AU2001262623A1 - A thin film field effect transistor - Google Patents

A thin film field effect transistor

Info

Publication number
AU2001262623A1
AU2001262623A1 AU2001262623A AU6262301A AU2001262623A1 AU 2001262623 A1 AU2001262623 A1 AU 2001262623A1 AU 2001262623 A AU2001262623 A AU 2001262623A AU 6262301 A AU6262301 A AU 6262301A AU 2001262623 A1 AU2001262623 A1 AU 2001262623A1
Authority
AU
Australia
Prior art keywords
thin film
field effect
effect transistor
film field
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001262623A
Inventor
Moshe Einav
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanogate Ltd
Original Assignee
Nanogate Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanogate Ltd filed Critical Nanogate Ltd
Publication of AU2001262623A1 publication Critical patent/AU2001262623A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78642Vertical transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
AU2001262623A 2000-05-25 2001-05-24 A thin film field effect transistor Abandoned AU2001262623A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0012798A GB2362755A (en) 2000-05-25 2000-05-25 Thin film field effect transistor with a conical structure
GB0012798 2000-05-25
PCT/IL2001/000477 WO2001091192A1 (en) 2000-05-25 2001-05-24 A thin film field effect transistor

Publications (1)

Publication Number Publication Date
AU2001262623A1 true AU2001262623A1 (en) 2001-12-03

Family

ID=9892403

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001262623A Abandoned AU2001262623A1 (en) 2000-05-25 2001-05-24 A thin film field effect transistor

Country Status (4)

Country Link
US (1) US6720617B2 (en)
AU (1) AU2001262623A1 (en)
GB (1) GB2362755A (en)
WO (1) WO2001091192A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100485177B1 (en) * 2002-12-05 2005-04-22 동부아남반도체 주식회사 MOS transistor and fabrication method thereof
JP3828511B2 (en) * 2003-06-26 2006-10-04 株式会社東芝 Manufacturing method of semiconductor device
US20080282967A1 (en) * 2004-06-16 2008-11-20 Moshe Einav Crystal Growth Method and Apparatus
US7288821B2 (en) * 2005-04-08 2007-10-30 International Business Machines Corporation Structure and method of three dimensional hybrid orientation technology
US20080210124A1 (en) * 2007-03-01 2008-09-04 Xerox Corporation Core-shell polymer particles
JP5933300B2 (en) * 2011-03-16 2016-06-08 株式会社半導体エネルギー研究所 Semiconductor device
US8847233B2 (en) 2011-05-12 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a trenched insulating layer coated with an oxide semiconductor film
JP2013042117A (en) * 2011-07-15 2013-02-28 Semiconductor Energy Lab Co Ltd Semiconductor device
CN106252352B (en) * 2016-09-30 2019-03-29 中国科学院微电子研究所 Semiconductor arrangement, method for manufacturing the same and electronic device comprising the arrangement
CN112382637A (en) * 2020-11-11 2021-02-19 京东方科技集团股份有限公司 Display back plate, preparation method thereof and display device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4003036A (en) * 1975-10-23 1977-01-11 American Micro-Systems, Inc. Single IGFET memory cell with buried storage element
JPS5537250U (en) * 1978-08-31 1980-03-10
US4272302A (en) * 1979-09-05 1981-06-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of making V-MOS field effect transistors utilizing a two-step anisotropic etching and ion implantation
FR2466101A1 (en) * 1979-09-18 1981-03-27 Thomson Csf PROCESS FOR FORMING POLYCRYSTALLINE SILICON LAYERS LOCATED ON SILICON-COATED SILICA REGIONS AND APPLICATION TO THE MANUFACTURE OF AN AUTOALIGNAL NON-PLANAR MOS TRANSISTOR
US4335450A (en) * 1980-01-30 1982-06-15 International Business Machines Corporation Non-destructive read out field effect transistor memory cell system
FR2513016A1 (en) * 1981-09-14 1983-03-18 Radiotechnique Compelec HIGH VOLTAGE TRANSFORMER V MOS AND METHOD FOR MANUFACTURING THE SAME
JPS58106870A (en) * 1981-12-18 1983-06-25 Nissan Motor Co Ltd Power metal oxide semiconductor field-effect transistor
KR920010963A (en) 1990-11-23 1992-06-27 오가 노리오 SOI type vertical channel FET and manufacturing method thereof
US5229310A (en) 1991-05-03 1993-07-20 Motorola, Inc. Method for making a self-aligned vertical thin-film transistor in a semiconductor device
KR950001159B1 (en) 1991-12-27 1995-02-11 삼성전자 주식회사 Tft and its manufacturing method for memory device
US5283456A (en) 1992-06-17 1994-02-01 International Business Machines Corporation Vertical gate transistor with low temperature epitaxial channel
US5391505A (en) * 1993-11-01 1995-02-21 Lsi Logic Corporation Active device constructed in opening formed in insulation layer and process for making same
US5757038A (en) 1995-11-06 1998-05-26 International Business Machines Corporation Self-aligned dual gate MOSFET with an ultranarrow channel
KR100223886B1 (en) 1995-12-26 1999-10-15 구본준 A semiconductor device and method for producing the same
US5689127A (en) 1996-03-05 1997-11-18 International Business Machines Corporation Vertical double-gate field effect transistor
JPH10290007A (en) 1997-04-14 1998-10-27 Sharp Corp Semiconductor device and its manufacture

Also Published As

Publication number Publication date
GB2362755A (en) 2001-11-28
GB0012798D0 (en) 2000-07-19
US20020000619A1 (en) 2002-01-03
WO2001091192A1 (en) 2001-11-29
US6720617B2 (en) 2004-04-13

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