AU2001279277A1 - Wafer carrier with groove for decoupling retainer ring from wafer - Google Patents

Wafer carrier with groove for decoupling retainer ring from wafer

Info

Publication number
AU2001279277A1
AU2001279277A1 AU2001279277A AU7927701A AU2001279277A1 AU 2001279277 A1 AU2001279277 A1 AU 2001279277A1 AU 2001279277 A AU2001279277 A AU 2001279277A AU 7927701 A AU7927701 A AU 7927701A AU 2001279277 A1 AU2001279277 A1 AU 2001279277A1
Authority
AU
Australia
Prior art keywords
wafer
retainer ring
vacuum chuck
polishing pad
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279277A
Inventor
Yehiel Gotkis
Aleksander A. Owczerz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001279277A1 publication Critical patent/AU2001279277A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Abstract

The present invention provides a wafer carrier for use with a chemical mechanical planarization apparatus. The wafer carrier includes a vacuum chuck and a retainer ring. The vacuum chuck is configured to hold and rotate a wafer for planarizing a surface topography of the wafer on a polishing pad. The vacuum chuck includes an inner region for holding the wafer and an outer region and further has a groove adapted to decouple the inner region and the outer region. The inner and outer regions of the vacuum chuck are arranged to move independently in a direction orthogonal to a polishing surface of the polishing pad. The retainer ring is disposed on the outer region of the vacuum chuck and is configured to retain the wafer during CMP processing. In this configuration, the decoupled retainer ring and the wafer are arranged to move independently to align to the polishing surface of the polishing pad during CMP processing.
AU2001279277A 2000-06-30 2001-06-29 Wafer carrier with groove for decoupling retainer ring from wafer Abandoned AU2001279277A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/608,510 US6386962B1 (en) 2000-06-30 2000-06-30 Wafer carrier with groove for decoupling retainer ring from water
US09608510 2000-06-30
PCT/US2001/041204 WO2002002275A1 (en) 2000-06-30 2001-06-29 Wafer carrier with groove for decoupling retainer ring from wafer

Publications (1)

Publication Number Publication Date
AU2001279277A1 true AU2001279277A1 (en) 2002-01-14

Family

ID=24436814

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279277A Abandoned AU2001279277A1 (en) 2000-06-30 2001-06-29 Wafer carrier with groove for decoupling retainer ring from wafer

Country Status (9)

Country Link
US (1) US6386962B1 (en)
EP (1) EP1294537B1 (en)
JP (1) JP4817588B2 (en)
KR (1) KR100778917B1 (en)
CN (1) CN1258433C (en)
AT (1) ATE291989T1 (en)
AU (1) AU2001279277A1 (en)
DE (1) DE60109774T2 (en)
WO (1) WO2002002275A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7160105B2 (en) * 2001-06-01 2007-01-09 Litrex Corporation Temperature controlled vacuum chuck
US20040099375A1 (en) * 2002-11-21 2004-05-27 Yanghua He Edge-contact ring for a wafer pedestal
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US11260500B2 (en) * 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
EP1694464B1 (en) 2003-11-13 2010-05-26 Applied Materials, Inc. Retaining ring with shaped surface
US20050113002A1 (en) * 2003-11-24 2005-05-26 Feng Chen CMP polishing heads retaining ring groove design for microscratch reduction
US7520798B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US20090023362A1 (en) * 2007-07-17 2009-01-22 Tzu-Shin Chen Retaining ring for chemical mechanical polishing, its operational method and application system
CN102337262B (en) * 2010-07-22 2013-03-06 上海市免疫学研究所 SiRNA for specific in vitro interference of expression of LAT protein in human T cell and application thereof
TWI492818B (en) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd Polishing pad, polishing method and polishing system
JP6032643B2 (en) * 2012-12-03 2016-11-30 株式会社岡本工作機械製作所 Backing material and substrate carrier head structure using the same
CN103659580A (en) * 2013-12-03 2014-03-26 常州深倍超硬材料有限公司 Clad sheet plane lapping tool
KR102648711B1 (en) * 2018-09-20 2024-03-20 삼성전자주식회사 substrate bonding apparatus and substrate bonding method using the same
KR102325059B1 (en) * 2018-12-26 2021-11-11 세메스 주식회사 Apparatus for treating a substrate and method for threating a substrate
US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same
CN115008342B (en) * 2022-06-15 2023-08-25 安徽禾臣新材料有限公司 Corner collapse preventing wax-free pad for wafer polishing and production process thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2933488B2 (en) * 1994-08-10 1999-08-16 日本電気株式会社 Polishing method and polishing apparatus
US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
JP3072962B2 (en) 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 Workpiece holder for polishing and method of manufacturing the same
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
JPH10230455A (en) * 1997-02-17 1998-09-02 Nec Corp Polishing device
JP3807807B2 (en) 1997-02-27 2006-08-09 株式会社荏原製作所 Polishing device
JPH11333712A (en) * 1998-05-21 1999-12-07 Nikon Corp Polishing head and polishing device using it
US6102779A (en) 1998-06-17 2000-08-15 Speedfam-Ipec, Inc. Method and apparatus for improved semiconductor wafer polishing

Also Published As

Publication number Publication date
EP1294537B1 (en) 2005-03-30
DE60109774D1 (en) 2005-05-04
KR20030031917A (en) 2003-04-23
JP2004503921A (en) 2004-02-05
DE60109774T2 (en) 2006-02-23
JP4817588B2 (en) 2011-11-16
WO2002002275A1 (en) 2002-01-10
KR100778917B1 (en) 2007-11-22
US6386962B1 (en) 2002-05-14
CN1258433C (en) 2006-06-07
ATE291989T1 (en) 2005-04-15
CN1489507A (en) 2004-04-14
EP1294537A1 (en) 2003-03-26

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