AU2001273665A1 - Projected gimbal point drive - Google Patents
Projected gimbal point driveInfo
- Publication number
- AU2001273665A1 AU2001273665A1 AU2001273665A AU7366501A AU2001273665A1 AU 2001273665 A1 AU2001273665 A1 AU 2001273665A1 AU 2001273665 A AU2001273665 A AU 2001273665A AU 7366501 A AU7366501 A AU 7366501A AU 2001273665 A1 AU2001273665 A1 AU 2001273665A1
- Authority
- AU
- Australia
- Prior art keywords
- spindle
- gimbal point
- wafer carrier
- projected
- point drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
- Lubrication Of Internal Combustion Engines (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Switches With Compound Operations (AREA)
Abstract
A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle. The wafer carrier has a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle. In addition, a drive cup is included that is disposed between the spindle and the wafer carrier. The drive cup has a concave inner surface and a convex outer surface, and allows the wafer carrier to be tilted about a predefined gimbal point. In this manner, torque can be applied without affecting the gimbal action.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21566600P | 2000-07-01 | 2000-07-01 | |
US60/215,666 | 2000-07-01 | ||
PCT/US2001/041232 WO2002002276A2 (en) | 2000-07-01 | 2001-06-29 | Projected gimbal point drive |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001273665A1 true AU2001273665A1 (en) | 2002-01-14 |
Family
ID=22803881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001273665A Abandoned AU2001273665A1 (en) | 2000-07-01 | 2001-06-29 | Projected gimbal point drive |
Country Status (10)
Country | Link |
---|---|
US (1) | US6808443B2 (en) |
EP (1) | EP1365888B1 (en) |
JP (1) | JP2004502311A (en) |
KR (1) | KR20030016307A (en) |
CN (1) | CN1258432C (en) |
AT (1) | ATE355934T1 (en) |
AU (1) | AU2001273665A1 (en) |
DE (1) | DE60127181T2 (en) |
TW (1) | TW491746B (en) |
WO (1) | WO2002002276A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4700996B2 (en) * | 2005-04-19 | 2011-06-15 | 東芝機械株式会社 | Transfer device |
US7648354B2 (en) * | 2005-04-28 | 2010-01-19 | Toshiba Kikai Kabushiki Kaisha | Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus |
JP4729338B2 (en) * | 2005-05-10 | 2011-07-20 | 東芝機械株式会社 | Transfer device |
JP4701008B2 (en) * | 2005-05-25 | 2011-06-15 | 東芝機械株式会社 | Transfer device with gimbal mechanism |
KR101039255B1 (en) * | 2009-07-07 | 2011-06-07 | (주)아산테크 | Large caliber pipiline management system |
US8545290B2 (en) * | 2010-12-08 | 2013-10-01 | Edmond Arzuman Abrahamians | Wafer polishing apparatus and method |
CN103363243B (en) * | 2013-08-07 | 2015-07-22 | 重庆望江工业有限公司 | Device for dressing candlestick inner pipe |
CN115401568B (en) * | 2022-09-22 | 2023-10-20 | 安庆帝新机电设备有限公司 | Automatic discharging device for floating seal ring polishing |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2526105A (en) * | 1947-01-13 | 1950-10-17 | James B Adams | Universal joint for hand tools |
US3107505A (en) * | 1961-02-15 | 1963-10-22 | Hague Mfg Company | Universal joint |
EP0119989A1 (en) * | 1983-03-18 | 1984-09-26 | Karl Hufnagl | Torque-transmitting universal joint |
US4636180A (en) * | 1984-08-23 | 1987-01-13 | Allied Corporation | Universal joint with stationary seats |
US5342067A (en) * | 1993-08-09 | 1994-08-30 | Corning Incorporated | Method and apparatus for machining substrate plates for magnetic memory disks |
US5423558A (en) * | 1994-03-24 | 1995-06-13 | Ipec/Westech Systems, Inc. | Semiconductor wafer carrier and method |
US5571044A (en) * | 1994-10-11 | 1996-11-05 | Ontrak Systems, Inc. | Wafer holder for semiconductor wafer polishing machine |
US5830806A (en) * | 1996-10-18 | 1998-11-03 | Micron Technology, Inc. | Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
US6425812B1 (en) * | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
EP1092504B1 (en) * | 1999-10-15 | 2005-12-07 | Ebara Corporation | Apparatus and method for polishing workpiece |
-
2001
- 2001-06-07 US US09/877,459 patent/US6808443B2/en not_active Expired - Fee Related
- 2001-06-29 DE DE60127181T patent/DE60127181T2/en not_active Expired - Fee Related
- 2001-06-29 CN CNB018121942A patent/CN1258432C/en not_active Expired - Fee Related
- 2001-06-29 EP EP01952962A patent/EP1365888B1/en not_active Expired - Lifetime
- 2001-06-29 JP JP2002506892A patent/JP2004502311A/en active Pending
- 2001-06-29 WO PCT/US2001/041232 patent/WO2002002276A2/en active IP Right Grant
- 2001-06-29 AU AU2001273665A patent/AU2001273665A1/en not_active Abandoned
- 2001-06-29 AT AT01952962T patent/ATE355934T1/en not_active IP Right Cessation
- 2001-06-29 KR KR1020027017732A patent/KR20030016307A/en active IP Right Grant
- 2001-07-02 TW TW090116238A patent/TW491746B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2002002276A3 (en) | 2003-09-25 |
CN1533316A (en) | 2004-09-29 |
EP1365888A2 (en) | 2003-12-03 |
KR20030016307A (en) | 2003-02-26 |
CN1258432C (en) | 2006-06-07 |
WO2002002276A2 (en) | 2002-01-10 |
US20020002031A1 (en) | 2002-01-03 |
DE60127181T2 (en) | 2007-11-15 |
US6808443B2 (en) | 2004-10-26 |
EP1365888B1 (en) | 2007-03-07 |
DE60127181D1 (en) | 2007-04-19 |
JP2004502311A (en) | 2004-01-22 |
TW491746B (en) | 2002-06-21 |
ATE355934T1 (en) | 2007-03-15 |
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