AU2001269840A1 - Encapsulation using microcellular foamed materials - Google Patents

Encapsulation using microcellular foamed materials

Info

Publication number
AU2001269840A1
AU2001269840A1 AU2001269840A AU6984001A AU2001269840A1 AU 2001269840 A1 AU2001269840 A1 AU 2001269840A1 AU 2001269840 A AU2001269840 A AU 2001269840A AU 6984001 A AU6984001 A AU 6984001A AU 2001269840 A1 AU2001269840 A1 AU 2001269840A1
Authority
AU
Australia
Prior art keywords
encapsulation
foamed materials
microcellular foamed
microcellular
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001269840A
Other languages
English (en)
Inventor
Thomas D. Boyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of AU2001269840A1 publication Critical patent/AU2001269840A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/02—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles
    • B29C44/12—Incorporating or moulding on preformed parts, e.g. inserts or reinforcements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/02—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles for articles of definite length, i.e. discrete articles
    • B29C44/12—Incorporating or moulding on preformed parts, e.g. inserts or reinforcements
    • B29C44/1266—Incorporating or moulding on preformed parts, e.g. inserts or reinforcements the preformed part being completely encapsulated, e.g. for packaging purposes or as reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/34—Auxiliary operations
    • B29C44/3469—Cell or pore nucleation
    • B29C44/348—Cell or pore nucleation by regulating the temperature and/or the pressure, e.g. suppression of foaming until the pressure is rapidly decreased
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Wrappers (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AU2001269840A 2000-06-14 2001-06-14 Encapsulation using microcellular foamed materials Abandoned AU2001269840A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21140400P 2000-06-14 2000-06-14
US60211404 2000-06-14
PCT/US2001/019190 WO2001097584A2 (en) 2000-06-14 2001-06-14 Encapsulation using microcellular foamed materials

Publications (1)

Publication Number Publication Date
AU2001269840A1 true AU2001269840A1 (en) 2001-12-24

Family

ID=22786785

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001269840A Abandoned AU2001269840A1 (en) 2000-06-14 2001-06-14 Encapsulation using microcellular foamed materials

Country Status (9)

Country Link
US (2) US20020009584A1 (ko)
EP (1) EP1289728B1 (ko)
JP (1) JP2004503414A (ko)
KR (1) KR20030019424A (ko)
CN (1) CN1217775C (ko)
AU (1) AU2001269840A1 (ko)
CA (1) CA2408317A1 (ko)
DE (1) DE60126082D1 (ko)
WO (1) WO2001097584A2 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030077346A1 (en) * 2000-06-14 2003-04-24 Boyer Thomas D. Encapsulation using microcellular foamed materials
US6803144B2 (en) * 2001-11-01 2004-10-12 Nokia Corporation Battery pack for electronic device
US7318713B2 (en) * 2002-07-18 2008-01-15 Trexel, Inc. Polymer processing systems including screws
GB0221150D0 (en) * 2002-09-12 2002-10-23 Matthews Siobhan O Incorporation of functional materials into bulk materials
DE102006012072A1 (de) * 2006-03-16 2007-09-20 Olho-Technik Oleff & Holtmann Ohg Verfahren zur Herstellung eines ummantelten, einbaufähigen elektrischen Funktionsteiles sowie elektrisches Funktionsteil
US9623591B2 (en) * 2013-01-15 2017-04-18 Basf Se Method of encapsulating an electronic component
JP6085580B2 (ja) * 2014-04-04 2017-02-22 ダイヤモンド電機株式会社 内燃機関用点火コイルの製造方法
US9508610B2 (en) * 2014-09-27 2016-11-29 Intel Corporation Inline measurement of molding material thickness using terahertz reflectance
CN106985327A (zh) * 2017-06-02 2017-07-28 段辉 超临界微发泡高光塑料及塑料基复合材料的制备方法及其塑料或塑料基复合材料
CN110421773B (zh) * 2017-09-01 2021-04-23 顺德职业技术学院 一种热电半导体充注模具的发泡工艺
JP2022500289A (ja) * 2018-09-17 2022-01-04 トレクセル・インコーポレイテッドTrexel, Inc. ポリマー・フォーム処理のシステム及び方法
US20200189155A1 (en) * 2020-02-20 2020-06-18 Zhenhuan LUO Process of foaming in a mold

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56156616A (en) * 1980-04-15 1981-12-03 Furukawa Electric Co Ltd Method of manufacturing dam for communication cable
US4473665A (en) * 1982-07-30 1984-09-25 Massachusetts Institute Of Technology Microcellular closed cell foams and their method of manufacture
US4806083A (en) * 1986-10-21 1989-02-21 The Marley-Wylain Company Submersible pump with expanded foam housing
US5160674A (en) * 1987-07-29 1992-11-03 Massachusetts Institute Of Technology Microcellular foams of semi-crystaline polymeric materials
US5158986A (en) * 1991-04-05 1992-10-27 Massachusetts Institute Of Technology Microcellular thermoplastic foamed with supercritical fluid
US5866053A (en) * 1993-11-04 1999-02-02 Massachusetts Institute Of Technology Method for providing continuous processing of microcellular and supermicrocellular foamed materials
US6005013A (en) * 1995-08-14 1999-12-21 Massachusetts Institute Of Technology Gear throttle as a nucleation device in a continuous microcellular extrusion system
ATE295254T1 (de) * 1996-08-27 2005-05-15 Trexel Inc Verfahren zum extrudieren von mikrozellenpolymeren
US5766637A (en) * 1996-10-08 1998-06-16 University Of Delaware Microencapsulation process using supercritical fluids

Also Published As

Publication number Publication date
US20020009584A1 (en) 2002-01-24
KR20030019424A (ko) 2003-03-06
JP2004503414A (ja) 2004-02-05
US20040170819A1 (en) 2004-09-02
CA2408317A1 (en) 2001-12-20
DE60126082D1 (de) 2007-03-08
CN1436117A (zh) 2003-08-13
EP1289728B1 (en) 2007-01-17
WO2001097584A3 (en) 2002-04-18
EP1289728A2 (en) 2003-03-12
CN1217775C (zh) 2005-09-07
WO2001097584A2 (en) 2001-12-20

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