AU2001282332A1 - System and method for controlling movement of a workpiece in a thermal processing system - Google Patents

System and method for controlling movement of a workpiece in a thermal processing system

Info

Publication number
AU2001282332A1
AU2001282332A1 AU2001282332A AU8233201A AU2001282332A1 AU 2001282332 A1 AU2001282332 A1 AU 2001282332A1 AU 2001282332 A AU2001282332 A AU 2001282332A AU 8233201 A AU8233201 A AU 8233201A AU 2001282332 A1 AU2001282332 A1 AU 2001282332A1
Authority
AU
Australia
Prior art keywords
workpiece
thermal processing
controlling movement
processing system
controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001282332A
Inventor
John Danis
Jeffrey Paul Hebb
Brian Matthews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of AU2001282332A1 publication Critical patent/AU2001282332A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/18—Controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Radiation Pyrometers (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Control Of Temperature (AREA)
  • Chemical Vapour Deposition (AREA)
AU2001282332A 2000-09-27 2001-08-24 System and method for controlling movement of a workpiece in a thermal processing system Abandoned AU2001282332A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09670712 2000-09-27
US09/670,712 US6610968B1 (en) 2000-09-27 2000-09-27 System and method for controlling movement of a workpiece in a thermal processing system
PCT/GB2001/003806 WO2002027059A2 (en) 2000-09-27 2001-08-24 System and method for controlling movement of a workpiece in a thermal processing system

Publications (1)

Publication Number Publication Date
AU2001282332A1 true AU2001282332A1 (en) 2002-04-08

Family

ID=24691545

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001282332A Abandoned AU2001282332A1 (en) 2000-09-27 2001-08-24 System and method for controlling movement of a workpiece in a thermal processing system

Country Status (8)

Country Link
US (1) US6610968B1 (en)
EP (1) EP1322901A2 (en)
JP (1) JP2004510338A (en)
KR (1) KR100914791B1 (en)
CN (1) CN100467988C (en)
AU (1) AU2001282332A1 (en)
TW (1) TW501172B (en)
WO (1) WO2002027059A2 (en)

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JP4226855B2 (en) * 2002-07-31 2009-02-18 パナソニック株式会社 Thermal analysis method, thermal analysis apparatus, and program for executing the thermal analysis method
US9627244B2 (en) 2002-12-20 2017-04-18 Mattson Technology, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece
US7619184B2 (en) * 2003-03-04 2009-11-17 Micron Technology, Inc. Multi-parameter process and control method
DE10328660B3 (en) * 2003-06-26 2004-12-02 Infineon Technologies Ag Determining temperature of semiconductor wafer at instant of contact with sensor, records varying sensor output over time, to deduce initial wafer temperature
US7026581B2 (en) * 2003-08-22 2006-04-11 Axcelis Technologies, Inc. Apparatus for positioning an elevator tube
US6855916B1 (en) 2003-12-10 2005-02-15 Axcelis Technologies, Inc. Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling
JP4403945B2 (en) * 2003-12-19 2010-01-27 株式会社デンソー Inspection method, inspection apparatus and inspection program for control program
US7205231B2 (en) * 2004-10-29 2007-04-17 Axcelis Technologies, Inc. Method for in-situ uniformity optimization in a rapid thermal processing system
US7493242B1 (en) * 2004-11-10 2009-02-17 The United States Of America As Represented By The Secretary Of The Navy Mathematical model for predicting the thermal behavior of an item
WO2006098443A1 (en) * 2005-03-17 2006-09-21 Hamamatsu Photonics K.K. Microscopic image capturing device
US7402778B2 (en) * 2005-04-29 2008-07-22 Asm Assembly Automation Ltd. Oven for controlled heating of compounds at varying temperatures
US7802917B2 (en) * 2005-08-05 2010-09-28 Lam Research Corporation Method and apparatus for chuck thermal calibration
DE602005015220D1 (en) * 2005-09-16 2009-08-13 Mettler Toledo Ag Method for simulating a process on a laboratory scale
US7184657B1 (en) 2005-09-17 2007-02-27 Mattson Technology, Inc. Enhanced rapid thermal processing apparatus and method
US7473032B2 (en) * 2006-06-30 2009-01-06 Honeywell International Inc. System and method for enabling temperature measurement using a pyrometer and pyrometer target for use with same
JP5967859B2 (en) 2006-11-15 2016-08-10 マトソン テクノロジー、インコーポレイテッド System and method for supporting a workpiece during heat treatment
US8388223B2 (en) * 2007-08-09 2013-03-05 The Edward Orton Jr. Ceramic Foundation Furnace temperature monitoring device and method
US9070590B2 (en) 2008-05-16 2015-06-30 Mattson Technology, Inc. Workpiece breakage prevention method and apparatus
EP2498276A4 (en) * 2009-11-02 2013-07-24 Lig Adp Co Ltd Temperature control method of chemical vapor deposition device
KR101551498B1 (en) 2009-12-03 2015-09-09 (주) 유로비젼레이저 Apparatus for heat treating metal surface with laser in vacuum chamber
DE102010016477A1 (en) * 2010-04-16 2011-10-20 Aixtron Ag A thermal treatment method comprising a heating step, a treatment step and a cooling step
JP6091932B2 (en) * 2012-03-22 2017-03-08 株式会社ニューフレアテクノロジー Silicon carbide film forming apparatus and silicon carbide film forming method
CN103697712A (en) * 2012-09-27 2014-04-02 上海梅山钢铁股份有限公司 Method for dynamically controlling furnace temperature of heating furnace based on time sensitivity
TWI506702B (en) 2014-07-28 2015-11-01 Powerchip Technology Corp Dispatch control method for furnace process
US10401823B2 (en) * 2016-02-04 2019-09-03 Makino Inc. Real time machining process monitoring utilizing preprocess simulation
CN107940997A (en) * 2016-10-12 2018-04-20 石嘴山市鸿裕电子科技有限公司 The fixed point placement of car type furnace workpiece uniformly ranks Coordination module
US10310013B2 (en) 2016-12-12 2019-06-04 Samsung Electronics Co., Ltd. Test mode isolation and power reduction in embedded core-based digital systems of integrated circuits (ICs) with multiple power domains
CN108089609A (en) * 2017-12-14 2018-05-29 洛阳用功感应加热设备有限公司 A kind of induction heating power dynamic tracking linear velocity temprature control method
CN110863102B (en) * 2019-10-29 2022-02-22 首钢京唐钢铁联合有限责任公司 Method and device for correcting thermocouple value of heating section of annealing furnace

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Also Published As

Publication number Publication date
US6610968B1 (en) 2003-08-26
WO2002027059A3 (en) 2002-06-06
KR100914791B1 (en) 2009-09-02
EP1322901A2 (en) 2003-07-02
CN100467988C (en) 2009-03-11
WO2002027059A2 (en) 2002-04-04
CN1466670A (en) 2004-01-07
JP2004510338A (en) 2004-04-02
KR20030040511A (en) 2003-05-22
TW501172B (en) 2002-09-01

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