AU2001268740A1 - Carrier head with reduced moment wear ring - Google Patents
Carrier head with reduced moment wear ringInfo
- Publication number
- AU2001268740A1 AU2001268740A1 AU2001268740A AU6874001A AU2001268740A1 AU 2001268740 A1 AU2001268740 A1 AU 2001268740A1 AU 2001268740 A AU2001268740 A AU 2001268740A AU 6874001 A AU6874001 A AU 6874001A AU 2001268740 A1 AU2001268740 A1 AU 2001268740A1
- Authority
- AU
- Australia
- Prior art keywords
- carrier head
- wear ring
- reduced moment
- moment wear
- reduced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21490500P | 2000-06-29 | 2000-06-29 | |
US60/214,905 | 2000-06-29 | ||
US09/716,784 US6540592B1 (en) | 2000-06-29 | 2000-11-20 | Carrier head with reduced moment wear ring |
US09/716,784 | 2000-11-20 | ||
PCT/US2001/020530 WO2002002273A2 (en) | 2000-06-29 | 2001-06-27 | Carrier head with reduced moment wear ring |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001268740A1 true AU2001268740A1 (en) | 2002-01-14 |
Family
ID=26909482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001268740A Abandoned AU2001268740A1 (en) | 2000-06-29 | 2001-06-27 | Carrier head with reduced moment wear ring |
Country Status (4)
Country | Link |
---|---|
US (1) | US6540592B1 (en) |
AU (1) | AU2001268740A1 (en) |
TW (1) | TW491745B (en) |
WO (1) | WO2002002273A2 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6220930B1 (en) * | 1998-11-03 | 2001-04-24 | United Microelectronics Corp. | Wafer polishing head |
US6796887B2 (en) * | 2002-11-13 | 2004-09-28 | Speedfam-Ipec Corporation | Wear ring assembly |
US7156946B2 (en) * | 2003-04-28 | 2007-01-02 | Strasbaugh | Wafer carrier pivot mechanism |
US6869348B1 (en) * | 2003-10-07 | 2005-03-22 | Strasbaugh | Retaining ring for wafer carriers |
US20050181711A1 (en) * | 2004-02-12 | 2005-08-18 | Alexander Starikov | Substrate confinement apparatus and method |
US7063604B2 (en) * | 2004-03-05 | 2006-06-20 | Strasbaugh | Independent edge control for CMP carriers |
US7033257B2 (en) * | 2004-07-21 | 2006-04-25 | Agere Systems, Inc. | Carrier head for chemical mechanical polishing |
TWI234804B (en) * | 2004-08-03 | 2005-06-21 | Chunghwa Picture Tubes Ltd | Chip compressing mechanism and chip compressing process |
EP1807865B1 (en) * | 2004-11-01 | 2012-04-11 | Ebara Corporation | Polishing apparatus |
JP5199691B2 (en) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | Polishing equipment |
US9520314B2 (en) * | 2008-12-19 | 2016-12-13 | Applied Materials, Inc. | High temperature electrostatic chuck bonding adhesive |
US8998676B2 (en) | 2012-10-26 | 2015-04-07 | Applied Materials, Inc. | Retaining ring with selected stiffness and thickness |
TWI656944B (en) * | 2014-05-14 | 2019-04-21 | 日商荏原製作所股份有限公司 | Polishing apparatus |
US10570257B2 (en) | 2015-11-16 | 2020-02-25 | Applied Materials, Inc. | Copolymerized high temperature bonding component |
JP7250311B2 (en) * | 2016-04-01 | 2023-04-03 | モ カン,ジューン | Carrier head for chemical-mechanical polishing apparatus with substrate receiving member |
JP6966896B2 (en) * | 2017-08-21 | 2021-11-17 | 信越ポリマー株式会社 | Sliding member |
CN111251177B (en) * | 2020-03-10 | 2021-11-16 | 北京烁科精微电子装备有限公司 | Bearing head and polishing device with same |
US20230063687A1 (en) * | 2021-08-27 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company Limited | Apparatus for polishing a wafer |
CN113910184A (en) * | 2021-09-29 | 2022-01-11 | 佛山市永发洁具有限公司 | Workbench structure for manual assembly production |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0569310A (en) | 1991-04-23 | 1993-03-23 | Mitsubishi Materials Corp | Device for grinding mirror surface of wafer |
US5205082A (en) | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
US5584746A (en) | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
US5624299A (en) | 1993-12-27 | 1997-04-29 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved carrier and method of use |
US5571044A (en) | 1994-10-11 | 1996-11-05 | Ontrak Systems, Inc. | Wafer holder for semiconductor wafer polishing machine |
JP3158934B2 (en) | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | Wafer polishing equipment |
US5681215A (en) | 1995-10-27 | 1997-10-28 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
JP3129172B2 (en) * | 1995-11-14 | 2001-01-29 | 日本電気株式会社 | Polishing apparatus and polishing method |
EP0786310B1 (en) | 1996-01-24 | 2002-12-04 | Lam Research Corporation | Wafer polishing head |
US6183354B1 (en) | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US5941758A (en) * | 1996-11-13 | 1999-08-24 | Intel Corporation | Method and apparatus for chemical-mechanical polishing |
US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6116990A (en) * | 1997-07-25 | 2000-09-12 | Applied Materials, Inc. | Adjustable low profile gimbal system for chemical mechanical polishing |
US5899798A (en) * | 1997-07-25 | 1999-05-04 | Obsidian Inc. | Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing |
US6080050A (en) * | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
JPH11285966A (en) | 1998-04-02 | 1999-10-19 | Speedfam-Ipec Co Ltd | Carrier and cmp device |
US6251215B1 (en) * | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
-
2000
- 2000-11-20 US US09/716,784 patent/US6540592B1/en not_active Expired - Lifetime
-
2001
- 2001-06-27 AU AU2001268740A patent/AU2001268740A1/en not_active Abandoned
- 2001-06-27 WO PCT/US2001/020530 patent/WO2002002273A2/en active Application Filing
- 2001-06-28 TW TW090115674A patent/TW491745B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2002002273A3 (en) | 2002-09-26 |
WO2002002273A2 (en) | 2002-01-10 |
TW491745B (en) | 2002-06-21 |
US6540592B1 (en) | 2003-04-01 |
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