AU2001287900A1 - Isolation device between optically conductive areas - Google Patents
Isolation device between optically conductive areasInfo
- Publication number
- AU2001287900A1 AU2001287900A1 AU2001287900A AU8790001A AU2001287900A1 AU 2001287900 A1 AU2001287900 A1 AU 2001287900A1 AU 2001287900 A AU2001287900 A AU 2001287900A AU 8790001 A AU8790001 A AU 8790001A AU 2001287900 A1 AU2001287900 A1 AU 2001287900A1
- Authority
- AU
- Australia
- Prior art keywords
- isolation device
- conductive areas
- optically conductive
- optically
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000002955 isolation Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/761—PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12126—Light absorber
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0023133 | 2000-09-21 | ||
GB0023133A GB2367187B (en) | 2000-09-21 | 2000-09-21 | An isolation device |
US09850060 | 2001-05-08 | ||
US09/850,060 US6628852B2 (en) | 2000-09-21 | 2001-05-08 | Isolation device |
PCT/GB2001/004191 WO2002025334A1 (en) | 2000-09-21 | 2001-09-20 | Isolation device between optically conductive areas |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001287900A1 true AU2001287900A1 (en) | 2002-04-02 |
Family
ID=26245033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001287900A Abandoned AU2001287900A1 (en) | 2000-09-21 | 2001-09-20 | Isolation device between optically conductive areas |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1319193A1 (en) |
CN (1) | CN1461418A (en) |
AU (1) | AU2001287900A1 (en) |
CA (1) | CA2422572A1 (en) |
WO (1) | WO2002025334A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102403321A (en) * | 2011-09-30 | 2012-04-04 | 上海新傲科技股份有限公司 | Semiconductor device and preparation method thereof |
US9946023B2 (en) * | 2015-08-05 | 2018-04-17 | Huawei Technologies Co., Ltd. | Optical attenuator and fabrication method thereof |
CN114898791A (en) | 2016-01-29 | 2022-08-12 | 三星电子株式会社 | Semiconductor device for selectively performing isolation function and layout replacement method thereof |
CN107039070B (en) | 2016-01-29 | 2022-06-14 | 三星电子株式会社 | Semiconductor device for selectively performing isolation function and layout replacement method thereof |
US11442296B2 (en) | 2020-07-20 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Waveguide structure and method for forming the same |
US20240012199A1 (en) * | 2022-07-08 | 2024-01-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and methods of formation |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL185118C (en) * | 1979-06-07 | 1990-01-16 | Philips Nv | SEMICONDUCTOR SWITCHING DEVICE FOR CONDUCTING AND AMPLIFYING RADIATION. |
US4637125A (en) * | 1983-09-22 | 1987-01-20 | Kabushiki Kaisha Toshiba | Method for making a semiconductor integrated device including bipolar transistor and CMOS transistor |
FR2710455B1 (en) * | 1993-09-24 | 1995-12-15 | Frederic Ghirardi | Method for producing a monolithic integrated structure incorporating opto-electronic components and structure thus produced. |
EP0704913B1 (en) * | 1994-09-28 | 1999-09-01 | Nippon Telegraph And Telephone Corporation | Optical semiconductor device and method of fabricating the same |
JPH08116135A (en) * | 1994-10-17 | 1996-05-07 | Mitsubishi Electric Corp | Manufacture of waveguiding path integrated element and waveguiding path integrated element |
-
2001
- 2001-09-20 CA CA002422572A patent/CA2422572A1/en not_active Abandoned
- 2001-09-20 EP EP01967526A patent/EP1319193A1/en not_active Withdrawn
- 2001-09-20 WO PCT/GB2001/004191 patent/WO2002025334A1/en not_active Application Discontinuation
- 2001-09-20 CN CN 01815964 patent/CN1461418A/en active Pending
- 2001-09-20 AU AU2001287900A patent/AU2001287900A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2002025334B1 (en) | 2002-07-04 |
EP1319193A1 (en) | 2003-06-18 |
CA2422572A1 (en) | 2002-03-28 |
WO2002025334A1 (en) | 2002-03-28 |
CN1461418A (en) | 2003-12-10 |
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