AU2001285019A1 - Phase-shift masks and methods of fabrication - Google Patents
Phase-shift masks and methods of fabricationInfo
- Publication number
- AU2001285019A1 AU2001285019A1 AU2001285019A AU8501901A AU2001285019A1 AU 2001285019 A1 AU2001285019 A1 AU 2001285019A1 AU 2001285019 A AU2001285019 A AU 2001285019A AU 8501901 A AU8501901 A AU 8501901A AU 2001285019 A1 AU2001285019 A1 AU 2001285019A1
- Authority
- AU
- Australia
- Prior art keywords
- fabrication
- phase
- methods
- shift masks
- masks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23116200P | 2000-09-07 | 2000-09-07 | |
US60231162 | 2000-09-07 | ||
US09/804,590 US6524755B2 (en) | 2000-09-07 | 2001-03-12 | Phase-shift masks and methods of fabrication |
US09804590 | 2001-03-12 | ||
PCT/US2001/025785 WO2002021218A1 (en) | 2000-09-07 | 2001-08-17 | Phase-shift masks and methods of fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001285019A1 true AU2001285019A1 (en) | 2002-03-22 |
Family
ID=26924865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001285019A Abandoned AU2001285019A1 (en) | 2000-09-07 | 2001-08-17 | Phase-shift masks and methods of fabrication |
Country Status (4)
Country | Link |
---|---|
US (1) | US6524755B2 (en) |
AU (1) | AU2001285019A1 (en) |
TW (1) | TW521318B (en) |
WO (1) | WO2002021218A1 (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6573030B1 (en) * | 2000-02-17 | 2003-06-03 | Applied Materials, Inc. | Method for depositing an amorphous carbon layer |
KR100620652B1 (en) * | 2000-06-23 | 2006-09-13 | 주식회사 하이닉스반도체 | A method for manufacturing phase shift mask of semiconductor device |
US6599666B2 (en) * | 2001-03-15 | 2003-07-29 | Micron Technology, Inc. | Multi-layer, attenuated phase-shifting mask |
US7027226B2 (en) * | 2001-09-17 | 2006-04-11 | Euv Llc | Diffractive optical element for extreme ultraviolet wavefront control |
US20030052084A1 (en) * | 2001-09-18 | 2003-03-20 | Tabery Cyrus E. | In-situ or ex-situ profile monitoring of phase openings on alternating phase shifting masks by scatterometry |
US6541397B1 (en) * | 2002-03-29 | 2003-04-01 | Applied Materials, Inc. | Removable amorphous carbon CMP stop |
KR100468735B1 (en) * | 2002-06-12 | 2005-01-29 | 삼성전자주식회사 | Method for manufacturing alternating phase shift mask |
US6927178B2 (en) * | 2002-07-11 | 2005-08-09 | Applied Materials, Inc. | Nitrogen-free dielectric anti-reflective coating and hardmask |
US6832364B2 (en) * | 2002-10-03 | 2004-12-14 | International Business Machines Corporation | Integrated lithographic layout optimization |
US20050048375A1 (en) * | 2003-08-27 | 2005-03-03 | Cheng-Ming Lin | Method of making an attenuated phase-shifting mask from a mask blank |
US7288344B2 (en) * | 2003-10-31 | 2007-10-30 | Intel Corporation | Accommodating diffraction in the printing of features on a substrate |
US6969568B2 (en) * | 2004-01-28 | 2005-11-29 | Freescale Semiconductor, Inc. | Method for etching a quartz layer in a photoresistless semiconductor mask |
US7276316B2 (en) * | 2004-02-02 | 2007-10-02 | International Business Machines Corporation | Common second level frame exposure methods for making embedded attenuated phase shift masks |
US20060051681A1 (en) * | 2004-09-08 | 2006-03-09 | Phototronics, Inc. 15 Secor Road P.O. Box 5226 Brookfield, Conecticut | Method of repairing a photomask having an internal etch stop layer |
US7455883B2 (en) * | 2004-10-19 | 2008-11-25 | Guardian Industries Corp. | Hydrophilic DLC on substrate with flame pyrolysis treatment |
US7459095B2 (en) * | 2004-10-21 | 2008-12-02 | Corning Incorporated | Opaque chrome coating suitable for etching |
TWI375114B (en) * | 2004-10-22 | 2012-10-21 | Shinetsu Chemical Co | Photomask-blank, photomask and fabrication method thereof |
JP5165833B2 (en) * | 2005-02-04 | 2013-03-21 | 信越化学工業株式会社 | Photomask blank, photomask, and photomask blank manufacturing method |
KR100844981B1 (en) | 2006-12-14 | 2008-07-09 | 삼성전자주식회사 | Phase shift mask and method of forming the same |
US20080254233A1 (en) * | 2007-04-10 | 2008-10-16 | Kwangduk Douglas Lee | Plasma-induced charge damage control for plasma enhanced chemical vapor deposition processes |
US20090053620A1 (en) * | 2007-08-24 | 2009-02-26 | Hynix Semiconductor Inc. | Blank Mask and Method for Fabricating Photomask Using the Same |
WO2011046655A2 (en) * | 2009-07-21 | 2011-04-21 | Cornell University | Transfer-free batch fabrication of single layer graphene devices |
US8808788B2 (en) | 2010-09-20 | 2014-08-19 | Tokyo Electron Limited | Processing a wafer with a post application bake (PAB) procedure |
US8465885B2 (en) | 2011-02-07 | 2013-06-18 | International Business Machines Corporation | Boundary layer formation and resultant structures |
US8715890B2 (en) | 2012-01-31 | 2014-05-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor mask blanks with a compatible stop layer |
CN103545211A (en) | 2012-07-13 | 2014-01-29 | 中国科学院微电子研究所 | Production method of semiconductor device |
CN102976264B (en) * | 2012-12-13 | 2015-04-15 | 中国科学院物理研究所 | Method for preparing self-supporting multilayer micro nano structure |
US9159561B2 (en) * | 2013-12-26 | 2015-10-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for overcoming broken line and photoresist scum issues in tri-layer photoresist patterning |
US9612534B2 (en) * | 2015-03-31 | 2017-04-04 | Tokyo Electron Limited | Exposure dose homogenization through rotation, translation, and variable processing conditions |
US10394114B2 (en) * | 2016-08-25 | 2019-08-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chromeless phase shift mask structure and process |
DE102018116054B4 (en) * | 2018-07-03 | 2022-02-17 | Advanced Mask Technology Center Gmbh & Co. Kg | Photomask and method of making a photomask |
US10859905B2 (en) * | 2018-09-18 | 2020-12-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Photomask and method for forming the same |
CN109062002A (en) * | 2018-09-29 | 2018-12-21 | 深圳清溢光电股份有限公司 | Dry etching prepares 6 generation LTPS PSM |
CN110329985B (en) * | 2019-06-18 | 2022-02-15 | 长沙新材料产业研究院有限公司 | Diamond surface complex structure and preparation method thereof |
Family Cites Families (62)
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---|---|---|---|---|
US6007324A (en) | 1977-10-23 | 1999-12-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Double layer method for fabricating a rim type attenuating phase shifting mask |
US4526673A (en) | 1982-09-24 | 1985-07-02 | Spire Corporation | Coating method |
DE3421739A1 (en) | 1984-06-12 | 1985-12-12 | Battelle-Institut E.V., 6000 Frankfurt | METHOD FOR PRODUCING DIAMOND-LIKE CARBON LAYERS |
US4783361A (en) | 1984-09-10 | 1988-11-08 | Ovonic Synthetic Materials Company, Inc. | Coated lenses |
US4777090A (en) | 1986-11-03 | 1988-10-11 | Ovonic Synthetic Materials Company | Coated article and method of manufacturing the article |
US4890309A (en) | 1987-02-25 | 1989-12-26 | Massachusetts Institute Of Technology | Lithography mask with a π-phase shifting attenuator |
US4972250A (en) | 1987-03-02 | 1990-11-20 | Microwave Technology, Inc. | Protective coating useful as passivation layer for semiconductor devices |
US5171607A (en) | 1990-01-29 | 1992-12-15 | Bausch & Lomb Incorporated | Method of depositing diamond-like carbon film onto a substrate having a low melting temperature |
DE69132622T2 (en) | 1990-09-21 | 2002-02-07 | Dainippon Printing Co Ltd | Process for manufacturing a phase shift photomask |
US5455081A (en) | 1990-09-25 | 1995-10-03 | Nippon Steel Corporation | Process for coating diamond-like carbon film and coated thin strip |
US5527596A (en) | 1990-09-27 | 1996-06-18 | Diamonex, Incorporated | Abrasion wear resistant coated substrate product |
US5135808A (en) | 1990-09-27 | 1992-08-04 | Diamonex, Incorporated | Abrasion wear resistant coated substrate product |
US6132908A (en) | 1990-10-26 | 2000-10-17 | Nikon Corporation | Photo mask and exposure method using the same |
US5718976A (en) | 1991-05-03 | 1998-02-17 | Advanced Refractory Technologies, Inc. | Erosion resistant diamond-like nanocomposite coatings for optical components |
US5246801A (en) | 1991-09-20 | 1993-09-21 | At&T Bell Laboratories | Method of repairing indentations in phase-shifting lithographic masks |
JP3064769B2 (en) | 1992-11-21 | 2000-07-12 | アルバック成膜株式会社 | PHASE SHIFT MASK, ITS MANUFACTURING METHOD, AND EXPOSURE METHOD USING THE PHASE SHIFT MASK |
US5470661A (en) | 1993-01-07 | 1995-11-28 | International Business Machines Corporation | Diamond-like carbon films from a hydrocarbon helium plasma |
US5411824A (en) | 1993-01-21 | 1995-05-02 | Sematech, Inc. | Phase shifting mask structure with absorbing/attenuating sidewalls for improved imaging |
AU5681194A (en) | 1993-01-21 | 1994-08-15 | Sematech, Inc. | Phase shifting mask structure with multilayer optical coating for improved transmission |
AU665480B2 (en) | 1993-01-29 | 1996-01-04 | Tokuyama Corporation | Polymerizable composition, polymer, organic glass and ophthalmic lens |
US5567550A (en) | 1993-03-25 | 1996-10-22 | Texas Instruments Incorporated | Method of making a mask for making integrated circuits |
US5532089A (en) | 1993-12-23 | 1996-07-02 | International Business Machines Corporation | Simplified fabrication methods for rim phase-shift masks |
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US5935735A (en) | 1996-10-24 | 1999-08-10 | Toppan Printing Co., Ltd. | Halftone phase shift mask, blank for the same, and methods of manufacturing these |
KR100244285B1 (en) | 1996-11-04 | 2000-02-01 | 김영환 | Phase shifting mask and method for fabrication |
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US6107000A (en) | 1996-12-17 | 2000-08-22 | Board Of Regents - University Of California - San Diego | Method for producing micro-optic elements with gray scale mask |
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US6086962A (en) | 1997-07-25 | 2000-07-11 | Diamonex, Incorporated | Method for deposition of diamond-like carbon and silicon-doped diamond-like carbon coatings from a hall-current ion source |
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US6030904A (en) | 1997-08-21 | 2000-02-29 | International Business Machines Corporation | Stabilization of low-k carbon-based dielectrics |
US6027837A (en) | 1997-10-14 | 2000-02-22 | International Business Machines Corporation | Method for tuning an attenuating phase shift mask |
US5853923A (en) | 1997-10-23 | 1998-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Double layer method for fabricating a rim type attenuating phase shifting mask |
US5932377A (en) | 1998-02-24 | 1999-08-03 | International Business Machines Corporation | Exact transmission balanced alternating phase-shifting mask for photolithography |
US5939227A (en) | 1998-03-09 | 1999-08-17 | Rochester Institute Of Technology | Multi-layered attenuated phase shift mask and a method for making the mask |
US6156394A (en) | 1998-04-17 | 2000-12-05 | Optical Coating Laboratory, Inc. | Polymeric optical substrate method of treatment |
TW352421B (en) | 1998-04-27 | 1999-02-11 | United Microelectronics Corp | Method and process of phase shifting mask |
USH1924H (en) | 1998-09-15 | 2000-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Load-adaptive nanocrystalline carbon/amorphous diamond-like carbon composite and preparation method |
US6348395B1 (en) * | 2000-06-07 | 2002-02-19 | International Business Machines Corporation | Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow |
-
2001
- 2001-03-12 US US09/804,590 patent/US6524755B2/en not_active Expired - Fee Related
- 2001-08-17 WO PCT/US2001/025785 patent/WO2002021218A1/en active Application Filing
- 2001-08-17 AU AU2001285019A patent/AU2001285019A1/en not_active Abandoned
- 2001-09-03 TW TW090121750A patent/TW521318B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW521318B (en) | 2003-02-21 |
US6524755B2 (en) | 2003-02-25 |
US20020028392A1 (en) | 2002-03-07 |
WO2002021218A1 (en) | 2002-03-14 |
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