AU2001278027A1 - Method and system for bonding a semiconductor chip onto a carrier using micro-pins - Google Patents

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Info

Publication number
AU2001278027A1
AU2001278027A1 AU2001278027A AU7802701A AU2001278027A1 AU 2001278027 A1 AU2001278027 A1 AU 2001278027A1 AU 2001278027 A AU2001278027 A AU 2001278027A AU 7802701 A AU7802701 A AU 7802701A AU 2001278027 A1 AU2001278027 A1 AU 2001278027A1
Authority
AU
Australia
Prior art keywords
pins
micro
bonding
carrier
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001278027A
Inventor
Michael Gurvitch
Sangmin Lee
Serge Luryi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Research Foundation of State University of New York
Original Assignee
Research Foundation of State University of New York
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Foundation of State University of New York filed Critical Research Foundation of State University of New York
Publication of AU2001278027A1 publication Critical patent/AU2001278027A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
AU2001278027A 2000-07-26 2001-07-26 Method and system for bonding a semiconductor chip onto a carrier using micro-pins Abandoned AU2001278027A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22070900P 2000-07-26 2000-07-26
US60220709 2000-07-26
PCT/US2001/023572 WO2002009194A1 (en) 2000-07-26 2001-07-26 Method and system for bonding a semiconductor chip onto a carrier using micro-pins

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DE10343256B4 (en) 2003-09-17 2006-08-10 Infineon Technologies Ag Arrangement for establishing an electrical connection between a BGA package and a signal source, and method for producing such a connection
DE10343257B4 (en) * 2003-09-17 2009-06-10 Qimonda Ag Process for the production of interconnects in chip sandwich assemblies
DE10343255B4 (en) * 2003-09-17 2006-10-12 Infineon Technologies Ag Method for establishing electrical connections between a semiconductor chip in a BGA package and a printed circuit board
JP2005135772A (en) * 2003-10-30 2005-05-26 Nitto Denko Corp Manufacturing method of anisotropic conductive film
US8916966B2 (en) * 2004-09-28 2014-12-23 Triquint Semiconductor, Inc. Integrated circuit including a heat dissipation structure
TWI255466B (en) * 2004-10-08 2006-05-21 Ind Tech Res Inst Polymer-matrix conductive film and method for fabricating the same
JP4613077B2 (en) 2005-02-28 2011-01-12 株式会社オクテック Semiconductor device, electrode member, and method for manufacturing electrode member
KR100886712B1 (en) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 Semiconductor package and method of manufacturing the same
JP5752741B2 (en) * 2012-09-26 2015-07-22 富士フイルム株式会社 Multilayer substrate and semiconductor package
JP5619232B2 (en) * 2013-07-25 2014-11-05 株式会社オクテック Semiconductor device and method for manufacturing electrode member
CN104486902B (en) * 2014-11-27 2018-01-16 深圳市华星光电技术有限公司 Bending type printed circuit board (PCB)
US10319830B2 (en) * 2017-01-24 2019-06-11 Qualcomm Incorporated Heterojunction bipolar transistor power amplifier with backside thermal heatsink

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JP2586066B2 (en) * 1987-11-13 1997-02-26 日本電気株式会社 Solder supply film and soldering method
US5468681A (en) * 1989-08-28 1995-11-21 Lsi Logic Corporation Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
JPH03218030A (en) * 1990-01-23 1991-09-25 Hitachi Ltd Semiconductor integrated circuit device and preform bonding material used in the same
US5819406A (en) * 1990-08-29 1998-10-13 Canon Kabushiki Kaisha Method for forming an electrical circuit member
JPH07221105A (en) * 1994-01-31 1995-08-18 Fujitsu Ltd Semiconductor device and manufacture thereof
US5509815A (en) 1994-06-08 1996-04-23 At&T Corp. Solder medium for circuit interconnection
US5971253A (en) 1995-07-31 1999-10-26 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
US5786635A (en) * 1996-12-16 1998-07-28 International Business Machines Corporation Electronic package with compressible heatsink structure
US6206272B1 (en) * 1999-04-08 2001-03-27 Intel Corporation Alignment weight for floating field pin design

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WO2002009194A1 (en) 2002-01-31
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US20040038496A1 (en) 2004-02-26
US20060186541A1 (en) 2006-08-24

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