆工匠智能化设备制造有限公司 | A kind of pre- arrangement of becket |
CN111842427B (en) * | 2019-11-08 | 2021-07-09 | 台州智子科技有限公司 | Recovery device for metal can |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4227348A (en) * | 1978-12-26 | 1980-10-14 | Rca Corporation | Method of slicing a wafer |
DE3024132A1 (en) * | 1980-06-27 | 1982-01-21 | Goetze Ag, 5093 Burscheid | DEVICE FOR RADIAL SEPARATION FROM UNCIRCULAR BUSH-SHAPED WORKPIECES |
JPH0187822U (en) | 1987-11-30 | 1989-06-09 | ||
JP2730918B2 (en) | 1988-09-16 | 1998-03-25 | キヤノン株式会社 | Method for detecting remaining amount of ink in ink jet recording apparatus |
JPH09290358A (en) * | 1996-04-25 | 1997-11-11 | Komatsu Electron Metals Co Ltd | Manufacture of semiconductor wafer and chamfering work device for semiconductor ingot |
US6250192B1 (en) * | 1996-11-12 | 2001-06-26 | Micron Technology, Inc. | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
-
2001
- 2001-09-18 US US10/363,536 patent/US6726547B2/en not_active Expired - Fee Related
- 2001-09-18 JP JP2002532395A patent/JP3834000B2/en not_active Expired - Fee Related
- 2001-09-18 AU AU2001288059A patent/AU2001288059A1/en not_active Abandoned
- 2001-09-18 WO PCT/JP2001/008107 patent/WO2002028580A1/en active Application Filing
- 2001-09-18 EP EP01967722A patent/EP1334788B1/en not_active Expired - Lifetime
- 2001-09-18 CN CNB018157254A patent/CN1265924C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1458872A (en) | 2003-11-26 |
JPWO2002028580A1 (en) | 2004-02-12 |
JP3834000B2 (en) | 2006-10-18 |
US6726547B2 (en) | 2004-04-27 |
EP1334788B1 (en) | 2012-08-01 |
CN1265924C (en) | 2006-07-26 |
US20030176154A1 (en) | 2003-09-18 |
WO2002028580A1 (en) | 2002-04-11 |
EP1334788A4 (en) | 2008-01-02 |
EP1334788A1 (en) | 2003-08-13 |
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